Patents by Inventor Masayuki Hodono
Masayuki Hodono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11829015Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.Type: GrantFiled: March 30, 2022Date of Patent: November 28, 2023Assignee: NITTO DENKO CORPORATIONInventors: Masayuki Hodono, Akihito Matsutomi, Tomohiro Taruno, Yoshinori Kouno, Hidenori Onishi, Shunsuke Shuto
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Publication number: 20220332083Abstract: A film for a metal layer laminate board and a metal layer laminate board have excellent stiffness, while capable of suppressing fluctuation of a dielectric constant before and after pressing. The film for a metal layer laminate board includes a porous resin layer having a tensile elastic modulus at 25° C. of 800 MPa or more and 2000 MPa or less.Type: ApplicationFiled: April 19, 2022Publication date: October 20, 2022Inventors: Kanayo SAWASHI, Akihito MATSUTOMI, Masayuki HODONO
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Publication number: 20220326551Abstract: A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheet 1 has a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheet 1 has a thickness T of 1 ?m or more and 240 ?m or less.Type: ApplicationFiled: March 30, 2022Publication date: October 13, 2022Inventors: Masayuki HODONO, Akihito MATSUTOMI, Tomohiro TARUNO, Yoshinori KOUNO, Hidenori ONISHI, Shunsuke SHUTO
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Publication number: 20220312597Abstract: A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.Type: ApplicationFiled: August 12, 2020Publication date: September 29, 2022Applicant: NITTO DENKO CORPORATIONInventors: Akihito MATSUTOMI, Masayuki HODONO
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Publication number: 20200032026Abstract: Provided is a porous low-dielectric polymer film which has a low dielectric constant at high millimeter-wave frequencies to fulfill utility as a sheet for a millimeter-wave antenna, and provides excellent circuit board processability. The porous low-dielectric polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 50 ?m or less, and wherein a porous structure of the film is a closed-cell structure.Type: ApplicationFiled: April 6, 2018Publication date: January 30, 2020Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Publication number: 20190263995Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film comprises: a base material layer made of a polymer material and formed with fine pores dispersed therein; and a substantially smooth skin layer made of the same polymer material as that of the base material layer and formed on at least one of the surfaces of the base material layer.Type: ApplicationFiled: April 6, 2017Publication date: August 29, 2019Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Publication number: 20190263996Abstract: Provided is a low-dielectric porous polymer film having a low dielectric constant at high millimeter-wave frequencies and thereby useful as a sheet for a millimeter-wave antenna. The low-dielectric porous polymer film is made of a polymer material and formed with fine pores dispersed therein, wherein the film has a porosity of 60% or more, and the pores have an average pore diameter of 10 ?m or less.Type: ApplicationFiled: April 6, 2017Publication date: August 29, 2019Inventors: Masayoshi NAKAMURA, Masayuki HODONO, Takahiko ITO, Naoki NAGAOKA, Tomoaki HISHIKI
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Patent number: 9553370Abstract: First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.Type: GrantFiled: March 13, 2014Date of Patent: January 24, 2017Assignee: NITTO DENKO CORPORATIONInventors: Masami Inoue, Masayuki Hodono, Mitsuru Honjo
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Patent number: 9265141Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes fitting holes which are formed in a surface of an overcladding layer and are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes protruding portions which fit into the fitting holes and are located and formed at predetermined locations with respect to the optical element.Type: GrantFiled: February 28, 2012Date of Patent: February 16, 2016Assignee: NITTO DENKO CORPORATIONInventors: Masami Inoue, Masayuki Hodono, Akiko Nagafuji, Yuichi Tsujita, Mitsuru Honjo
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Publication number: 20150270620Abstract: First and second conductor layers are formed on a main surface of a base layer. A tapered slot is formed between the first and second conductive layers. A first slit is formed at the first conductor layer, and a second slit is formed at the second conductor layer. Thus, the first conductor layer is divided into a first device connection portion and a first antenna portion, and the second conductor layer is divided into a second device connection portion and a second antenna portion. A semiconductor device is connected to the first and second device connection portions.Type: ApplicationFiled: March 13, 2014Publication date: September 24, 2015Applicant: NITTO DENKO CORPORATIONInventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO
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Patent number: 8915657Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit using coupling pins. The optical waveguide unit includes fitting holes for fitting the coupling pins thereinto, which are formed in a surface of an overcladding layer, located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes fitting through holes for fitting the coupling pins therethrough, located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the coupling pins fit through the fitting through holes and fit into the fitting holes.Type: GrantFiled: March 7, 2012Date of Patent: December 23, 2014Assignee: Nitto Denko CorporationInventors: Masami Inoue, Masayuki Hodono, Akiko Nagafuji, Yuichi Tsujita
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Patent number: 8837873Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.Type: GrantFiled: March 7, 2012Date of Patent: September 16, 2014Assignee: Nitto Denko CorporationInventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue, Mitsuru Honjo
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Publication number: 20140225129Abstract: An electrode is formed on at least one surface of first and second surfaces of a dielectric film formed of resin to be capable of receiving or transmitting an electromagnetic wave in a terahertz band. A semiconductor device operable in the terahertz band is mounted on at least one surface of the first and second surfaces of the dielectric film to be electrically connected to the electrode. A portion of a support layer is formed on the first or second surface of the dielectric film, and a dielectric lens is supported by another portion of the support layer. Another portion of the support layer is bent with respect to the portion such that the electromagnetic wave in the terahertz band transmitted or received by the electrode permeates through the dielectric lens.Type: ApplicationFiled: February 11, 2014Publication date: August 14, 2014Applicant: Nitto Denko CorporationInventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO
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Publication number: 20140203994Abstract: An antenna module includes a support body and an antenna body. The support body has a flat support surface and a support surface that extends obliquely upward from one side of the support surface. The antenna body is attached to the support surface while being bent along the support surface of the support body. The antenna body is constituted by a dielectric film, a pair of electrodes and a semiconductor device. The pair of electrodes is formed on a main surface of the dielectric film, and the semiconductor device is mounted on the end of the electrode.Type: ApplicationFiled: January 15, 2014Publication date: July 24, 2014Applicant: Nitto Denko CorporationInventors: Masayuki HODONO, Masami INOUE, Mitsuru HONJO
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Publication number: 20140132466Abstract: A dielectric film has a main surface and a back surface and is formed of resin. Electrodes that can receive or transmit an electromagnetic wave having a frequency of not less than 0.05 THz and not more than 10 THz in the terahertz band are formed on the main surface of the dielectric film. The electrodes constitute a tapered slot antenna. The dielectric film and the electrodes are formed of a flexible printed circuit board. A semiconductor device that is operable at a frequency in the terahertz band is mounted on the main surface of the dielectric film so as to be electrically connected to the electrodes.Type: ApplicationFiled: November 4, 2013Publication date: May 15, 2014Applicants: OSAKA UNIVERSITY, NITTO DENKO CORPORATIONInventors: Masami INOUE, Masayuki HODONO, Mitsuru HONJO, Tadao NAGATSUMA, Masayuki FUJITA
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Patent number: 8644655Abstract: Provided are an opto-electric hybrid board which eliminates the necessity of an aligning operation of a core of an optical waveguide unit and an optical element of an electric circuit unit and which is excellent in mass-productivity, and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of the undercladding layer and the overcladding layer, and are located and formed at predetermined locations with respect to a light transmitting surface of a core. The electric circuit unit includes fitting holes into which the protruding portions fit, and are located and formed at predetermined locations with respect to the optical element.Type: GrantFiled: February 28, 2012Date of Patent: February 4, 2014Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Ryusuke Naito, Mitsuru Honjo
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Patent number: 8644660Abstract: Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.Type: GrantFiled: March 1, 2012Date of Patent: February 4, 2014Assignee: Nitto Denko CorporationInventors: Akiko Nagafuji, Yuichi Tsujita, Masayuki Hodono, Masami Inoue
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Patent number: 8606056Abstract: Provided are an opto-electric hybrid board and a manufacturing method therefor. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon, the electric circuit unit being coupled to the optical waveguide unit. The optical waveguide unit includes notch portions for locating the electric circuit unit, which is formed in portions of at least one of an undercladding layer and an overcladding layer, and the notch portions are located and formed at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions, which fit into the notch portions, and the bent portions are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other under a state in which the bent portions fit into the notch portions.Type: GrantFiled: March 7, 2012Date of Patent: December 10, 2013Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Masayuki Hodono, Akiko Nagafuji, Masami Inoue, Mayu Takase
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Patent number: 8548285Abstract: A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section, and an optical sensor module obtained thereby. An optical waveguide section W1 including groove portions (fitting portions) 4a for the positioning of a substrate section, and a substrate section E1 including fitting plate portions (to-be-fitted portions) 5a for fitting engagement with the groove portions 4a are individually produced. The fitting plate portions 5a in the substrate section E1 are brought into fitting engagement with the groove portions 4a in the optical waveguide section W1 whereby the substrate section E1 and the optical waveguide section W1 are integrated together.Type: GrantFiled: July 30, 2010Date of Patent: October 1, 2013Assignee: Nitto Denko CorporationInventor: Masayuki Hodono
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Patent number: 8467640Abstract: An optical waveguide unit having board unit engaging vertical grooves and a board unit having engagement plate portions to be fitted in the vertical grooves and projections are individually produced, and the engagement plate portions and the projections are brought into fitting engagement with the vertical grooves of the optical waveguide unit. At this time, the projections are deformed to accommodate the tolerances of the components, thereby preventing wobbling and warpage of the board unit. Further, the vertical grooves of the optical waveguide unit are provided in proper positions with respect to a light transmission face of a core, and the engagement plate portions of the board unit are provided in proper positions with respect to the optical element. Therefore, the fitting engagement between the vertical grooves and the engagement plate portions permits proper positioning of the light transmission face of the core and the optical element for self-alignment.Type: GrantFiled: August 16, 2011Date of Patent: June 18, 2013Assignee: Nitto Denko CorporationInventor: Masayuki Hodono