Abstract: Disclosed herein are curable compositions comprising an epoxide-functional polymer and a curing agent that reacts with the epoxide-functional polymer that is activatable by an external energy source. The epoxide-functional polymer may be a solid a solid epoxide-functional polyurethane comprising a di-isocyanate. Also disclosed are articles comprising one of the compositions in an at least partially cured state positioned between first and second substrates. Also disclosed are methods of forming an adhesive on a substrate.

Abstract: Disclosed is a coating composition comprising a first component and a second component. The first component comprises a diluent and a carbodiimide present in an amount of no more than 50 percent by weight based on total weight of the coating composition. The second component comprises a curing agent that chemically reacts with the carbodiimide, the curing agent comprising an active hydrogen-containing compound. The coating composition may be an adhesive composition or a sealant composition. Also disclosed is a method for treating a substrate comprising contacting at least a portion of a surface of the substrate with a composition of the present invention. Also disclosed is a substrate comprising a surface at least partially coated with a layer formed from a composition of the present invention. Also disclosed is an article comprising a first substrate and a second substrate and a composition of the present invention positioned between the first and second substrates.

Abstract: The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

Abstract: Disclosed herein are systems for treating a substrate. The system may include a cleaner composition, a deoxidizing composition comprising a Group IVA metal and/or a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0, and/or a seal composition. The system may also include a coating composition. The cleaner composition, deoxidizing composition, and/or seal composition may comprise a homopolymer or a copolymer comprising a phosphorous-containing monomeric subunit m1. Also disclosed is a deoxidizing composition comprising a Group IVA metal and a Group IVB metal and free fluoride and having a pH of 1.0 to 3.0. Also disclosed are methods of treating a substrate. Also disclosed are treated substrates.

Abstract: An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.

Abstract: Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 ?·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Abstract: The present invention is directed toward a composition comprising: an epoxy compound, a polythiol curing agent, and a second curing agent. Also disclosed are methods of treating a substrate with the composition and substrates formed by such methods.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Abstract: Disclosed herein are compositions including (a) a first component comprising (1) an epoxy-adduct that is the reaction product of reactants comprising a first epoxy compound, a polyol, and an anhydride and/or a diacid and (2) a second epoxy compound; (b) rubber particles having a core/shell structure and/or graphenic carbon particles; and (c) a second component that chemically reacts with the first component at ambient or slightly thermal conditions. Also disclosed herein are compositions including (a) an epoxy-capped flexibilizer; (b) a heat-activated latent curing agent; and optionally (c) rubber particles having a core/shell structure and/or graphenic carbon particles; (d) an epoxy/CTBN adduct; and/or (e) an epoxy/dimer acid adduct. The heat-activated latent curing agent may include at least one reaction product of reactants including an epoxy compound and an amine and/or an alkaloid.

Abstract: Disclosed herein is a composition comprising: an epoxy-containing component, elastomeric particles in an amount of greater than 11% by weight to 25% by weight based on total weight of the composition; and a curing component activatable by an external energy source, the curing component comprising at least one guanidine having a D90 particle size of 25 ?m measured by dynamic light scattering. Also disclosed is the composition in an at least partially cured state. Also disclosed is a method for treating a substrate comprising applying the composition to a surface of a substrate; and applying an external energy source to cure the composition. Also disclosed are substrates comprising the composition. Also disclosed are substrates formed by the method of the present invention.

Abstract: An imprint mold includes a mesa portion projecting from a base material. The mesa portion includes a contact surface configured for contact with a curable composition made of an organic material, and a surface of a side wall at which the contact surface projects from the base material. A liquid repellent surface is formed on at least the surface of the side wall, the liquid repellent surface having a contact angle with respect to the curable composition being higher than a contact angle of the contact surface. The liquid repellent surface includes at least one type of compound selected from the group consisting of an oxide of an inorganic element, a fluoride of an inorganic element, and a nitride of an inorganic element.

Abstract: Disclosed is a tielayer composition having an epoxy-containing compound, a polythiol curing agent, a curing catalyst, and a solvent present in an amount of at least 25% by weight, based on the total weight of the tielayer composition. Also disclosed is a tielayer comprising the tielayer composition in a cured state. Also disclosed is a coated substrate. The substrate has at least one coatable surface and a tielayer formed from the tielayer composition applied to at least one surface of the substrate and cured thereon. The substrate may be footwear. Also disclosed is a method for forming a bond between two substrates.

Abstract: The present invention is directed toward an adhesive composition comprising: a first component; and a second component that chemically reacts with the first component, the second component comprising: a polythiol curing agent; and an alkanolamine. Also disclosed are methods of forming a bond between two substrates and adhesive bonds.

Abstract: As such, in the disclosure, a slit is formed in a side plate. The slit has an opening in the upper end surface of the side plate. The opening has a width which is smaller than a thickness of the side plate and enables to correspond to a thickness t of the substrate and a length which enables to correspond to a length a of one side of the substrate. An RF antenna module is housed in the slit formed in the side plate of the housing to be accommodated in the housing by inserting the one side of the substrate through the opening of the slit, which is formed in the upper end surface of the side plate, and inserting the substrate into the slit by an amount equal to or larger than a length of another side of the substrate.

Abstract: Disclosed herein is an adhesive composition comprising: an epoxy-containing component; and a blocked polyisocyanate curing agent comprising a blocking group derived from a blocking agent comprising an alpha-hydroxy amide, ester, or thioester, or a combination thereof. Also disclosed are methods for forming a bonded substrate with the adhesive composition. Also disclosed is an article comprising first and second substrates and the adhesive composition.

Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Abstract: Disclosed herein are methods of preparing an aminimide. An epoxy compound is reacted with a hydrazine compound comprising a trivalent nitrogen, and an anhydride functional material or a cyclic compound containing a carbonyl group and at least one heteroatom alpha to the carbonyl group at a temperature greater than 20° C. to form the aminimide. At least one of the epoxy compound and the anhydride functional material or the cyclic compound is polymeric.

Abstract: As such, in the disclosure, a slit is formed in a side plate. The slit has an opening in the upper end surface of the side plate. The opening has a width which is smaller than a thickness of the side plate and enables to correspond to a thickness t of the substrate and a length which enables to correspond to a length a of one side of the substrate. An RF antenna module is housed in the slit formed in the side plate of the housing to be accommodated in the housing by inserting the one side of the substrate through the opening of the slit, which is formed in the upper end surface of the side plate, and inserting the substrate into the slit by an amount equal to or larger than a length of another side of the substrate.