Patents by Inventor Masayuki Nakanishi

Masayuki Nakanishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10317713
    Abstract: A producing method includes a bonding process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate, a cut forming process of forming a cut line CL1 on a border portion between the mounting area within the panel surface area and other area on the one substrate of the bonded substrate, a cutting process of cutting the bonded substrate into separated bonded substrate pieces, a grinding process of grinding the substrates in a pair that are outside the thin film pattern in each of the separated bonded substrates 50A along the outline and forming edge surfaces of the display panels each having the curved outline, and a removing process of cutting a part of the one substrate along the cut line and removing the part.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: June 11, 2019
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Masayuki Kanehiro, Youhei Nakanishi
  • Patent number: 10293655
    Abstract: In a straddle type vehicle in which a radiator is covered with a cover member, and an air guide duct for guiding hot air from the radiator to an outside of the vehicle is formed integral with the cover member, the hot air is restrained from staying within the cover member even in the case where the air guide duct of the cover member covering the radiator must be opened face-to-face with only a portion of a core of the radiator. A ventilation control member for controlling cooling air passing through the core of the radiator so as to flow toward an inner opening of the air guide duct is provided in the vicinity of the radiator.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: May 21, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Masayuki Hojo, Ryuichi Nakanishi
  • Publication number: 20190134776
    Abstract: One object is to improve the uniformity of polishing of a substrate. The present application discloses, as one embodiment, a substrate polishing device for a quadrilateral-shaped substrate, the device including: a surface plate; a substrate support mechanism that is attached to the surface plate and that supports the substrate; a polishing head mechanism for attaching a polishing pad, the polishing head mechanism opposing the surface plate; and an orbital drive mechanism for orbitally driving the polishing head mechanism. The substrate support mechanism includes: a base plate; a plate flow passage provided to the base plate; and a plurality of substrate support chambers that are connected to the plate flow passage, wherein each substrate support chamber independently applies a vertical direction force to the substrate, and the vertical direction force applied to the substrate corresponds to an internal pressure of the substrate support chamber.
    Type: Application
    Filed: November 6, 2018
    Publication date: May 9, 2019
    Inventors: Masayuki NAKANISHI, Kenji KODERA
  • Publication number: 20190118335
    Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.
    Type: Application
    Filed: October 17, 2018
    Publication date: April 25, 2019
    Inventors: Kenichi KOBAYASHI, Masayuki NAKANISHI, Makoto KASHIWAGI, Manao HOSHINA
  • Publication number: 20190054594
    Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
    Type: Application
    Filed: June 8, 2018
    Publication date: February 21, 2019
    Applicant: Ebara Corporation
    Inventors: Masayuki NAKANISHI, Yu ISHII, Kenya ITO, Keisuke UCHIYAMA, Makoto KASHIWAGI
  • Patent number: 10166647
    Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: January 1, 2019
    Assignee: EBARA CORPORATION
    Inventors: Tamami Takahashi, Masaya Seki, Hiroaki Kusa, Kenji Yamaguchi, Masayuki Nakanishi
  • Publication number: 20180286772
    Abstract: A vacuum suction pad capable of making it more difficult to separate a substrate when the substrate is held by vacuum suction, the vacuum suction pad 8 including: a pad main body 37 having a lower surface adhered to a stage 5 of a substrate holder 2; and a plurality of circular arc-shaped substrate holding convexities 38, provided on a top surface of the pad main body 37, for holding a substrate W attracted by vacuum suction to the top surface of the pad main body 37, wherein the substrate holding convexities 38 are arranged concentrically with the circular pad main body 37, and width W1 in a radial direction of the substrate holding convexity 38 located on a radially outer side among the plurality of substrate holding convexities 38 is narrower than width W2 in the radial direction of the substrate holding convexity 38 on a radially inner side.
    Type: Application
    Filed: March 29, 2018
    Publication date: October 4, 2018
    Inventors: Satoru YAMAMOTO, Masayuki NAKANISHI, Kenji KODERA
  • Publication number: 20180254196
    Abstract: A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.
    Type: Application
    Filed: March 1, 2018
    Publication date: September 6, 2018
    Inventors: Yu ISHII, Kenya ITO, Keisuke UCHIYAMA, Masayuki NAKANISHI
  • Patent number: 10016875
    Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.
    Type: Grant
    Filed: May 24, 2016
    Date of Patent: July 10, 2018
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Hiroyuki Kawasaki, Masayuki Nakanishi, Kenya Ito
  • Publication number: 20180169820
    Abstract: A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.
    Type: Application
    Filed: December 12, 2017
    Publication date: June 21, 2018
    Inventors: Masayuki NAKANISHI, Kenji KODERA, Yasuyuki MIYASAWA
  • Patent number: 9983524
    Abstract: A fixing portion is provided with a fixing roller, a heating roller having a heat source, a fixing belt stretched between the fixing roller and the heating roller, and a pressurizing roller that is brought into pressure contact with the fixing roller across the fixing belt and forms a nip portion into which a sheet of paper is conveyed between the fixing belt and the pressurizing roller. The fixing portion is further provided with a pad that has a contact surface portion in contact with the inner peripheral surface of the fixing belt, and a biasing member that biases the pad in a direction in which the contact surface portion is brought into pressure contact with the inner peripheral surface of the fixing belt. The pad is configured so as to pivot about the rotating shaft of the heating roller.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: May 29, 2018
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Kousuke Namisaki, Masayuki Nakanishi, Masatsugu Ohishi
  • Publication number: 20180133861
    Abstract: To provide a polishing apparatus capable of polishing bevel portions of varying shape by selecting a suitable polishing recipe, based on a state before polishing. The polishing apparatus 100 comprises: a holding/polishing unit 102 for holding and polishing a workpiece W1; and an identifying unit 104 for identifying data 104a associated with a state of the peripheral portion of the substrate W1 before polishing. The holding/polishing unit 102 comprises: a holder 106 for holding and rotating the substrate W1; and a polisher 108 for polishing the peripheral portion of the substrate W1 by pressing a polishing member against the peripheral portion. A polishing-condition determiner 110 determines a polishing condition, based on data 104a indicating to which type, of a plurality of shape-related types, the shape of a given peripheral portion belongs.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 17, 2018
    Inventors: Masayuki NAKANISHI, Toshifumi WATANABE, Kenji KODERA
  • Publication number: 20180029441
    Abstract: A vehicle air-conditioning unit has an air conditioning case and a case interior member. The air conditioning case defines a case passage in which air flows toward a vehicle compartment. The air conditioning case has a recess defining portion that is located in the case passage and defines a recessed portion. The case interior member has a guide portion and a cover. The guide portion guides the air flowing in the case passage. The cover is located in the recessed portion. The cover prevents the air, flowing in the case passage, from flowing into the recessed portion.
    Type: Application
    Filed: April 8, 2016
    Publication date: February 1, 2018
    Inventor: Masayuki NAKANISHI
  • Publication number: 20180015508
    Abstract: An apparatus which can polish an entirety of a surface of a substrate, such as a wafer, is disclosed. The apparatus includes a substrate holder configured to hold a substrate and rotate the substrate; and a polishing head configured to rub a polishing tool against a first surface of the substrate to polish the first surface. The substrate holder includes a plurality of rollers which can contact a periphery of the substrate. The plurality of rollers are rotatable about their respective own axes.
    Type: Application
    Filed: July 12, 2017
    Publication date: January 18, 2018
    Inventors: Yu ISHII, Masayuki NAKANISHI, Keisuke UCHIYAMA
  • Patent number: 9808903
    Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.
    Type: Grant
    Filed: January 29, 2014
    Date of Patent: November 7, 2017
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Masayuki Nakanishi, Tetsuji Togawa
  • Publication number: 20170168438
    Abstract: A fixing portion is provided with a fixing roller, a heating roller having a heat source, a fixing belt stretched between the fixing roller and the heating roller, and a pressurizing roller that is brought into pressure contact with the fixing roller across the fixing belt and forms a nip portion into which a sheet of paper is conveyed between the fixing belt and the pressurizing roller. The fixing portion is further provided with a pad that has a contact surface portion in contact with the inner peripheral surface of the fixing belt, and a biasing member that biases the pad in a direction in which the contact surface portion is brought into pressure contact with the inner peripheral surface of the fixing belt. The pad is configured so as to pivot about the rotating shaft of the heating roller.
    Type: Application
    Filed: December 12, 2016
    Publication date: June 15, 2017
    Inventors: Kousuke NAMISAKI, Masayuki NAKANISHI, Masatsugu OHISHI
  • Patent number: D834075
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: November 20, 2018
    Assignee: EBARA CORPORATION
    Inventors: Kenji Kamimura, Masayuki Nakanishi, Satoru Yamamoto, Yasuyuki Miyasawa, Kenji Kodera
  • Patent number: D851140
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: June 11, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kenji Kamimura, Masayuki Nakanishi, Satoru Yamamoto, Yasuyuki Miyasawa, Kenji Kodera
  • Patent number: D851141
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: June 11, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kenji Kamimura, Masayuki Nakanishi, Satoru Yamamoto, Yasuyuki Miyasawa, Kenji Kodera
  • Patent number: D851142
    Type: Grant
    Filed: August 14, 2018
    Date of Patent: June 11, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kenji Kamimura, Masayuki Nakanishi, Satoru Yamamoto, Yasuyuki Miyasawa, Kenji Kodera