Abstract: A spectral measurement device includes a light reflection grating having a plurality of movable gratings and a movable grating drive unit that displaces the movable gratings to alter a grating pattern of the light reflection grating, a light detecting element that detects light incident on the light reflection grating, a storage unit storing a relationship between a light quantity to be detected by the light detecting element and corresponding light intensities at differing wavelengths for different grating patterns, and a computation unit that calculates light intensities at the differing wavelengths of the light incident on the light reflection grating based on the light quantity of the incident light detected by the light detecting element for each of the different grating patterns by altering the grating pattern based on the relationship between the light quantity and the corresponding light intensities for the different grating patterns stored in the storage unit.

Abstract: To achieve an image pickup element that can utilize polarized light as well as non-polarized light to image or capture an object, an image pickup element is provided to an imaging apparatus that forms an image of an object to be imaged onto a light-receiving surface of an image sensor, acquires a polarized filter image together with a regular luminance image, and executes image processing on the acquired images. The image pickup element includes, on a light-receiving surface LRS of the image sensor IMS, a polarizing filter PFL including at least two kinds of pixels having different transmission and polarization properties from each other.

Abstract: A spectral measurement device includes a light reflection grating having a plurality of movable gratings and a movable grating drive unit that displaces the movable gratings to alter a grating pattern of the light reflection grating, a light detecting element that detects light incident on the light reflection grating, a storage unit storing a relationship between a light quantity to be detected by the light detecting element and corresponding light intensities at differing wavelengths for different grating patterns, and a computation unit that calculates light intensities at the differing wavelengths of the light incident on the light reflection grating based on the light quantity of the incident light detected by the light detecting element for each of the different grating patterns by altering the grating pattern based on the relationship between the light quantity and the corresponding light intensities for the different grating patterns stored in the storage unit.

Abstract: An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.

Abstract: An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.