Patents by Inventor Masayuki Hodono

Masayuki Hodono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200032026
    Abstract: Provided is a porous low-dielectric polymer film which has a low dielectric constant at high millimeter-wave frequencies to fulfill utility as a sheet for a millimeter-wave antenna, and provides excellent circuit board processability. The porous low-dielectric polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 50 ?m or less, and wherein a porous structure of the film is a closed-cell structure.
    Type: Application
    Filed: April 6, 2018
    Publication date: January 30, 2020
    Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
  • Publication number: 20190263996
    Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 10 ?m or less.
    Type: Application
    Filed: April 6, 2017
    Publication date: August 29, 2019
    Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
  • Publication number: 20190263995
    Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film comprises: a base material layer made of a polymer material and formed with fine pores dispersed therein; and a substantially smooth skin layer made of the same polymer material as that of the base material layer and formed on at least one of the surfaces of the base material layer.
    Type: Application
    Filed: April 6, 2017
    Publication date: August 29, 2019
    Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
  • Patent number: 9553370
    Abstract: First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: January 24, 2017
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masami Inoue, Masayuki Hodono, Mitsuru Honjo
  • Patent number: 9265141
    Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 16, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Masami Inoue, Masayuki Hodono, Akiko Nagafuji, Yuichi Tsujita, Mitsuru Honjo
  • Publication number: 20150270620
    Abstract: First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.
    Type: Application
    Filed: March 13, 2014
    Publication date: September 24, 2015
    Applicant: NITTO DENKO CORPORATION
    Inventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO
  • Patent number: 8915657
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit using coupling pins. The optical waveguide unit includes fitting holes for fitting the coupling pins thereinto, which are formed in a surface of an overcladding layer, located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes fitting through holes for fitting the coupling pins therethrough, located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the coupling pins fit through the fitting through holes and fit into the fitting holes.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: December 23, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masami Inoue, Masayuki Hodono, Akiko Nagafuji, Yuichi Tsujita
  • Patent number: 8837873
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: September 16, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue, Mitsuru Honjo
  • Publication number: 20140225129
    Abstract: An electrode is formed on at least one surface of first and second surfaces of a dielectric film formed of resin to be capable of receiving or transmitting an electromagnetic wave in a terahertz band. A semiconductor device operable in the terahertz band is mounted on at least one surface of the first and second surfaces of the dielectric film to be electrically connected to the electrode. A portion of a support layer is formed on the first or second surface of the dielectric film, and a dielectric lens is supported by another portion of the support layer. Another portion of the support layer is bent with respect to the portion such that the electromagnetic wave in the terahertz band transmitted or received by the electrode permeates through the dielectric lens.
    Type: Application
    Filed: February 11, 2014
    Publication date: August 14, 2014
    Applicant: Nitto Denko Corporation
    Inventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO
  • Publication number: 20140203994
    Abstract: An antenna module includes a support body and an antenna body. The support body has a flat support surface and a support surface that extends obliquely upward from one side of the support surface. The antenna body is attached to the support surface while being bent along the support surface of the support body. The antenna body is constituted by a dielectric film, a pair of electrodes and a semiconductor device. The pair of electrodes is formed on a main surface of the dielectric film, and the semiconductor device is mounted on the end of the electrode.
    Type: Application
    Filed: January 15, 2014
    Publication date: July 24, 2014
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki HODONO, Masami INOUE, Mitsuru HONJO
  • Publication number: 20140132466
    Abstract: A dielectric film has a main surface and a back surface and is formed of resin. Electrodes that can receive or transmit an electromagnetic wave having a frequency of not less than 0.05 THz and not more than 10 THz in the terahertz band are formed on the main surface of the dielectric film. The electrodes constitute a tapered slot antenna. The dielectric film and the electrodes are formed of a flexible printed circuit board. A semiconductor device that is operable at a frequency in the terahertz band is mounted on the main surface of the dielectric film so as to be electrically connected to the electrodes.
    Type: Application
    Filed: November 4, 2013
    Publication date: May 15, 2014
    Applicants: OSAKA UNIVERSITY, NITTO DENKO CORPORATION
    Inventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO, Tadao NAGATSUMA, Masayuki FUJITA
  • Patent number: 8644655
    Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.
    Type: Grant
    Filed: February 28, 2012
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Ryusuke Naito, Mitsuru Honjo
  • Patent number: 8644660
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.
    Type: Grant
    Filed: March 1, 2012
    Date of Patent: February 4, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue
  • Patent number: 8606056
    Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes notch portions for locating the electric circuit unit, which is formed in portions of at least one of an undercladding layer and an overcladding layer, and the notch portions are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions, which fit into the notch portions, and the bent portions are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other under a state in which the bent portions fit into the notch portions.
    Type: Grant
    Filed: March 7, 2012
    Date of Patent: December 10, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Mayu Takase
  • Patent number: 8548285
    Abstract: A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section, and an optical sensor module obtained thereby. An optical waveguide section W1 including groove portions (fitting portions) 4a for the positioning of a substrate section, and a substrate section E1 including fitting plate portions (to-be-fitted portions) 5a for fitting engagement with the groove portions 4a are individually produced. The fitting plate portions 5a in the substrate section E1 are brought into fitting engagement with the groove portions 4a in the optical waveguide section W1 whereby the substrate section E1 and the optical waveguide section W1 are integrated together.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: October 1, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Patent number: 8467640
    Abstract: An optical waveguide unit having board unit engaging vertical grooves and a board unit having engagement plate portions to be fitted in the vertical grooves and projections are individually produced, and the engagement plate portions and the projections are brought into fitting engagement with the vertical grooves of the optical waveguide unit. At this time, the projections are deformed to accommodate the tolerances of the components, thereby preventing wobbling and warpage of the board unit. Further, the vertical grooves of the optical waveguide unit are provided in proper positions with respect to a light transmission face of a core, and the engagement plate portions of the board unit are provided in proper positions with respect to the optical element. Therefore, the fitting engagement between the vertical grooves and the engagement plate portions permits proper positioning of the light transmission face of the core and the optical element for self-alignment.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: June 18, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Patent number: 8452138
    Abstract: An optical sensor module is provided in which an engagement portion of a board unit is fitted in a groove of an optical waveguide unit and, even with the single engagement portion, the board unit is stably supported. An optical sensor module includes an optical waveguide unit, and a board unit mounted with an optical element and coupled to the optical waveguide unit. The optical waveguide unit includes a single edge extension portion axially extending along one side edge of an over-cladding layer, a board unit engagement groove provided in the single edge extension portion, and a projection provided on a side wall of the vertical groove and kept in abutment against an engagement portion of the board unit. The board unit includes an engagement portion fitted in the vertical groove, which abuts against the projection within the vertical groove.
    Type: Grant
    Filed: January 30, 2012
    Date of Patent: May 28, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Ryusuke Naito, Emiko Tani, Masayuki Hodono, Yusuke Shimizu, Kei Nakamura
  • Patent number: 8428403
    Abstract: An optical sensor module is provided which reduces variations in optical coupling loss between a core in an optical waveguide unit and an optical element in a substrate unit and which reduces the optical coupling loss. The optical waveguide unit including vertical groove portions for fitting engagement with the substrate unit and the substrate unit including fitting plate portions for fitting engagement with the vertical groove portions are produced individually. The fitting plate portions in the substrate unit are brought into fitting engagement with the vertical groove portions in the optical waveguide unit, so that the substrate unit and the optical waveguide unit are integrated together. The vertical groove portions in the optical waveguide unit are in an appropriate position relative to a light-transmissive surface of the core. The fitting plate portions in the substrate unit are in an appropriate position relative to the optical element.
    Type: Grant
    Filed: July 18, 2011
    Date of Patent: April 23, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Patent number: 8396338
    Abstract: An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion (3a) is formed in a surface of an over cladding layer (3) of the optical waveguide section (W1). At least part of the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) for opto-electric conversion and at least part of a loop portion (8a) of a bonding wire (8) in the opto-electric conversion substrate section (E1) are positioned within the recessed portion (3a). This brings the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) and the reflecting surface (2a) formed in the core (2) closer to each other.
    Type: Grant
    Filed: September 10, 2010
    Date of Patent: March 12, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Hajime Nishio, Masayuki Hodono
  • Patent number: 8388239
    Abstract: An opto-electric hybrid module manufacturing method which suppresses a cost loss, and to provide an opto-electric hybrid module manufactured by the method. An opto-electric hybrid module is produced by separately preparing a first board for a middle portion having an optical waveguide extending from one end to the other end of the board, a second board for a light emitting end portion having a light emitting element and an optical waveguide connectable to one end of the optical waveguide of the middle portion and a third board for a light receiving end portion having a light receiving element and an optical waveguide connectable to the other end of the optical waveguide of the middle portion, checking the second and third boards for light transmission, and connecting second and third boards judged to be acceptable to the first board.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: March 5, 2013
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono