Patents by Inventor Masayuki Hodono

Masayuki Hodono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120027338
    Abstract: An optical sensor module is provided which reduces variations in optical coupling loss between a core in an optical waveguide unit and an optical element in a substrate unit and which reduces the optical coupling loss. The optical waveguide unit including vertical groove portions for fitting engagement with the substrate unit and the substrate unit including fitting plate portions for fitting engagement with the vertical groove portions are produced individually. The fitting plate portions in the substrate unit are brought into fitting engagement with the vertical groove portions in the optical waveguide unit, so that the substrate unit and the optical waveguide unit are integrated together. The vertical groove portions in the optical waveguide unit are in an appropriate position relative to a light-transmissive surface of the core. The fitting plate portions in the substrate unit are in an appropriate position relative to the optical element.
    Type: Application
    Filed: July 18, 2011
    Publication date: February 2, 2012
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Patent number: 8055105
    Abstract: A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W1 including protrusions 4 for the positioning of an electric circuit portion E1, and the electric circuit portion E1 including through holes 8 for fitting engagement with the protrusions 4 are produced individually. An optical element 11 is mounted on the electric circuit portion E1. Thereafter, an inspection is performed to verify the mounting state of the optical element 11. When the appropriate mounting is verified, the through holes 8 in the electric circuit portion E1 are brought into fitting engagement with the protrusions 4 for the positioning of the electric circuit portion E1, whereby the electric circuit portion E1 with the optical element 11 mounted thereon and the optical waveguide portion W1 are integrated with each.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: November 8, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Patent number: 8055113
    Abstract: An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: November 8, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Hodono, Kunio Nagasaki, Miho Yamaguchi, Shinji Inokuchi
  • Patent number: 8055112
    Abstract: An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.
    Type: Grant
    Filed: September 7, 2010
    Date of Patent: November 8, 2011
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Hodono, Kunio Nagasaki, Miho Yamaguchi, Shinji Inokuchi
  • Publication number: 20110216995
    Abstract: A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide unit and an optical element in a substrate unit and which does not reduce the accuracy of alignment, and an optical sensor module obtained thereby. An optical waveguide unit including protruding portions having vertical walls with a height less than 50 ?m and groove portions, and a substrate unit including positioning members of respective positioning plate portions to be positioned in the protruding portions and fitting plate portions for fitting engagement with the groove portions are individually produced. Corners of the positioning members are positioned on the vertical walls of the protruding portions, and the fitting plate portions are brought into fitting engagement with the groove portions whereby the substrate unit and the optical waveguide unit are integrated together.
    Type: Application
    Filed: March 4, 2011
    Publication date: September 8, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Patent number: 7995881
    Abstract: An opto-electric hybrid module capable of reducing the propagation loss of light beams, and a manufacturing method thereof. An opto-electric hybrid module in which a light-emitting element and a light-receiving element are mounted on the front surface side of an electric circuit board E, and an optical waveguide W1 is bonded to the back surface side thereof. The optical waveguide W1 includes a core having opposite end portions formed as light reflection portions. Portions of the core near the opposite end portions are formed as extensions extending from the light reflection portions toward the light-emitting element and the light-receiving element. The extensions and are positioned in through holes for light propagation formed in the electric circuit board E, and have distal end surfaces and in face-to-face relationship with a light-emitting portion of the light-emitting element and a light-receiving portion of the light-receiving element, respectively.
    Type: Grant
    Filed: May 27, 2009
    Date of Patent: August 9, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Publication number: 20110135250
    Abstract: A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W1 including protrusions 4 for the positioning of an electric circuit portion E1, and the electric circuit portion E1 including through holes 8 for fitting engagement with the protrusions 4 are produced individually. An optical element 11 is mounted on the electric circuit portion E1. Thereafter, an inspection is performed to verify the mounting state of the optical element 11. When the appropriate mounting is verified, the through holes 8 in the electric circuit portion E1 are brought into fitting engagement with the protrusions 4 for the positioning of the electric circuit portion E1, whereby the electric circuit portion E1 with the optical element 11 mounted thereon and the optical waveguide portion W1 are integrated with each.
    Type: Application
    Filed: February 4, 2011
    Publication date: June 9, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Publication number: 20110085758
    Abstract: A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section and which achieves improvement in alignment accuracy and reduction in costs, and an optical sensor module obtained thereby. An optical waveguide section W2 including protruding portions 4 for the positioning of a substrate section and groove portions 3b for fitting engagement with the substrate section, and a substrate section E2 including positioning plate portions 5a to be positioned in the protruding portions 4 and fitting plate portions 5b for fitting engagement with the groove portions 3b are individually produced.
    Type: Application
    Filed: October 8, 2010
    Publication date: April 14, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Patent number: 7912332
    Abstract: A manufacturing method of an optical waveguide device which is capable of easily and precisely aligning the optical axis of a light receiving and emitting element and the optical axis of an optical waveguide and capable of shortening manufacturing time, and to provide an optical waveguide device obtained thereby. An under cladding layer 11 is formed on an upper surface of a substrate 10. A core layer 16 is formed on an upper surface of the under cladding layer 11. Horizontal alignment guides 17 made of the same material as the above-mentioned core layer 16 are formed on the above-mentioned substrate 10. A light emitting element 19 is installed on the substrate 10 along the horizontal alignment guides 17.
    Type: Grant
    Filed: November 6, 2008
    Date of Patent: March 22, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Publication number: 20110064354
    Abstract: An opto-electric hybrid module capable of shortening the distance between a light-emitting section or a light-receiving section of a semiconductor chip and a reflecting surface formed in a core to reduce optical losses between an opto-electric conversion substrate section and an optical waveguide section, and a method of manufacturing the same. A recessed portion (3a) is formed in a surface of an over cladding layer (3) of the optical waveguide section (W1). At least part of the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) for opto-electric conversion and at least part of a loop portion (8a) of a bonding wire (8) in the opto-electric conversion substrate section (E1) are positioned within the recessed portion (3a). This brings the light-emitting section (7a) or the light-receiving section of the semiconductor chip (7) and the reflecting surface (2a) formed in the core (2) closer to each other.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 17, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hajime NISHIO, Masayuki HODONO
  • Patent number: 7906355
    Abstract: An optical waveguide device production method which ensures that a receptacle structure can be easily and highly accurately produced in a single step, an optical waveguide device produced by the method, and an optical waveguide connection structure to be used for the optical waveguide device. The optical waveguide device includes a light emitting element (21) mounted on an upper surface of a board (20), and a core layer (29) which seals the light emitting element (21). The core layer (29) has an optical waveguide insertion recess (25) and an optical coupling lens (27) unitarily formed in a portion thereof opposed to a light emitting surface of the light emitting element (21). One end of an optical waveguide (30) is inserted in the recess (25) and fixed by a sealing resin (31). Thus, the optical waveguide (30) is optically coupled with a light emitting/receiving point of the light emitting element (21) in the core layer (29).
    Type: Grant
    Filed: November 18, 2008
    Date of Patent: March 15, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Patent number: 7907803
    Abstract: A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W1 including protrusions 4 for the positioning of an electric circuit portion E1, and the electric circuit portion E1 including through holes 8 for fitting engagement with the protrusions 4 are produced individually. An optical element 11 is mounted on the electric circuit portion E1. Thereafter, an inspection is performed to verify the mounting state of the optical element 11. When the appropriate mounting is verified, the through holes 8 in the electric circuit portion E1 are brought into fitting engagement with the protrusions 4 for the positioning of the electric circuit portion E1, whereby the electric circuit portion E1 with the optical element 11 mounted thereon and the optical waveguide portion W1 are integrated with each.
    Type: Grant
    Filed: April 6, 2010
    Date of Patent: March 15, 2011
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono
  • Publication number: 20110026873
    Abstract: A method of manufacturing an optical sensor module which eliminates the need for the operation of alignment between a core in an optical waveguide section and an optical element in a substrate section, and an optical sensor module obtained thereby. An optical waveguide section W1 including groove portions (fitting portions) 4a for the positioning of a substrate section, and a substrate section E1 including fitting plate portions (to-be-fitted portions) 5a for fitting engagement with the groove portions 4a are individually produced. The fitting plate portions 5a in the substrate section E1 are brought into fitting engagement with the groove portions 4a in the optical waveguide section W1 whereby the substrate section E1 and the optical waveguide section W1 are integrated together.
    Type: Application
    Filed: July 30, 2010
    Publication date: February 3, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Publication number: 20110008010
    Abstract: An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.
    Type: Application
    Filed: September 7, 2010
    Publication date: January 13, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki Hodono, Kunio Nagasaki, Miho Yamaguchi, Shinji Inokuchi
  • Publication number: 20110005677
    Abstract: An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.
    Type: Application
    Filed: September 7, 2010
    Publication date: January 13, 2011
    Applicant: Nitto Denko Corporation
    Inventors: Masayuki Hodono, Kunio Nagasaki, Miho Yamaguchi, Shinji Inokuchi
  • Patent number: 7856165
    Abstract: An optical waveguide film includes a film including a clad layer and a core layer covered by the clad layer; and an adhesive layer formed at least on one surface of the film, having a rough structured surface having an arithmetic mean surface roughness of 0.1 to 2.0 ?m, and having a storage modulus at 25° C. of 10 to 100 MPa obtained by dynamic viscoelastic measurement in torsion mode with a frequency of 1 Hz.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: December 21, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Takami Hikita, Masayuki Hodono, Kunio Nagasaki
  • Patent number: 7822308
    Abstract: An optical waveguide film includes a clad layer having an adhesive function; and a core layer covered by the clad layer.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: October 26, 2010
    Assignee: Nitto Denko Corporation
    Inventors: Masayuki Hodono, Kunio Nagasaki, Miho Yamaguchi, Shinji Inokuchi
  • Publication number: 20100254666
    Abstract: A manufacturing method of an opto-electric hybrid module which is capable of suppressing losses in cost, and an opto-electric hybrid module obtained thereby. An optical waveguide portion W1 including protrusions 4 for the positioning of an electric circuit portion E1, and the electric circuit portion E1 including through holes 8 for fitting engagement with the protrusions 4 are produced individually. An optical element 11 is mounted on the electric circuit portion E1. Thereafter, an inspection is performed to verify the mounting state of the optical element 11. When the appropriate mounting is verified, the through holes 8 in the electric circuit portion E1 are brought into fitting engagement with the protrusions 4 for the positioning of the electric circuit portion E1, whereby the electric circuit portion E1 with the optical element 11 mounted thereon and the optical waveguide portion W1 are integrated with each.
    Type: Application
    Filed: April 6, 2010
    Publication date: October 7, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Publication number: 20100209054
    Abstract: An opto-electric hybrid module capable of achieving the reduction in distance between an optical element and a core end portion to improve the efficiency of light coupling therebetween, and a method of manufacturing the same are provided. The opto-electric hybrid module includes an optical waveguide section, an electric circuit section, and a light-emitting element (7) and a light-receiving element (8) both mounted on the electric circuit section. The optical waveguide section includes an under cladding layer (1), a linear core (2) for an optical path, the core being formed on a surface of the under cladding layer (1), and an over cladding layer (3) formed on the surface of the under cladding layer (1) and covering the core (2). An electric circuit (4) is formed on a surface portion of the under cladding layer (1) except where the core (2) is formed.
    Type: Application
    Filed: February 2, 2010
    Publication date: August 19, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventor: Masayuki Hodono
  • Patent number: 7760981
    Abstract: A method of manufacturing optical waveguide device, comprising steps of: preparing optical waveguide including under cladding layer and protruding core pattern formed on the under cladding layer; preparing mold having protrusions for shaping recesses for fitting with predetermined portions of the core pattern; preparing board provided with light-receiving/emitting element mounted thereon; placing the mold around the light-receiving/emitting element for positioning top surfaces of the protrusions of the mold over light-receiving/emitting portions of the light-receiving/emitting element; filling the mold with sealing resin material and hardening the material in the mold to form sealing resin layer having recesses for fitting with the core pattern; after removing the sealing resin layer from the mold, the core pattern are fitted with the recesses of the resin layer to optically couple the light-receiving/emitting portions and the optical waveguide; and forming an over cladding layer for covering the remaining po
    Type: Grant
    Filed: January 22, 2009
    Date of Patent: July 20, 2010
    Assignee: Nitto Denko Corporation
    Inventor: Masayuki Hodono