Patents by Inventor Masayuki Ishiwa
Masayuki Ishiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7283636Abstract: The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.Type: GrantFiled: February 28, 2003Date of Patent: October 16, 2007Assignee: The Furukawa Electric Co., Ltd.Inventors: Takeshi Nishimura, Kenji Iizuka, Masayuki Ishiwa, Shigeo Yamaguchi, Tsutomu Yokoyama, Masaaki Arahori, Hideharu Yonehara, Hiroshi Ikeda, Sadaaki Sakurai
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Publication number: 20050152577Abstract: The present invention provides a planer acoustic transducer including a vibrating diaphragm including a spiral voice coil provided on both surfaces or on one surface of an insulating base film; and a permanent magnet corresponding to the voice coil, wherein, in the vibrating diaphragm, the spiral voice coil is formed by applying a wire conductor, in a coil pattern, onto a sheet-like substrate having an adhesive layer on at least one surface thereof. Alternatively, at least a portion of the vibrating diaphragm, which portion corresponds to the loop of a first or second vibration mode, is reinforced with a rigidity-imparting member; the substrate of the vibrating diaphragm is formed of a resin foam; or the voice coil is formed three-dimensionally.Type: ApplicationFiled: February 28, 2003Publication date: July 14, 2005Applicant: The FURUKAWA ELECTRIC CO., LTD.Inventors: Takeshi Nishimura, Kenji Iizuka, Masayuki Ishiwa, Shigeo Yamaguchi, Tsutomu Yokoyama, Masaaki Arahori, Hideharu Yonehara, Hiroshi Ikeda, Sadaaki Sakurai
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Patent number: 6917345Abstract: A small antenna comprises an antenna conductor, and a dielectric chip formed at surroundings of the antenna conductor by a plurality of resin moldings.Type: GrantFiled: December 21, 2001Date of Patent: July 12, 2005Assignee: The Furukawa Electric Co., Ltd.Inventors: Hiroki Hamada, Yoshikazu Kamei, Masayuki Ishiwa, Isao Tomomatsu, Takahiro Ueno, Shinji Satoh
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Patent number: 6720924Abstract: An antenna apparatus comprises a substrate, a chip antenna mounted on the substrate, and a ground pattern disposed on the substrate, at least a portion on the side of a power supply terminal of an antenna conductor in the chip antenna being overlapped with the ground pattern.Type: GrantFiled: February 5, 2002Date of Patent: April 13, 2004Assignees: The Furukawa Electric Co., Ltd., Sony CorporationInventors: Isao Tomomatsu, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki, Masayuki Ishiwa
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Patent number: 6686406Abstract: A dielectric ceramic containing Bi, Zn, and Sr as constituent elements. A resin-ceramic composite material containing a mixture of the dielectric ceramic powder and an organic polymer resin. An antenna and an electrical part using the composite material, and a manufacturing method thereof.Type: GrantFiled: December 10, 2001Date of Patent: February 3, 2004Assignee: The Furukawa Electric Co., Ltd.Inventors: Isao Tomomatsu, Masayuki Ishiwa
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Patent number: 6653572Abstract: A multilayer circuit board formed by integrally laminating a plurality of printed wiring boards in a multilayer structure so as to provide air gaps therebetween. An insulating layer is formed on each of both surfaces of a metal core substrate having through-hole forming apertures and a printed wiring layer is formed on the each insulating layer. Metal projections integrally formed on the metal core substrate serve as bonding electrodes between the adjacent wiring boards in the multilayer structure. The width of the air gap provided between the adjacent wiring boards is determined by the height of the metal projections.Type: GrantFiled: February 7, 2001Date of Patent: November 25, 2003Assignee: The Furukawa Electric Co., Ltd.Inventors: Masayuki Ishiwa, Kenji Iizuka, Takeshi Nishimura
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Patent number: 6642907Abstract: An antenna device includes a dielectric chip fitted to an aperture formed in an exterior casing of a terminal unit and having an outer surface thereof cooperating with an outer surface to form part of an outer surface of the terminal unit, and an antenna conductor embedded into the dielectric chip and disposed at a vertical position sufficiently far from a grounding conductor of a printed circuit board in the exterior casing.Type: GrantFiled: January 9, 2002Date of Patent: November 4, 2003Assignee: The Furukawa Electric Co., Ltd.Inventors: Hiroki Hamada, Masayuki Ishiwa
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Patent number: 6630906Abstract: A chip antenna comprises an antenna conductor, and a dielectric chip which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.Type: GrantFiled: July 20, 2001Date of Patent: October 7, 2003Assignees: The Furukawa Electric Co., Ltd., Sony CorporationInventors: Isao Tomomatsu, Masayuki Ishiwa, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki
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Patent number: 6630911Abstract: A compact antenna comprises a core which is a hard linear member having a predetermined shape corresponding to resonance characteristic, a conductor film which covers at least a portion of an outer surface of the core and which has higher electric conductivity than that of the core, and a substrate which closely surrounds and holds the outer surface of the core covered with the connection film. A film thickness of the conductor film is equal to a skin depth and thus, it is possible to inexpensively maintain reliability, and to prevent radiation efficiency from being lowered.Type: GrantFiled: December 17, 2001Date of Patent: October 7, 2003Assignee: The Furukawa Electric Co., Ltd.Inventors: Yoshikazu Kamei, Takanori Washiro, Hiroki Hamada, Takahiro Ueno, Masayuki Ishiwa
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Patent number: 6593847Abstract: This invention provides a planar acoustic converting apparatus including a support having a flat plate portion, a diaphragm which has an insulating base film having a liquid crystalline polymer film and being opposed to the flat plate portion of the support and at least one spiral coil provided on one major surface or both major surfaces of the insulating base film, at least one permanent magnet supported by the support and opposing a magnetic pole to the diaphragm, and a holding portion provided to the support and holding the diaphragm such that the diaphragm can vibrate and is positioned apart from the at least one permanent magnet.Type: GrantFiled: May 10, 2001Date of Patent: July 15, 2003Assignees: The Furukawa Electric Co., Ltd., FPS, Inc.Inventors: Toshiiku Miyazaki, Masashi Hori, Takeshi Nishimura, Kenji Iizuka, Masayuki Ishiwa
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Publication number: 20020149538Abstract: An antenna apparatus comprises a substrate, a chip antenna mounted on the substrate, and a ground pattern disposed on the substrate, at least a portion on the side of a power supply terminal of an antenna conductor in the chip antenna being overlapped with the ground pattern.Type: ApplicationFiled: February 5, 2002Publication date: October 17, 2002Inventors: Isao Tomomatsu, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki, Masayuki Ishiwa
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Publication number: 20020105479Abstract: A small antenna comprises an antenna conductor, and a dielectric chip formed at surroundings of the antenna conductor by a plurality of resin moldings.Type: ApplicationFiled: December 21, 2001Publication date: August 8, 2002Inventors: Hiroki Hamada, Yoshikazu Kamei, Masayuki Ishiwa, Isao Tomomatsu, Takahiro Ueno, Shinji Satoh
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Publication number: 20020104681Abstract: A multilayer circuit board formed by integrally laminating a plurality of printed wiring boards in a multilayer structure so as to provide air gaps therebetween. An insulating layer is formed on each of both surfaces of a metal core substrate having through-hole forming apertures and a printed wiring layer is formed on the each insulating layer. Metal projections integrally formed on the metal core substrate serve as bonding electrodes between the adjacent wiring boards in the multilayer structure. The width of the air gap provided between the adjacent wiring boards is determined by the height of the metal projections.Type: ApplicationFiled: February 7, 2001Publication date: August 8, 2002Inventors: Masayuki Ishiwa, Kenji Iizuka, Takeshi Nishimura
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Publication number: 20020098970Abstract: A dielectric ceramic containing Bi, Zn, and Sr as constituent elements. A resin-ceramic composite material containing a mixture of the dielectric ceramic powder and an organic polymer resin. An antenna and an electrical part using the composite material, and a manufacturing method thereof.Type: ApplicationFiled: December 10, 2001Publication date: July 25, 2002Inventors: Isao Tomomatsu, Masayuki Ishiwa
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Publication number: 20020093457Abstract: An antenna device includes a dielectric chip fitted to an aperture formed in an exterior casing of a terminal unit and having an outer surface thereof cooperating with an outer surface to form part of an outer surface of the terminal unit, and an antenna conductor embedded into the dielectric chip and disposed at a vertical position sufficiently far from a grounding conductor of a printed circuit board in the exterior casing.Type: ApplicationFiled: January 9, 2002Publication date: July 18, 2002Inventors: Hiroki Hamada, Masayuki Ishiwa
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Publication number: 20020080076Abstract: A compact antenna comprises a core which is a hard linear member having a predetermined shape corresponding to resonance characteristic, a conductor film which covers at least a portion of an outer surface of the core and which has higher electric conductivity than that of the core, and a substrate which closely surrounds and holds the outer surface of the core covered with the connection film. A film thickness of the conductor film is equal to a skin depth and thus, it is possible to inexpensively maintain reliability, and to prevent radiation efficiency from being lowered.Type: ApplicationFiled: December 17, 2001Publication date: June 27, 2002Inventors: Yoshikazu Kamei, Takanori Washiro, Hiroki Hamada, Takahiro Ueno, Masayuki Ishiwa
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Publication number: 20020075186Abstract: A chip antenna comprises an antenna element, and a dielectric chip having the antenna element buried therein or stacked on a surface thereof. Particularly, the dielectric chip has a space area, for example, a flute for forming an air layer on an underside (in a surface not in contact with the antenna element). By varying the size of the flute, the antenna characteristic is tuned while consistently maintaining the outer dimensions of the chip antenna and a mounting height for the antenna element.Type: ApplicationFiled: December 14, 2001Publication date: June 20, 2002Inventors: Hiroki Hamada, Yoshikazu Kamei, Masayuki Ishiwa
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Publication number: 20020027530Abstract: A chip antenna comprises an antenna conductor, and a dielectric chip which stacks on a portion of the antenna conductor, in which a conductor exposed portion of the antenna conductor which is not overlapped on the dielectric chip is bent along the surface of the dielectric chip.Type: ApplicationFiled: July 20, 2001Publication date: March 7, 2002Inventors: Isao Tomomatsu, Masayuki Ishiwa, Takahiro Ueno, Toshiyuki Imagawa, Minoru Oozeki
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Patent number: 6347890Abstract: An optical ferrule is a molding of a resin composition comprising a base resin, silica, and whisker, as essential components. The resin composition has a melt viscosity of 300 to 600 [Pa×sec.] when measured at a shear rate of 900 [1/sec.] at a temperature of 340° C. by using a capillary having a diameter of 0.1 mm and a depth of 30 mm as defined by JIS-K-7199. Preferably, the base resin is a linear polyphenylene sulfide resin, and 250 to 300 parts by weight of silica and 10 to 70 parts by weight of whisker are blended with 100 parts by weight of the linear polyphenylene sulfide resin.Type: GrantFiled: December 20, 2000Date of Patent: February 19, 2002Assignee: Furakawa Electric Co., Ltd.Inventors: Takahiro Ueno, Koichi Maeno, Masayuki Ishiwa, Katsuki Suematsu
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Publication number: 20010048256Abstract: This invention provides a planar acoustic converting apparatus including a support having a flat plate portion, a diaphragm which has an insulating base film having a liquid crystalline polymer film and being opposed to the flat plate portion of the support and at least one spiral coil provided on one major surface or both major surfaces of the insulating base film, at least one permanent magnet supported by the support and opposing a magnetic pole to the diaphragm, and a holding portion provided to the support and holding the diaphragm such that the diaphragm can vibrate and is positioned apart from the at least one permanent magnet.Type: ApplicationFiled: May 10, 2001Publication date: December 6, 2001Inventors: Toshiiku Miyazaki, Masashi Hori, Takeshi Nishimura, Kenji Iizuka, Masayuki Ishiwa