Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.

Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.

Abstract: A component built-in module of the present invention includes: a first wiring pattern; an electronic component mounted on the first wiring pattern; a second wiring pattern; an electrical insulating sheet with the electrical component built therein, the electrical insulating sheet being disposed between the first wiring pattern and the second wiring pattern; and a via conductor formed in a via hole penetrating through the electrical insulating sheet, the via conductor connecting electrically the first wiring pattern and the second wiring pattern. A side face of the via conductor defines a continuous line in an axis direction of the via conductor. Thus, a component built-in module having excellent reliability concerning electrical connection can be provided.

Abstract: Holes having the same diameter as via holes are formed in predetermined positions in advance when forming wiring patterns on releasable carriers. The carriers with the wiring patterns are bonded on an insulating material, and a laser beam is irradiated from the side of the carrier using the holes in the wiring pattern as a laser mask to form via holes in the insulating material. The via holes and the holes in the carrier are then filled with a conductive paste. With the holes in the carrier that are matched in position with the via holes, lands in the conductor layers are precisely positioned relative to the via holes. A multilayer circuit board thus produced has lower electrical connection resistance and excellent mountability with improved performances. Also a manufacturing method thereof is achieved.

Abstract: The present invention provides a droplet discharging apparatus including a discharge head for deflectively discharging droplets through one discharge port at a plurality of pixel areas in adaptive fashion. The discharge head is controlled to discharge droplets at an object. A storage unit stores status information about the discharge head. A communication unit communicates with an information processing apparatus located outside so as to transmit the status information to the information processing apparatus.

Abstract: A recording medium is provided which records an installation-assisting program in a manner readable by a computer, the installation-assisting program causing the computer to carry out the steps of: before execution of installation, acquiring a character string necessary for the installation from an external file; and referencing the acquired character string to proceed with the installation.

Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has a first step of setting a flexibly deformable sheet on a face of the semiconductor device not facing the substrate; and a second step of generating an air-pressure difference between the side where the semiconductor device is not present and the side where the semiconductor device is present on the basis of the sheet so that the air pressure at the side where the semiconductor device is not present becomes higher than the side where the semiconductor device is present and pressurizing the semiconductor device by the sheet after the first step.

Abstract: A method for fabricating a semiconductor-mounting body having at least one semiconductor device mounted on a substrate and a sealing resin set in the gap between the substrate and the semiconductor device, has

Abstract: Pharmaceutical composition for preventing or treating bone fracture comprising as an active ingredient a platelet factor 4.The present composition can promote differentiation of osteoblasts so that they are effective for prophylaxis and treatment of such diseases requiring bone differentiation and proliferation as bone fracture and the like.

Abstract: L-lysyl-glycyl-histidine and metal complexes thereof, for example, L-lysyl-glycyl-L-histidine: copper (II).The L-lysyl-glycyl-L-histidine and salt thereof have a fibroblast proliferation promoting activity and then it is useful as a wound healing agent.

Abstract: A protein named PHBP-70 having a wound-healing activity which has a molecular weight of about 60-80 KDa by analysis with SDS-PAGE under reducing conditions and can be obtained from the blood of the fetus and neonates of mammals including human beings. The protein PHBP-70 is a novel protein having a fibroblast proliferating activity and thus it is useful as a wound-healing agent.

Abstract: Supporting metal fittings for double beams comprising, double beams which are composed of two angles disposed in parallel with each other at a given interval, an upper metal fitting having notched portions in which the upper portions of the double beams are engaged, said upper metal fitting also having a tongue portion which engages between the double beams, a lower metal fitting having retainers by which the lower portion of the double beams is retained, said lower metal fitting also having a tongue portion which engages between the double beams, and a fixing member coupled to both the upper and lower metal fittings and inserted between the double beams for fixing them together, enabling the easy manufacturing of the supporting metal fittings for double beams for installing ducts, etc., using non-machined angles.