Abstract: In one embodiment, a separation layer and a wiring layer are formed in order on a supporting substrate. A plurality of semiconductor chips are mounted on the wiring layer. The plural semiconductor chips are collectively sealed by a sealing resin layer. A resin-sealed body is evenly held by a holder. The resin-sealed body is separated from the supporting substrate by shearing the separation layer while being heated. The separated resin-sealed body is cooled while a state of the resin-sealed body being held evenly by the holder is maintained, and then a holding state of the resin-sealed body by the holder is released. The resin-sealed body is cut to singulate a circuit structure body.

Abstract: In a semiconductor device manufacturing method, a first resin layer with optical transmission restrained is formed on a supporting substrate and a second resin layer made of thermoplastic resin is formed on the first resin layer. An insulating layer and a wiring layer are formed on the second resin layer and a first semiconductor chip is mounted on the wiring layer. The supporting substrate is separated by irradiating the first resin layer with a laser beam, and the second resin layer is removed.

Abstract: In one embodiment, a separation layer and a wiring layer are formed in order on a supporting substrate. A plurality of semiconductor chips are mounted on the wiring layer. The plural semiconductor chips are collectively sealed by a sealing resin layer. A resin-sealed body is evenly held by a holder. The resin-sealed body is separated from the supporting substrate by shearing the separation layer while being heated. The separated resin-sealed body is cooled while a state of the resin-sealed body being held evenly by the holder is maintained, and then a holding state of the resin-sealed body by the holder is released. The resin-sealed body is cut to singulate a circuit structure body.

Abstract: There is provided a time division multiplexing transmission system which is capable of increasing the transmission efficiency. The system comprises OLT 10 and ONUs 20 connected to the OLT on a point-to-multipoint basis. The OLT 10 comprises a transmission circuit 11 that transmits a signal to the ONUs 20, a receiving circuit 12 that receives a signal from the ONU, and a transmission and receiving control circuit 13 that controls transmission and reception of a signal by the circuit 11 and the circuit 12. The OLT 10 specifies the transmission speed of an ONU device to be connected with itself, transmits the specified transmission speed to the ONU devices, and changes the settings of the circuit 12 based on that transmission speed. The ONU 20 transmits a response frame to the circuit 12 when the transmission speed transmitted from the circuit 11 agrees with its own transmission speed.

Abstract: The object of the present invention is to provide an optical communication module in which the pin arrangement can be applied flexibly, and an optical communication system in which this optical communication module is used. The present invention provides an optical communication module which has an outer shape formed based on normal standards and which is able to communicate with a host-side circuit board, etc. to which it is fitted, via a predetermined communication interface; wherein the optical communication module exchanges input/output I/F information with the circuit board, etc., and the communication interface can be switched to another communication interface based on these input/output I/F information.

Abstract: According to an embodiment, a separation layer and a wiring layer having an organic insulating film formed of a resin material and a metal wiring are sequentially formed on a support substrate. Regions of the organic insulating film corresponding to dicing regions are removed. Plural semiconductor chips are mounted on the wiring layer. A sealing resin layer is formed on the separation layer. The sealing resin layer is formed to cover edge surfaces of the device forming regions. The support substrate is separated from a resin sealing body having the wiring layer, the plural semiconductor chips and the sealing resin layer. The resin sealing body is cut according to the dicing regions to cingulate a structure configuring a semiconductor device.

Abstract: In one embodiment, a preliminary solder layer made of a Sn alloy is formed on a connecting pad of a wiring substrate. A solder bump made of a Sn alloy is formed on an electrode pad of a semiconductor chip. After contacting the preliminary solder layer and the solder bump, the preliminary solder layer and the solder bump are melted by heating to a temperature of their melting points or higher to form a solder connecting part made of a Sn alloy containing Ag and Cu. Only the preliminary solder layer of the preliminary solder layer and the solder bump is composed of a Sn alloy containing Ag.

Abstract: According to one embodiment, a method of fabricating a semiconductor device is disclosed. The method can include forming a debonding layer constituted with a thermoplastic resin on a supporting material, and forming an insulating layer constituted with a thermosetting resin including a solvent dissolving the thermoplastic resin on the debonding layer.

Abstract: The semiconductor device includes a wiring substrate having connection pads and a semiconductor chip having electrode pads. The semiconductor chip is mounted on the wiring substrate, and the electrode pads are connected to the connection pads via solder bumps. An underfill resin formed of a cured thermosetting resin is filled in a gap between the wiring substrate and the semiconductor chip. The underfill resin has a glass transition temperature which increases accompanying growth of crystal grains of the solder bumps.

Abstract: Without using a component such as a chip coil, a winding pattern is formed with a wire with which a main wiring pattern is formed. This enables to deal with the flexibility by realizing a thin product using a coil antenna. Further, the wiring pattern is designed such that the winding pattern is provided and distributed to the main wiring pattern forming a loop, and is formed with the wire so as to have a wound shape small enough compared with the main wiring pattern. In this way, the ratio of the self-inductance to the mutual inductance is appropriately made further large, so that the mutual inductance is made comparatively small.

Abstract: An optical repeater device of the present invention comprises: a preamble compensating circuit 53, for taking out a normal data signal from burst signals propagating through a communication transmission path, and for adding a preamble signal before and/or after the data signal. Furthermore, the preamble compensating circuit 53 comprises: a detector circuit 53a, for inputting the burst signal, and for outputting only the normal data signal; a buffer circuit 53b, for storing the data signal output from the detector circuit 53a, and for outputting thereof; a preamble signal generation circuit 53d, for outputting at least one type of the preamble signal; and an data output select circuit 53e, for outputting the data signal at the time of the data signal input from the buffer circuit 53b, and for outputting the preamble signal from the preamble signal generation circuit 53d at any other time thereof.

Abstract: An optical transmission system is provided. The optical transmission system includes a user side optical repeater device, a central office side optical repeater device, and wavelength multiplexing and wavelength de-multiplexing functions. The user side optical repeater device is to be connected with a user side optical network unit, transmits data in two ways, and is used for wavelength division multiplexing. The central office side optical repeater device is to be connected with a central office side optical line terminal, transmits data in two ways, and is used for wavelength division multiplexing. The wavelength multiplexing and wavelength de-multiplexing functions are used for relaying between the user side optical repeater device and the central office side optical repeater device.

Abstract: An article of manufacture for use by a player in a game or as a collectible figure, comprising a first portion comprising a representational figure and a second portion affixed to the first portion and comprising a coupling member arranged to be coupled with a preexisting support structure so that a user of the article of manufacture is enabled to couple it with the support structure and uncouple it therefrom.

Abstract: An article of manufacture for use by a player in a game or as a collectible figure, comprising a first portion comprising a representational figure and a second portion affixed to the first portion and comprising a coupling member arranged to be coupled with a preexisting support structure so that a user of the article of manufacture is enabled to couple it with the support structure and uncouple it therefrom.

Abstract: A method for associating detailed data is to aggregate the detailed data by using an aggregation key when detailed data generated in relation to a business is accumulated in a predetermined journal in a format that can identify an aggregation key and segments. The method includes storing the association between the segments as a business pattern; outputting the business pattern to an output unit so as to explicitly show the association between the segments, and associating an input business event name with each segment; outputting the business event name to the output unit and associating an input journal name with the business event name; and outputting the journal name to the output unit and associating an input rule with the journal name, the rule specifying which record in a journal identified by the journal name the detailed data identified by the business event name is.

Abstract: A detailed data storage apparatus creates, when a detailed data database that stores therein detailed data relatint to each stage of a process executed through multiple stages receives detailed data relating to a predetermined stage, forecast detailed data indicating contents predicted for a stage next to a predetermined stage and subsequent stages from the detailed data, and stores the forecast detailed data in the detailed data database. The apparatus includes an order holding unit that orders and holds the multiple stages; a determining unit that determines whether there is a stage immediately previous to the predetermined stage; and an offset detailed-data creating unit that creates offset detailed data including a content for offsetting the forecast detailed data created at the immediately previous stage when the determining unit determines that there is the immediately previous stage, so as to store the offset detailed data in the detailed data database.

Abstract: A detailed data aggregation apparatus holds detailed data of a plurality of events and a transcription and replenishment rule. In the rule, a plurality of common items, which are common to different events as a minimum unit of aggregation, are defined, and a transcription instruction (for instructing to transcribe a value corresponding to an event definition item to a value corresponding to the common item) and a replenishment instruction (for instructing to replenish a value to be replenished as the value corresponding to the common item) are described, associated with each common item for each event. Regarding the held detailed data, transcribed/replenished detailed data including values corresponding to the common items is created from the respective detailed data according to the transcription instruction or replenishment instruction.

Abstract: An optical repeater device of the present invention comprises: a preamble compensating circuit 53, for taking out a normal data signal from burst signals propagating through a communication transmission path, and for adding a preamble signal before and/or after the data signal. Furthermore, the preamble compensating circuit 53 comprises: a detector circuit 53a, for inputting the burst signal, and for outputting only the normal data signal; a buffer circuit 53b, for storing the data signal output from the detector circuit 53a, and for outputting thereof; a preamble signal generation circuit 53d, for outputting at least one type of the preamble signal; and an data output select circuit 53e, for outputting the data signal at the time of the data signal input from the buffer circuit 53b, and for outputting the preamble signal from the preamble signal generation circuit 53d at any other time thereof.

Abstract: A noncontact information medium includes a coil formed by a conductor, a capacitor that forms a resonance circuit together with the coil, an IC chip that controls information transmitted to and received from a reader-writer. The coil has a cutoff part formed by cutting off at least a part of the conductor.

Abstract: An article of manufacture for use by a player in a game or as a collectible figure, comprising a first portion comprising a representational figure and a second portion affixed to the first portion and comprising a coupling member arranged to be coupled with a preexisting support structure so that a user of the article of manufacture is enabled to couple it with the support structure and uncouple it therefrom.