Abstract: A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

Abstract: A liquid election head including a silicon substrate and an element for generating energy that is utilized for electing a liquid on the silicon substrate, wherein a protective layer A containing a metal oxide is disposed on a first surface of the silicon substrate, a structure containing an organic resin and constituting part of a liquid flow passage is disposed on the protective layer A, and an intermediate layer A containing a silicon compound is disposed between the protective layer A and the structure.

Abstract: A perforated substrate having a first surface, a second (opposite) surface, a plurality of through holes running through the substrate from the first surface to the second surface and an etching object arranged on the first surface, is processed by forming a coating layer containing a resin material on the etching object, then allowing part of the resin material to drop into each of the through holes so as to close each of the through holes at least partly with the dropped resin material, then patterning the coating layer such that the coating layer is left on each of the through holes as mask while at least part of the coating layer covering the etching object is removed to expose the etching object; and etching the exposed etching object under a condition where each of the through holes is closed at least partly with the resin material.

Abstract: A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

Abstract: A method for forming a film that covers a side wall of a through hole in a substrate having the through hole, the method including, in the following order, the steps of providing a substrate having a through hole that passes therethrough from a first surface to a second surface, which is a surface opposite to the first surface, forming, on the first surface, a lid member that blocks an opening of the through hole open on the first surface, recessing, in a direction away from the first surface, a surface of the lid member that blocks the opening by removing part of the lid member through the opening, and forming a film that covers the side wall of the through hole.

Abstract: A method for manufacturing a perforated substrate includes forming a through-hole extending through a substrate from a first surface to a second surface opposite the first surface; forming a film on the first surface, a sidewall of the through-hole, and the second surface; forming a resist on the first surface; patterning the resist such that the resist closes an opening of the through-hole in the first surface; etching the film on the first surface using the resist as a mask; before the etching step, forming an inspection member on the second surface such that the inspection member closes an opening of the through-hole in the second surface; and determining whether there is a film patterning defect or a flaw that causes a film patterning defect.

Abstract: A liquid ejection head comprises a semiconductor substrate having an energy generating element arranged thereon to generate energy to be utilized to eject liquid and a laminate including a plurality of insulating layers laid sequentially in the depth direction of the semiconductor substrate. Wiring is formed in the laminate and electrically connected to the energy generating element. The wiring includes a via formed in the insulating layers in the thickness direction of the insulating layers. The energy generating element is arranged between the semiconductor substrate and the laminate in the laminating direction of the insulating layers.

Abstract: A liquid discharge head comprising a silicon substrate; an insulating layer A formed on a first surface of the silicon substrate, a protective layer A that includes metal oxide and is formed on the insulating layer A, the structure that is formed on the protective layer A by direct contact with the protective layer A, includes organic resin, and forms a part of a flow path for liquid, and an element that is formed on a second surface of the silicon substrate on a side opposite to the first surface, and is configured to generate energy used for discharging the liquid.

Abstract: A liquid election head including a silicon substrate and an element for generating energy that is utilized for electing a liquid on the silicon substrate, wherein a protective layer A containing a metal oxide is disposed on a first surface of the silicon substrate, a structure containing an organic resin and constituting part of a liquid flow passage is disposed on the protective layer A, and an intermediate layer A containing a silicon compound is disposed between the protective layer A and the structure.

Abstract: A method of forming a through-substrate having a first surface and a second surface opposite to the first surface, the method causing the first surface to communicate with the second surface through the substrate, the method including: a first step that forms a first trench from the first surface side of the substrate using dry etching, the first trench having side surfaces on which protective film is formed; and a second step that forms a second trench from the second surface side using dry etching, the second trench communicating with the first trench having the side surfaces on which the protective film is formed.

Abstract: A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching.

Abstract: A method for manufacturing a liquid discharge head that includes a discharge-port-forming member, which has discharge ports through which a liquid is discharged, and a pressure-chamber-forming member, which includes pressure chambers communicating with the discharge ports and each including a heating resistor formed in a bottom portion thereof and which has a surface joined to the discharge-port-forming member, includes preparing the pressure-chamber-forming member in which wiring layers each including a barrier metal as a base member are formed, forming the pressure chambers, whose depths from the surface are different from each other and which include the heating resistors each formed of one of the barrier metals, by recessing the pressure-chamber-forming member from the surface and removing at least two of the wiring layers, which are formed at different positions in a depth direction from the surface, to expose the corresponding barrier metals, and forming the discharge-port-forming member on the surface.

Abstract: A method of etching a silicon substrate, in which a depressed portion is formed by etching a first surface of the silicon substrate with ions generated in plasma, the method including introducing a rare gas into a reaction system to ionize the rare gas.

Abstract: A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate.

Abstract: A liquid ejection head comprises a semiconductor substrate having an energy generating element arranged thereon to generate energy to be utilized to eject liquid and a laminate including a plurality of insulating layers laid sequentially in the depth direction of the semiconductor substrate. Wiring is formed in the laminate and electrically connected to the energy generating element. The wiring includes a via formed in the insulating layers in the thickness direction of the insulating layers. The energy generating element is arranged between the semiconductor substrate and the laminate in the laminating direction of the insulating layers.

Abstract: A liquid-discharging head includes a substrate; a flow passage wall-forming layer bonded to the substrate so as to form a flow passage for liquid between the substrate and the flow passage wall-forming layer, the flow passage communicating with a discharge port configured to discharge the liquid; an element configured to generate energy used for discharging the liquid from the discharge port and provided on the flow passage wall-forming layer; a metal layer provided with the discharge port so as to correspond to the element; and a projecting portion made of a metal and extending from the metal layer through the flow passage wall-forming layer and projecting in the direction of the substrate.

Abstract: A method for manufacturing a liquid discharge head that includes a discharge-port-forming member, which has discharge ports through which a liquid is discharged, and a pressure-chamber-forming member, which includes pressure chambers communicating with the discharge ports and each including a heating resistor formed in a bottom portion thereof and which has a surface joined to the discharge-port-forming member, includes preparing the pressure-chamber-forming member in which wiring layers each including a barrier metal as a base member are formed, forming the pressure chambers, whose depths from the surface are different from each other and which include the heating resistors each formed of one of the barrier metals, by recessing the pressure-chamber-forming member from the surface and removing at least two of the wiring layers, which are formed at different positions in a depth direction from the surface, to expose the corresponding barrier metals, and forming the discharge-port-forming member on the surface.

Abstract: A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes.

Abstract: A method of forming a through-substrate having a first surface and a second surface opposite to the first surface, the method causing the first surface to communicate with the second surface through the substrate, the method including: a first step that forms a first trench from the first surface side of the substrate using dry etching, the first trench having side surfaces on which protective film is formed; and a second step that forms a second trench from the second surface side using dry etching, the second trench communicating with the first trench having the side surfaces on which the protective film is formed.

Abstract: Provided is a method of manufacturing a liquid ejection head including: a substrate having energy generating elements disposed thereon; and an ejection orifice forming member having ejection orifices, the substrate and the ejection orifice forming member forming a flow path therebetween, the method including: forming, on the substrate, a mold having a recessed portion at a position corresponding to a region in which each of the ejection orifices is formed and in a vicinity of the position; forming a coating layer by chemical vapor deposition so as to cover the mold; and forming the ejection orifices through the coating layer to obtain the ejection orifice forming member.