Abstract: The present application relates to a substrate processing method of suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The substrate processing method includes: applying a first filler to the gap between an edge portion of a first substrate and an edge portion of a second substrate; and applying a second filler to the gap between the edge portion of the first substrate and the edge portion of the second substrate after applying of the first filler. A viscosity of the first filler is lower than a viscosity of the second filler.

Abstract: The present application relates to a substrate processing method and a substrate processing apparatus for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: measuring surface shapes of an edge portion of a first substrate and an edge portion of a second substrate; determining an applying condition for the filler to be applied to the laminated substrate based on results of the measuring of the surface shapes; and applying the filler to a gap between the edge portion of the first substrate and the edge portion of the second substrate of the laminated substrate under the determined applying condition.

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, and more particularly to a substrate processing method and a substrate processing apparatus for polishing a bevel portion of the substrate and performing CMP processing of a flat portion of the substrate. The substrate processing method includes: polishing a bevel portion (B) of each of the plurality of substrates (W) by a polishing tool such that slope surfaces(S) of bevel portions (B) of the plurality of substrates (W) have the same slope angles (?); and performing CMP processing of a flat portion (P) of each of the plurality of substrates (W) whose bevel portions (B) have been polished.

Abstract: The present invention relates to a substrate processing apparatus and a substrate processing method for processing a laminated substrate manufactured by bonding a plurality of substrates to each other. The substrate processing apparatus has a filler-application module (300) that applies and cures filler (F) to a gap between peripheral portions of adjacent wafers (W1, W2) in a laminated substrate (Ws), a grinding module (400) that grinds an upper surface of the laminated substrate (Ws) to which the filler (F) has been applied, and a polishing module (500) that polishes an upper surface of the laminated substrate (Ws) that has been ground.

Abstract: The present application relates to a substrate processing apparatus and a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding substrates, and more particularly to a technique of applying a filler to a gap formed between edge portions of the substrates constituting the laminated substrate. The method includes: applying the filler to a gap between an edge portion of the first substrate and an edge portion of the second substrate; curing the applied filler; generating, by an infrared imaging device, an image of an edge portion of the laminated substrate to which the filler is applied; and determining a filling state of the filler applied to the gap between the edge portion of the first substrate and the edge portion of the second substrate based on the image.

Abstract: The present invention relates to a substrate cleaning apparatus and a substrate cleaning method for cleaning a substrate, such as a semiconductor wafer, and more particularly to a substrate cleaning apparatus and a substrate cleaning method for cleaning a periphery of a substrate. A substrate cleaning apparatus (1) includes: a substrate holder (10) configured to hold and rotate a substrate (W); a pressing structure (22) having an internal space (R) and configured to press a cleaning tape (19) against a periphery of the substrate (W); a pressing-structure moving mechanism (30) configured to regulate a position of the pressing structure (22) in a radial direction of the substrate (W); and a pressure regulator (44) configured to regulate pressure in the internal space (R). The pressing structure (22) includes: a hollow support member (24) having an opening (25); and an elastic element (27) configured to support the cleaning tape (19). The elastic element (27) is arranged to close the opening (25).

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Abstract: The present application relates to a substrate processing method for suppressing cracking and chipping of a laminated substrate manufactured by bonding a plurality of substrates. Further, the present application relates to a substrate processing apparatus capable of performing such a substrate processing method. The present method includes: rotating a laminated substrate manufactured by bonding a first substrate and a second substrate; applying a filler, having thermosetting property, to a gap between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and curing the filler. Applying the filler and curing the filler are continuously performed in a same processing chamber.

Abstract: A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

Abstract: One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.

Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.

Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.

Abstract: A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substrate holder 2; and a plurality of circular arc-shaped substrate holding convexities 38, provided on a top surface of the pad main body 37, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body 37, wherein the substrate holding convexities 38 are arranged concentrically with the circular pad main body 37, and width W1 in a radial direction of the substrate holding convexity 38 located on a radially outer side among the plurality of substrate holding convexities 38 is narrower than width W2 in the radial direction of the substrate holding convexity 38 on a radially inner side.

Abstract: A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W, and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

Abstract: To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.

Abstract: A vehicle air-conditioning unit has an air conditioning case and a case interior member. The air conditioning case defines a case passage in which air flows toward a vehicle compartment. The air conditioning case has a recess defining portion that is located in the case passage and defines a recessed portion. The case interior member has a guide portion and a cover. The guide portion guides the air flowing in the case passage. The cover is located in the recessed portion. The cover prevents the air, flowing in the case passage, from flowing into the recessed portion.

Abstract: A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

Abstract: A polishing apparatus capable of accurately detecting a polishing end point of a periphery of a substrate, such as a wafer, is disclosed. The polishing apparatus includes a polishing head configured to press a polishing tool against the periphery of the substrate on a substrate holding surface. The polishing head includes a pressing member configured to press the polishing tool against the periphery of the substrate, and a shear-force detection sensor configured to detect a shear force acting on the pressing member and output an index value indicating a magnitude of the shear force. An operation controller has a memory storing a program configured to determine a polishing end point at which the index value reaches a threshold value, and a processer configured to execute the program.

Abstract: A substrate processing method capable of preventing an adherence of a foreign matter to a substrate is disclosed. The substrate processing method comprises: a substrate rotating step of rotating a substrate W while holding the substrate W; a first-liquid upper supply step of supplying a first liquid onto an upper surface of the substrate W while rotating the substrate W; a polishing step of pressing a polishing tape 23 to the substrate W while supplying the first liquid in a state of rotating the substrate W; a second-liquid upper supply step of supplying a second liquid onto the upper surface of the substrate W while rotating the substrate W; and a cleaning step of pressing a cleaning tape 29 to the substrate W while supplying the second liquid in a state of rotating the substrate W and terminating after the polishing step is terminated. The second liquid is either of a conducting water, a surfactant solution, or ozone water.