Abstract: A temperature measuring device includes an ultrasonic sensor attached to a rear surface side of the structural body having the multilayer structure, an acquisition unit configured to, through the ultrasonic sensor, acquire a signal of a reflected wave of an ultrasonic wave incident at the internal side of the structural body, an extraction unit configured to extract, from the signal of the reflected wave, a domain including a reflected wave reflected on a surface on the internal side of the structural body, and an identification unit configured to, based on a signal of the reflected wave in the extracted domain, identify the temperature of the surface on the internal side of the structural body.

Abstract: This seal device comprises: a movable seal ring arranged so as to be deformable in the radial direction, in a state of facing an outer peripheral surface of a rotor of a steam turbine capable of rotating around the axis; a first elastic member provided to each of end surfaces of the movable seal ring in the circumferential direction; and a second elastic member that is provided to an intermediate position in the circumferential direction of the movable seal ring and urges the movable seal ring outward in the radial direction.

Abstract: A fluid film bearing includes a plurality of bearing pads that are arranged in a circumferential direction of a rotating body that rotates about an axis, and that support the rotating body via a fluid film, wherein the bearing pad includes a base layer made of metal, an elastic layer that is layered on the rotating body side of the base layer, and that is made of an elastically deformable elastic material, a sliding layer that is layered on the rotating body side of the elastic layer, and that opposes the rotating body and is made of a bearing material, and a metal plate that is layered between the elastic layer and the sliding layer, and that is more rigid than the elastic layer and the sliding layer.

Abstract: A sealing device is disposed between a stationary body and a rotating body and is configured to suppress flow of a fluid from a high-pressure side to a low-pressure side. The sealing device includes: a sealing member movably supported by the stationary body in an axial direction and a radial direction of the rotating body; a seal fin extending from the sealing member to the rotating body side; a pressure adjustment space provided between the stationary body and a high-pressure-side end surface of the sealing member; and a communication passage having one end communicating with the low-pressure side and the other end communicating with the pressure adjustment space.

Abstract: A fluid film bearing includes a plurality of bearing pads that are arranged in a circumferential direction of a rotating body that rotates about an axis, and that support the rotating body via a fluid film, wherein the bearing pad includes a base layer made of metal, an elastic layer that is layered on the rotating body side of the base layer, and that is made of an elastically deformable elastic material, a sliding layer that is layered on the rotating body side of the elastic layer, and that opposes the rotating body and is made of a bearing material, and a metal plate that is layered between the elastic layer and the sliding layer, and that is more rigid than the elastic layer and the sliding layer.

Abstract: A temperature measuring device includes an ultrasonic sensor attached to a rear surface side of the structural body having the multilayer structure, an acquisition unit configured to, through the ultrasonic sensor, acquire a signal of a reflected wave of an ultrasonic wave incident at the internal side of the structural body, an extraction unit configured to extract, from the signal of the reflected wave, a domain including a reflected wave reflected on a surface on the internal side of the structural body, and an identification unit configured to, based on a signal of the reflected wave in the extracted domain, identify the temperature of the surface on the internal side of the structural body.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: A fan-out wafer-level packaging method and the package produced thereof are provided in the present application.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: A fan-out wafer-level packaging method and the package produced thereof are provided in the present application.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over said semiconductor substrate and coupled with first inductor.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: A circuit device, includes a semiconductor substrate, and a first inductor provided over said semiconductor substrate, and a first interconnect provided over said semiconductor substrate and coupled with first inductor.

Abstract: In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball side is limited. The electronic device includes an interconnect layer (a first interconnect layer) and an interconnect layer (a second interconnect layer). The second interconnect layer is formed on the undersurface of the first interconnect layer. The second interconnect layer is larger in area seen from the top than the first interconnect layer and is extended to the outside from the first interconnect layer.

Abstract: A circuit device includes a semiconductor substrate, a first inductor provided over the semiconductor substrate, and a second inductor provided over the semiconductor substrate and coupled to the first inductor. The first inductor and second inductor are wound in a same direction with each other from respective inner end portions to respective outer end portions thereof.