Patents by Inventor Masayoshi Koyama
Masayoshi Koyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9162249Abstract: A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.Type: GrantFiled: September 28, 2009Date of Patent: October 20, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Masayoshi Koyama, Norihito Tsukahara, Daido Komyoji
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Patent number: 9076752Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).Type: GrantFiled: January 10, 2013Date of Patent: July 7, 2015Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Toshiyuki Kojima, Tsukasa Shiraishi, Norihito Tsukahara, Takayuki Hirose, Keiko Ikuta, Masayoshi Koyama
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Publication number: 20140231981Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).Type: ApplicationFiled: January 10, 2013Publication date: August 21, 2014Applicant: Panasonic CorporationInventors: Toshiyuki Kojima, Tsukasa Shiraishi, Norihito Tsukahara, Takayuki Hirose, Keiko Ikuta, Masayoshi Koyama
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Patent number: 8353102Abstract: A wiring board connection method comprising: arranging a continuous conductive joint body on adjacent connection terminals of one of the wiring boards in a space between the adjacent connection terminals on one of the wiring boards; aligning the wiring boards so that the connection terminals face each other with the conductive joint body interposed therebetween; and bonding the connection terminals with each other by heating and then cooling the conductive joint body, wherein: the conductive joint body is a material that generates air bubbles upon being heated; and a recessed portion is formed on a surface of at least one of the connection terminals, the surface being opposite to the connection terminal of another wiring board. When the connection terminals are bonded with each other, the conductive joint body is allowed to move so as to gather on the surfaces of the connection terminals where no recessed portions are formed.Type: GrantFiled: May 15, 2008Date of Patent: January 15, 2013Assignee: Panasonic CorporationInventors: Masayoshi Koyama, Tsukasa Shiraishi
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Patent number: 8304338Abstract: Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).Type: GrantFiled: March 22, 2010Date of Patent: November 6, 2012Assignee: Panasonic CorporationInventors: Norihito Tsukahara, Masayoshi Koyama
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Patent number: 8115109Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.Type: GrantFiled: April 22, 2009Date of Patent: February 14, 2012Assignee: Panasonic CorporationInventors: Masayoshi Koyama, Norihito Tsukahara, Susumu Matsuoka
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Patent number: 8111426Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.Type: GrantFiled: November 15, 2007Date of Patent: February 7, 2012Assignee: Sony CorporationInventors: Masayoshi Koyama, Masato Nakamura, Takumi Namekawa, Shota Nishi, Shinichi Horii
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Patent number: 8081345Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.Type: GrantFiled: November 15, 2007Date of Patent: December 20, 2011Assignee: Sony CorporationInventors: Masayoshi Koyama, Masato Nakamura, Takumi Namekawa, Shota Nishi, Shinichi Horii
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Patent number: 7905011Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.Type: GrantFiled: February 22, 2007Date of Patent: March 15, 2011Assignee: Panasonic CorporationInventors: Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama
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Patent number: 7869084Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.Type: GrantFiled: November 15, 2007Date of Patent: January 11, 2011Assignee: Sony CorporationInventors: Masayoshi Koyama, Masato Nakamura, Takumi Namekawa, Shota Nishi, Shinichi Horii
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Publication number: 20100244283Abstract: Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).Type: ApplicationFiled: March 22, 2010Publication date: September 30, 2010Applicant: PANASONIC CORPORATIONInventors: Norihito Tsukahara, Masayoshi Koyama
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Patent number: 7753752Abstract: In a method of cutting a plasma display panel, a front glass substrate and a rear glass substrate are sealed so as to face each other. The front glass substrate and the rear glass substrate are sandwiched between pairs of rotating cutters, and the pairs of rotating cutters are pressed onto the front glass substrate and the rear glass substrate to be in contact therewith so that the rotating cutters are run thereon in order to cut the substrates.Type: GrantFiled: January 17, 2006Date of Patent: July 13, 2010Assignee: Panasonic CorporationInventors: Nobuyuki Kirihara, Hiroki Nunose, Masayoshi Koyama, Akira Isomi
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Patent number: 7737367Abstract: Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.Type: GrantFiled: January 25, 2006Date of Patent: June 15, 2010Assignee: Panasonic CorporationInventors: Masayoshi Koyama, Yoshitake Hayashi, Kazuo Otani
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Publication number: 20100080912Abstract: A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.Type: ApplicationFiled: September 28, 2009Publication date: April 1, 2010Applicant: PANASONIC CORPORATIONInventors: Masayoshi Koyama, Norihito Tsukahara, Daido Komyoji
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Publication number: 20090266592Abstract: A circuit board in which end faces (36a) of wires are located in positions withdrawn from the end in a joint region of a first board (31a), end faces (36b) of wires are located in positions withdrawn from the end in a joint region of a second board (31b), a gap (W) between the end faces (36a) of the wires of the first board (31a) and the end faces (36b) of the wires of the second board (31b) is filled with a conductor (16A), and the first board (31a) and the second board (31b) are jointed by means of a resin.Type: ApplicationFiled: April 22, 2009Publication date: October 29, 2009Applicant: Panasonic CorporationInventors: Masayoshi Koyama, Norihito Tsukahara, Susumu Matsuoka
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Publication number: 20090229120Abstract: In a method for forming bumps 19 on electrodes 32 of a wiring board 31, a fluid 14 containing conductive particles 16 and a gas bubble generating agent is supplied onto a first region 17 including the electrodes 32 on the wiring board 31. Then, a substrate 40 which has a protruding surface 13 having the same area as that of the first region 17 and formed on a main surface 18 of the substrate 40 having a larger area than that of the first region 17 is disposed so that the protruding surface 13 faces the first region 17 of the wiring board 31. Then, the fluid 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the fluid 14.Type: ApplicationFiled: February 22, 2007Publication date: September 17, 2009Inventors: Yasushi Taniguchi, Seiichi Nakatani, Seiji Karashima, Takashi Kitae, Susumu Matsuoka, Masayoshi Koyama
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Publication number: 20090156081Abstract: In a method of cutting a plasma display panel, a front glass substrate and a rear glass substrate are sealed so as to face each other. The front glass substrate and the rear glass substrate are sandwiched between pairs of rotating cutters, and the pairs of rotating cutters are pressed onto the front glass substrate and the rear glass substrate to be in contact therewith so that the rotating cutters are run thereon in order to cut the substrates.Type: ApplicationFiled: January 17, 2006Publication date: June 18, 2009Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Nobuyuki Kirihara, Hiroki Nunose, Masayoshi Koyama, Akira Isomi
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Patent number: 7488895Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.Type: GrantFiled: September 27, 2004Date of Patent: February 10, 2009Assignee: Panasonic CorporationInventors: Yoshitake Hayashi, Masayoshi Koyama, Satoru Yuhaku, Kazuo Otani, Susumu Matsuoka, Yasushi Taniguchi, Seiichi Nakatani
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Publication number: 20080283284Abstract: A wiring board connection method connects wiring boards each having a strip-shaped connection terminal for connecting with another substrate, the method including the steps of: aligning the wiring boards so that the connection terminals face each other with a fluid interposed therebetween; and bonding the connection terminals with each other by heating and then-cooling the fluid, wherein: the fluid is a material that generates air bubbles upon being heated; a plurality of the connection terminals are provided on each of the wiring boards; and a groove is formed in each of at least one of the connection terminals in at least one of the wiring boards, the groove extending across the relevant connection terminal.Type: ApplicationFiled: May 15, 2008Publication date: November 20, 2008Applicant: Matsushita Electric Industrial Co., Ltd.Inventors: Masayoshi KOYAMA, Tsukasa SHIRAISHI
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Publication number: 20080186340Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.Type: ApplicationFiled: November 15, 2007Publication date: August 7, 2008Applicant: SONY CORPORATIONInventors: Masayoshi Koyama, Masato Nakamura, Takumi Namekawa, Shota Nishi, Shinichi Horii