Abstract: A semiconductor device includes a semiconductor layer of a first conductivity type having a first main surface at one side and a second main surface at another side, a trench gate structure including a gate trench formed in the first main surface of the semiconductor layer, and a gate electrode embedded in the gate trench via a gate insulating layer, a trench source structure including a source trench formed deeper than the gate trench and across an interval from the gate trench in the first main surface of the semiconductor layer, a source electrode embedded in the source trench, and a deep well region of a second conductivity type formed in a region of the semiconductor layer along the source trench, a ratio of a depth of the trench source structure with respect to a depth of the trench gate structure being not less than 1.5 and not more than 4.

Abstract: A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Abstract: The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 4.0% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.

Abstract: A cleaner composition consisting essentially of (A) 90.0-99.9 wt % of an organic solvent and (B) 0.1-10.0 wt % of a C3-C6 alcohol, and containing (C) 20-300 ppm of sodium and/or potassium is effective for cleaning a surface of a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Abstract: A cleaner composition consisting essentially of (A) 92.0 wt % to less than 99.9 wt % of an organic solvent, (B) 0.1 wt % to less than 8.0 wt % of a C3-C6 alcohol, and (C) 0.001-3.0 wt % of a quaternary ammonium salt is effective for removing any silicone adhesive residues on a silicon semiconductor substrate. A satisfactory degree of cleanness is achieved within a short time and at a high efficiency without causing corrosion to the substrate.

Abstract: The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 4.0% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.

Abstract: The invention provides a substrate detergent composition used for cleaning a surface of a substrate, comprising: (A) A quaternary ammonium salt: 0.1 to 2.0% by mass; (B) Water: 0.1 to 0.4% by mass; and (C) An organic solvent: 94.0 to 99.8% by mass. There can be provided a substrate detergent composition used for cleaning a surface of a substrate contaminated with a silicone component whose water contact angle is 100° or more.

Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Abstract: A heat-conductive silicone grease composition is provided comprising (A) a trialkoxysilyl-endcapped organopolysiloxane having a viscosity of 0.1-1,000 Pa·s at 25° C., (B) a specific organopolysiloxane, (C) a heat-conductive filler, and (D) a condensation catalyst. The composition is amenable to coat at the initial, thereafter increases its viscosity with moisture at room temperature rather than curing so that it remains flexible, easy to re-work, and anti-sagging, eliminates a need for cold storage and for hot application, avoids any undesired viscosity buildup, is easy to manufacture, and has good heat transfer.

Abstract: A room temperature-curable organopolysiloxane composition is provided.

Abstract: A room temperature-curable organopolysiloxane composition is provided.

Abstract: A room temperature-curable polyorganosiloxane composition is provided. The composition comprises (A) 100 parts by weight of a polyorganosiloxane represented by the following general formula (1): wherein R is a monovalent hydrocarbon group containing 1 to 5 carbon atoms, R1 is independently a substituted or unsubstituted monovalent hydrocarbon group containing 1 to 10 carbon atoms; n is an integer of at least 10; X is oxygen atom or an alkylene group containing 2 to 5 carbon atoms, and m is independently an integer of 0 or 1; or a mixture of such polyorganosiloxane, (B) 0.1 to 50 parts by weight of a partial hydrolysate of an organosilicon compound having at least 3 hydrolyzable groups bonded to silicon atom in one molecule; (C) 1 to 500 parts by weight of at least one filler, (D) 0.01 to 10 parts by weight of a curing catalyst, and (E) 0.1 to 10 parts by weight of a silane coupling agent.

Abstract: An optical fiber is prepared by applying a liquid electron beam-curable resin composition to a bare optical fiber or a coated optical fiber having a primary or secondary coating on a bare optical fiber, irradiating electron beams to the resin composition on the optical fiber for curing while the optical fiber passes a zone under substantially atmospheric pressure, and providing a magnetic field and optionally an electric field in the zone for thereby improving the efficiency of electron irradiation. The method can comply with the increased drawing speed of the bare optical fiber and does not detract from the transmission properties of the optical fiber.

Abstract: An optical fiber coating material is provided in the form of an electron beam-curable resin composition comprising a polyurethane having at least two ethylenically unsaturated groups, a reactive diluent, and a compound having both nitrogen and sulfur atoms. The optical fiber coating material is sufficiently EB curable to minimize the dependency of gel fraction and Young's modulus on an EB dose and to comply with the high-speed drawing of optical fiber. The coating material is cured with EB under specific conditions to achieve a sufficient degree of cure and uniform properties without adversely affecting the transmission loss of the optical fiber.

Abstract: An optical fiber is prepared by applying a liquid electron beam-curable resin composition to a bare optical fiber or a coated optical fiber having a primary or secondary coating on a bare optical fiber, irradiating electron beams to the resin composition on the optical fiber for curing while the optical fiber passes a zone under substantially atmospheric pressure, and providing a magnetic field and optionally an electric field in the zone for thereby improving the efficiency of electron irradiation. The method can comply with the increased drawing speed of the bare optical fiber and does not detract from the transmission properties of the optical fiber.

Abstract: Methods for curing a coating material, including a primary coating material, a secondary coating material, and a taping material, on an optical fiber. An optical fiber coating material having (A) 100 parts by weight of a polyether polyurethane bearing at least two ethylenically unsaturated groups with a Mn of 800-10,000, and (B) 1-40 parts by weight of a nitrogenous reactive diluent is cured by irradiating thereto electron beams, produced by driving electrons under an accelerating voltage of 50-190 kV, in a dose of 10-100 kGy. The method succeeds in effectively curing the optical fiber coating material into a cured coating having stable properties.

Abstract: An optical fiber coating material comprising (A) 100 parts by weight of a polyether polyurethane bearing at least two ethylenically unsaturated groups with a Mn of 800-10,000, and (B) 1-40 parts by weight of a nitrogenous reactive diluent is cured by irradiating thereto electron beams, produced by driving electrons under an accelerating voltage of 50-190 kV, in a dose of 10-100 kGy. The method succeeds in effectively curing the optical fiber coating material into a cured coating having stable properties.

Abstract: In connection with a unit (3) for irradiating electron beams to a curable coating on a filament (1) for curing the coating, x-ray shielding tubes (6 and 7) are disposed upstream of an inlet (3a) and downstream of an outlet (3b) of the irradiating unit (3), respectively, for shielding secondary x-rays resulting from the electron beam irradiation. Secondary x-rays emanating from electron beams irradiated to the curable coating on the filament can be shielded in a simple way. The invention helps establish a safe working environment without detracting from process efficiency.