Abstract: A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching.

Abstract: A recording-element substrate includes an ejection port configured to eject liquid; a heating resistance element configured to generate thermal energy for ejecting the liquid from the ejection port; and a drive circuit configured to drive the heating resistance element. The heating resistance element includes a heating resistor layer and three pairs of electrodes provided for the heating resistor layer. The drive circuit forms a heating area that generates thermal energy in the heating resistor layer by selectively using two or more of the electrodes.

Abstract: A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material.

Abstract: A liquid discharge head has a substrate, an energy generating element which generates energy for discharging liquid, and an orifice plate in which a discharge orifice which discharges liquid is formed, in which the orifice plate contains silicon and carbon and when the content ratio of the silicon is defined as X (atom %) and the content ratio of the carbon is defined as Y (atom %), Y/X is 0.001 or more.

Abstract: A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate.

Abstract: The invention provides a process for producing a protective-layer-provided substrate in which a protective layer is formed on a substrate on the surface of which a plurality of structures have been arranged at intervals. The protective layer has a resin layer and a film for chucking. The process includes the steps of forming the resin layer between the respective structures, on the surfaces of the respective structures and on the surface of the substrate having the plurality of the structures; and forming the film for chucking on the resin layer to form the protective layer.

Abstract: A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material.

Abstract: A method of etching a silicon substrate, in which a depressed portion is formed by etching a first surface of the silicon substrate with ions generated in plasma, the method including introducing a rare gas into a reaction system to ionize the rare gas.

Abstract: Provided is a method of manufacturing a liquid ejection head including: a substrate having energy generating elements disposed thereon; and an ejection orifice forming member having ejection orifices, the substrate and the ejection orifice forming member forming a flow path therebetween, the method including: forming, on the substrate, a mold having a recessed portion at a position corresponding to a region in which each of the ejection orifices is formed and in a vicinity of the position; forming a coating layer by chemical vapor deposition so as to cover the mold; and forming the ejection orifices through the coating layer to obtain the ejection orifice forming member.

Abstract: A method for producing a liquid-ejection head includes forming molds on or above the substrate, the molds being used as mold members for forming the plurality of liquid chambers; forming the flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition, the flow-passage-forming member having depressed portions each formed in an area between an adjacent pair of the liquid-chamber side walls in which the molds are not formed; forming a water-repellent layer on the orifice plate; forming filling members in the depressed portions by applying a filling material to the flow-passage-forming member having the water-repellent layer formed thereon to fill the depressed portions with the filling material; forming the ejection ports in the flow-passage-forming member; and removing the molds after forming the ejection ports.

Abstract: A method for producing a liquid-ejection head includes forming molds on or above the substrate, the molds being used as mold members for forming the plurality of liquid chambers; forming the flow-passage-forming member by depositing an inorganic material on or above the substrate and the molds by chemical vapor deposition, the flow-passage-forming member having depressed portions each formed in an area between an adjacent pair of the liquid-chamber side walls in which the molds are not formed; forming a water-repellent layer on the orifice plate; forming filling members in the depressed portions by applying a filling material to the flow-passage-forming member having the water-repellent layer formed thereon to fill the depressed portions with the filling material; forming the ejection ports in the flow-passage-forming member; and removing the molds after forming the ejection ports.

Abstract: A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

Abstract: A method for manufacturing a wiring board includes a first process of preparing a substrate having a hole passing through a first surface and a second surface opposite the first surface; a second process of closing the opening of the hole in the first surface with a wiring member; a third process of supplying a powder conductive material onto the second surface to fill the hole with the conductive material; a fourth process of removing the conductive material that is not charged into the hole from the top of the second surface; and a fifth process of melting the conductive material that fills the hole by heating the conductive material and thereafter solidifying the conductive material.

Abstract: A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.

Abstract: A process includes preparing a base material having a first surface provided with an element generating energy that is used for discharging a liquid and an electrode layer that is connected to the element; forming a hollow on a second surface, which is the surface on the opposite side of the first surface, of the base material, wherein part of the electrode layer serves as the bottom face of the hollow; covering the surface of the base material and the bottom face forming the inner face of the hollow with an insulating film; and partially exposing the electrode layer by removing part of the insulating film covering the bottom face using laser light.

Abstract: A liquid discharge head includes a plurality of nozzle arrays. A concave portion is formed on a back side of a head substrate, and all supply ports are formed in the bottom of the concave portion. The head substrate and a supporting member are bonded at the bottom of the concave portion so that the supply port and an introduction port communicate with each other. According to such a configuration, a ground contact area can be sufficiently secured, so that a liquid discharge head that is highly reliable and having high heat dissipation ability, and that can be manufactured with high productivity can be achieved.

Abstract: A liquid ejection head substrate including a silicon substrate having a liquid supply port as hollow and slots as through holes connecting the hollow and a liquid channel arranged opposite sides of the substrate. The method includes etching the substrate to form the hollow; forming a first resist on the hollow; etching the first resist on the bottom of the hollow under conditions of securing an equal etching rate to both the silicon substrate and the first resist; forming a second resist on the hollow; patterning the second resist into an etching mask; and etching the substrate using the etching mask to form the through holes.

Abstract: An inkjet head includes a recording element substrate for discharging ink, a supply port penetrating the recording element substrate and serving as an ink flow path, a protrusion formed at a position surrounding the supply port, projecting from one surface of the recording element substrate, and having a first metal layer at a distal end, and a supporting member having a second metal layer welded with the first metal layer and supporting the recording element substrate.

Abstract: A liquid ejection head includes a substrate, having a front surface and a back surface, provided on the front surface with an energy generating element for generating energy used for ejecting liquid; a supply port, provided so as to penetrate between the front surface and the back surface of the substrate, for supplying the liquid to the energy generating element; a first film provided on the front surface of the substrate; and a second film provided so as to coat a wall of the substrate defining the supply port. The first film and the second film surface-contact each other with respect to two directions substantially perpendicular to each other.

Abstract: A liquid discharge head includes a plurality of nozzle arrays. A concave portion is formed on a back side of a head substrate, and all supply ports are formed in the bottom of the concave portion. The head substrate and a supporting member are bonded at the bottom of the concave portion so that the supply port and an introduction port communicate with each other. According to such a configuration, a ground contact area can be sufficiently secured, so that a liquid discharge head that is highly reliable and having high heat dissipation ability, and that can be manufactured with high productivity can be achieved.