Patents by Inventor Masayoshi Esashi

Masayoshi Esashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9739675
    Abstract: A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: August 22, 2017
    Assignees: DENSO CORPORATION, TOHOKU UNIVERSITY, National University Corporation Chiba University
    Inventors: Akihiko Teshigahara, Toshihiko Takahata, Takao Iwaki, Shuji Tanaka, Masayoshi Esashi, Kenya Hashimoto
  • Patent number: 9478503
    Abstract: An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: October 25, 2016
    Assignees: TOHOKU UNIVERSITY, KABUSHIKI KAISHA TOYOTA CHUO-KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Mitsutoshi Makihata, Masayoshi Esashi, Shuji Tanaka, Masanori Muroyama, Hirofumi Funabashi, Yutaka Nonomura, Yoshiyuki Hata, Hitoshi Yamada, Takahiro Nakayama, Ui Yamaguchi
  • Publication number: 20160054352
    Abstract: There are provided a multi-axis sensor and a method for manufacturing the same. The multi-axis sensor includes: a first sensor mounted on a board and detecting inertial force; and a second sensor mounted on the board and detecting a position and a motion, wherein the first sensor and the board have a seal formed therebetween so as to prevent permeation from the outside and are electrically connected to each other.
    Type: Application
    Filed: January 7, 2015
    Publication date: February 25, 2016
    Applicants: SAMSUNG ELECTRO-MECHANICS CO., LTD., TOHOKU UNIVERSITY
    Inventors: Pil Joong KANG, Je Hong KYOUNG, Masayoshi ESASHI, Jung Won LEE
  • Patent number: 9215089
    Abstract: A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: December 15, 2015
    Assignees: TOHOKU UNIVERSITY, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masanori Muroyama, Masayoshi Esashi, Shuji Tanaka, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada
  • Publication number: 20150357551
    Abstract: A surface acoustic wave (SAW) sensor includes a surface acoustic wave material and a comb-teeth electrode. The surface acoustic wave material is to be arranged at a place where the surface acoustic wave material is distorted by physical quantity such as stress. The comb-teeth electrode is arranged on the surface of the surface acoustic wave material to excite a surface acoustic wave to the surface acoustic wave material. The surface acoustic wave material has a sapphire board and a ScAlN film arranged on a surface of the sapphire board.
    Type: Application
    Filed: May 27, 2015
    Publication date: December 10, 2015
    Inventors: Akihiko TESHIGAHARA, Toshihiko TAKAHATA, Takao IWAKI, Shuji TANAKA, Masayoshi ESASHI, Kenya HASHIMOTO
  • Publication number: 20150333046
    Abstract: An integrated device with high insulation tolerance is provided. A groove having an inclined side surface is provided between adjacent devices. When a side where an electronic circuit or MEMS device is mounted is a front surface, the groove becomes narrower from the front surface to a back surface because of the inclined surface. A mold material (insulating material) is disposed inside the groove, so that the plurality of devices are mechanically joined together, being electrically insulated from one another. A line member that establishes an electrical conduction between the adjacent devices is formed to lie along the side surface and the bottom surface of the groove. To lead the line out to the backside, the bottom surface of the groove has a hole, so that the line member is exposed to the backside from the hole.
    Type: Application
    Filed: February 28, 2013
    Publication date: November 19, 2015
    Applicants: TOHOKU UNIVERSITY, TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Mitsutoshi MAKIHATA, Masayoshi ESASHI, Shuji TANAKA, Masanori MUROYAMA, Hirofumi FUNABASHI, Yutaka NONOMURA, Yoshiyuki HATA, Hitoshi YAMADA, Takahiro NAKAYAMA, Ui YAMAGUCHI
  • Patent number: 9134189
    Abstract: A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: September 15, 2015
    Assignees: Toyota Jidosha Kabushiki Kaisha, Kabushiki Kaisha Toyota Chuo Kenkyusho, Tohoku University
    Inventors: Yoshiyuki Hata, Yutaka Nonomura, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Yoshiteru Omura, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada, Shuji Tanaka, Masayoshi Esashi, Masanori Muroyama, Mitsutoshi Makihata
  • Publication number: 20150110309
    Abstract: There is provided an acoustic transducer including an electrode substrate having a plurality of holes formed therein and having a first electrode thereon, a diaphragm disposed so as to face the electrode substrate and having a second electrode thereon to form an electric field in a space between the diaphragm and the electrode substrate, and a plurality of protrusions formed on the diaphragm and having the second electrode to form electric fields in the plurality of holes.
    Type: Application
    Filed: March 4, 2014
    Publication date: April 23, 2015
    Applicants: TOHOKU UNIVERSITY, SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yoon Sok Park, Masayoshi Esashi, Pil Joong Kang
  • Patent number: 8823114
    Abstract: Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: September 2, 2014
    Assignees: Tohoku University, Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Shuji Tanaka, Masayoshi Esashi, Masanori Muroyama, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada
  • Patent number: 8796850
    Abstract: By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
    Type: Grant
    Filed: September 1, 2010
    Date of Patent: August 5, 2014
    Assignee: Tohoku University
    Inventors: Shuji Tanaka, Masayoshi Esashi, Sakae Matsuzaki, Mamoru Mori
  • Publication number: 20140137670
    Abstract: A dynamic quantity sensor includes a force receiving portion, a first movable portion that rotates in a first rotational direction around a first rotational axis according to dynamic quantity in a first direction that the force receiving portion receives, and rotates in the first rotational direction around the first rotational axis according to dynamic quantity in a second direction different from the first direction that the force receiving portion receives; and a second movable portion that rotates in a second rotational direction around a second rotational axis according to the dynamic quantity in the first direction that the force receiving portion receives, and rotates in an opposite direction to the second rotational direction around the second rotational axis according to the dynamic quantity in the second direction that the force receiving portion receives.
    Type: Application
    Filed: November 15, 2013
    Publication date: May 22, 2014
    Applicants: TOYOTA JIDOSHA KABUSHIKI KAISHA, TOHOKU UNIVERSITY, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Yoshiyuki Hata, Yutaka Nonomura, Motohiro Fujiyoshi, Hirofumi Funabashi, Teruhisa Akashi, Yoshiteru Omura, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada, Shuji Tanaka, Masayoshi Esashi, Masanori Muroyama, Mitsutoshi Makihata
  • Patent number: 8613231
    Abstract: Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: December 24, 2013
    Assignees: Tohoku University, Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Masanori Muroyama, Masayoshi Esashi, Shuji Tanaka, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Hitoshi Yamada, Ui Yamaguchi
  • Patent number: 8481248
    Abstract: A method for fabricating a micromachine component of resin comprising step (a) of forming a sacrifice layer on a substrate, step (b) of forming at least two photosensitive resin composition layers sequentially on the sacrifice layer, and performing photolithography of each photosensitive resin composition layer to form an air gap portion defining the circumferential edge portion of the micromachine component and an air gap portion where an internal structure of the micromachine component is constituted to form a multilayer structure, step (c) for depositing dry film resist on the multilayer structure of the cured photosensitive resin composition layer, and performing photolithography of the dry film resist layer to form a cured dry film resist layer in which an air gap portion defining the circumferential edge of a shroud layer and an air gap where the structure of the shroud layer is constituted are formed, and step (d) for separating the micromachine component having the multilayer structure of the cured ph
    Type: Grant
    Filed: June 15, 2006
    Date of Patent: July 9, 2013
    Assignees: Tohoku University, Nippon Kayaku Kabushiki Kaisha
    Inventors: Nao Honda, Satoshi Mori, Shuji Tanaka, Masayoshi Esashi
  • Patent number: 8336399
    Abstract: A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
    Type: Grant
    Filed: October 13, 2010
    Date of Patent: December 25, 2012
    Assignees: Tohoku University, Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Masanori Muroyama, Masayoshi Esashi, Shuji Tanaka, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada
  • Publication number: 20120247226
    Abstract: Provided are multiple normal stress detection sensor units capable of detecting a normal stress, and a sheet layer portion. The sheet layer portion includes an exterior sheet layer portion, a force detection sheet layer portion incorporating normal stress detection units, and an intermediary layer sandwiched between the exterior sheet layer portion and the force detection sheet layer portion. The exterior sheet layer portion and the force detection sheet layer portion include multiple protrusions protruding in directions opposed to each other, and are disposed such that the protrusions engage each other with the intermediary layer interposed therebetween. Each normal stress detection sensor unit includes a central portion detection sensor device disposed immediately below a central portion of the protrusion provided on the force detection sheet portion, and at least two edge detection sensor devices disposed immediately below edge portions of the protrusion provided on the force detection sheet portion.
    Type: Application
    Filed: October 14, 2009
    Publication date: October 4, 2012
    Applicants: TOHOKU UNIVERSITY, TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Masanori Muroyama, Masayoshi Esashi, Shuji Tanaka, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Hitoshi Yamada, Ui Yamaguchi
  • Publication number: 20120254490
    Abstract: A touch sensor system includes buses, a plurality of touch sensor devices disposed on the buses, and an information integrating device that is connected to all the buses and integrates information from the touch sensor device. The touch sensor device includes a sensor unit and a signal processing unit that transmits a sensor data signal generated by processing an analog sensor signal to the information integrating device through the bus. The signal processing unit includes a digital converting unit, a threshold evaluating unit that gives a start permission of the signal process when a sensor value exceeds a preset threshold, an ID adding unit that adds a transmitter identification number to the sensor signal, and a data transmitting unit that outputs the sensor data signal to a signal line of the bus. Fast responses are made possible without increasing the amount of data and host processing load while including many touch sensor elements.
    Type: Application
    Filed: October 14, 2009
    Publication date: October 4, 2012
    Applicants: TOHOKU UNIVERSITY, TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Masanori Muroyama, Masayoshi Esashi, Shuji Tanaka, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada
  • Publication number: 20120217638
    Abstract: By forming a metal layer 14 on at least one of a connecting electrode 12 of a first substrate 10 and a connecting electrode 17 of a second substrate 15, placing the first substrate 10 and the second substrate 15 together in order that the connecting electrode 12 and the connecting electrode 17 face opposite to each other via the metal layer 14, increasing temperature up to anodic bonding temperature, and applying DC voltage between the first substrate 10 and the second substrate 15 while maintaining that temperature, the first substrate 10 and the second substrate 15 are anodically bonded, and at the same time by melting the metal layer 14, the connecting electrode 12 and the connecting electrode 17 are electrically connected. The method achieves anodic bonding of substrates with high yield and at the same time establishes wiring connection, effective for packaging.
    Type: Application
    Filed: September 1, 2010
    Publication date: August 30, 2012
    Applicant: TOHOKU UNIVERSITY
    Inventors: Shuji Tanaka, Masayoshi Esashi, Sakae Matsuzaki, Mamoru Mori
  • Publication number: 20120199921
    Abstract: Provided is a technique for packaging a sensor structure having a contact sensing surface and a signal processing LSI that processes a sensor signal. The sensor structure has the contact sensing surface and sensor electrodes. The signal processing integrated circuit is embedded in a semiconductor substrate. The sensor structure and the semiconductor substrate are bonded by a bonding layer, forming a sensor device as a single chip. The sensor electrodes and the integrated circuit are sealed inside the sensor device, and the sensor electrodes and external terminals of the integrated circuit are led out to the back surface of the semiconductor substrate through a side surface of the semiconductor substrate.
    Type: Application
    Filed: October 13, 2010
    Publication date: August 9, 2012
    Applicants: TOHOKU UNIVERSITY, TOYOTA JIDOSHA KABUSHIKI KAISHA, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO
    Inventors: Shuji Tanaka, Masayoshi Esashi, Masanori Muroyama, Sakae Matsuzaki, Mitsutoshi Makihata, Yutaka Nonomura, Motohiro Fujiyoshi, Takahiro Nakayama, Ui Yamaguchi, Hitoshi Yamada
  • Publication number: 20110083517
    Abstract: A sensor system includes a first sensing device that includes a sensor, and first and second surrounding portions that surround the sensor at least partially, a second sensing device that comprises a sensor, and first and second surrounding portions that surround the sensor at least partially, wherein at least one of a combination of shapes of the first and second surrounding portions of the respective first and second sensing devices and a combination of physical properties of the first and second surrounding portions of the respective first and second sensing devices is configured such that a detection characteristic of the first sensing device is different from a detection characteristic of the second sensing device.
    Type: Application
    Filed: October 13, 2010
    Publication date: April 14, 2011
    Applicants: TOHOKU UNIVERSITY, KABUSHIKI KAISHA TOYOTA CHUO KENKYUSHO, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Masanori MUROYAMA, Masayoshi ESASHI, Shuji TANAKA, Sakae MATSUZAKI, Mitsutoshi MAKIHATA, Yutaka NONOMURA, Motohiro FUJIYOSHI, Takahiro NAKAYAMA, Ui YAMAGUCHI, Hitoshi YAMADA
  • Patent number: 7723896
    Abstract: A driving mechanism using shape memory alloys comprises a first and a second shape memory alloys coils (1, 2), a pin-like drive member (3) connected to each of the shape memory alloys coils (1, 2) extending in the axis direction, a substrate (4) having a wiring pattern (11) and a drive circuit (4a) to supply current to the shape memory alloys coils (1, 2), and a magnetic latch part (9) to hold the drive member (3), and the magnetic latch part (9) has a latch position in the axis direction of the drive member (3), the drive circuit (4a) selectively current-drives the first and the second shape memory alloys coils (1, 2), the driven first or second shape memory alloys coils (1, 2) is heated and compressed to move the drive member (3) in the axis direction, and magnetic bodies (9a, 9b) provided to the drive member (3) is magnetically fixed at the latch position, thereby fixed and held in the axis direction.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: May 25, 2010
    Assignees: Japan Science and Technology Agency
    Inventors: Masayoshi Esashi, Yoichi Haga, Masanori Mizushima, Tadao Matsunaga