Patents by Inventor Masayuki Ishiwa

Masayuki Ishiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20010019646
    Abstract: An optical ferrule is a molding of a resin composition comprising a base resin, silica, and whisker, as essential components. The resin composition has a melt viscosity of 300 to 600 [Pa×sec.] when measured at a shear rate of 900 [1/sec.] at a temperature of 340° C. by using a capillary having a diameter of 0.1 mm and a depth of 30 mm as defined by JIS-K-7199. Preferably, the base resin is a linear polyphenylene sulfide resin, and 250 to 300 parts by weight of silica and 10 to 70 parts by weight of whisker are blended with 100 parts by weight of the linear polyphenylene sulfide resin.
    Type: Application
    Filed: December 20, 2000
    Publication date: September 6, 2001
    Inventors: Takahiro Ueno, Koichi Maeno, Masayuki Ishiwa, Katsuki Suematsu
  • Patent number: 4868047
    Abstract: An injection molding resin-type printed wiring board having an electric circuit pattern layer formed integrally on the surface thereof and having reduced warpage. In the printed circuit board, the injection molding resin includes a thermoplastic resin composition essentially comprising polyethylene terephthalate and containing a flaky inorganic reinforcing material. The inorganic reinforcing material comprises single-substance fine mica flakes or a mixture of fine mica flakes and short glass fibers.
    Type: Grant
    Filed: February 19, 1988
    Date of Patent: September 19, 1989
    Assignee: Furukawa Denki Kogyo Kabushiki Kaisha
    Inventors: Akira Hasegawa, Masayuki Ishiwa