Abstract: The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The present invention relates to a polishing apparatus for removing surface roughness produced at a peripheral portion of a substrate, or for removing a film formed on a peripheral portion of a substrate. The polishing apparatus includes a housing (3) for forming a polishing chamber (2) therein, a rotational table (1) for holding and rotating a substrate (W), a polishing tape supply mechanism (6) for supplying a polishing tape (5) into the polishing chamber (2) and supplied to the polishing chamber (2), a polishing head (35) for pressing the polishing tape (5) against a bevel portion of the substrate (W), a liquid supply (50) for supplying a liquid to a front surface and a rear surface of the substrate (W), and a regulation mechanism (16) for making an internal pressure of the polishing chamber (2) being set to be lower than an external pressure of the polishing chamber (2).

Abstract: To provide an order accounting system capable of swiftly performing accounting processing, and of allowing to understand an account state in real time, in the order accounting system, an order input terminal requests an ordering control device to send unsettled data which is account data for which account has not been settled and receives the unsettled data, performs accounting processing based on the unsettled data, and sends, after the accounting processing is performed, the account identification information included in the unsettled data to the ordering control device as settled account identification information.

Abstract: A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: A substrate processing apparatus has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

Abstract: The present invention provides a conductive composition and a conductive paste from which a conductive film having a high conductivity and a low thermal expansion coefficient can be formed. The thermal expansion coefficient of an island fixing type conductive layer 10 is compatible with that of a substrate 12. A cracking of the island fixing type conductive layer 10 or a crack in the substrate 12 due to a difference between these thermal expansion coefficients is suitably inhibited. The thermal expansion coefficient of the island fixing type conductive layer 10 is adjusted by ZWP contained in the range from 10 to 55 (wt %) as a low-expansion filler. Thus, compared with the case where other low-expansion filler is added, the conductivity degradation is inhibited. Accordingly, the island fixing type conductive layer 10 having a high conductivity and a high bonding strength is obtained.

Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.

Abstract: A substrate processing method is used to polish a substrate. The substrate processing method includes rotating a substrate 13 by a motor 12, polishing a first surface of a peripheral portion of the substrate 13 by pressing a polishing surface of a polishing mechanism 20 against the first surface, determining a polishing end point of the first surface by monitoring a polished state of the first surface, stopping the polishing according to the determining the polishing end point, determining a polishing time spent for the polishing, determining a polishing time for a second surface of the peripheral portion based on the polishing time of the first surface, and polishing the second surface for the determined polishing time.

Abstract: The present invention provides various services for a mobile communication network (100) or an IP network (200), by processing necessary information suitably in accordance with a service type so as to exchange the information to a service control device (20) and transmitting the results of the service process by the service control device (20) to the mobile communication network (100) or the IP network (200), for a service request from the mobile communication network (100) or the IP network (200).

Abstract: Vacuum heat insulator comprising a laminated core made of a plurality of sheets of inorganic fibers having 10 ?m or smaller in diameter and a certain composition including SiO2 as a main component, Al2O3, CaO, and MgO, a gas barrier enveloping member, and an absorbent. The vacuum heat insulator is characterized by having at least one groove formed therein after fabrication of the vacuum heat insulator. Further, the vacuum heat insulator is characterized by using inorganic fiber core of which a peak of distribution in fiber diameter lies between 1 ?m or smaller and 0.1 ?m or larger, and not containing binding material for binding the fiber material. Electronic apparatuses use the vacuum heat insulator. With use of the vacuum heat insulator, electronic and electric apparatuses superior in energy saving and not to present uncomfortable feeling to the user can be provided.

Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on the peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate such as a semiconductor wafer and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and making a relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and making a relative movement between the polishing tape and the substrate to polish the bevel portion of the substrate.

Abstract: A substrate processing apparatus according to the present invention has a polishing tape and a polishing head for pressing the polishing tape against a peripheral portion of a semiconductor wafer. The substrate processing apparatus polishes the wafer due to sliding contact of the polishing tape and the wafer. The polishing head has an elastic body for supporting the polishing tape. The substrate processing apparatus has an air cylinder for pressing the polishing head so that the elastic body of the polishing head presses the polishing tape against the predetermined portion of the wafer under a constant force.

Abstract: Vacuum heat insulator comprising a laminated core made of a plurality of sheets of inorganic fibers having 10 &mgr;m or smaller in diameter and a certain composition including SiO2 as a main component, Al2O3, CaO, and MgO, a gas barrier enveloping member, and an absorbent. The vacuum heat insulator is characterized by having at least one groove formed therein after fabrication of the vacuum heat insulator. Further, the vacuum heat insulator is characterized by using inorganic fiber core of which a peak of distribution in fiber diameter lies between 1 &mgr;m or smaller and 0.1 &mgr;m or larger, and not containing binding material for binding the fiber material. Electronic apparatuses of the present invention use the vacuum heat insulator. With use of the vacuum heat insulator, electronic and electric apparatuses superior in energy saving and not to present uncomfortable feeling to the user can be provided.

Abstract: A mobile communications service control apparatus comprises signal processing means for conducting prescribed signal processing of a packet transmitted from a mobile terminal or preset communications-equipment, information restoring means for restoring information of a layer higher than a transmitted layer of the signal-processed packet, and service providing means for providing a service in accordance with the contents of the restored information.

Abstract: A mobile communications service control apparatus comprises signal processing means for conducting prescribed signal processing of a packet transmitted from a mobile terminal or preset communications-equipment, information restoring means for restoring information of a layer higher than a transmitted layer of the signal-processed packet, and service providing means for providing a service in accordance with the contents of the restored information.

Abstract: An edible microcapsule comprising a core and a capsule wall, wherein the core is an edible hydrophobic substance, the capsule wall is formed by salting-out of a combination of a protein and an edible salt, and transglutaminase is used as a crosslinking agent for hardening (solidifying) the capsule wall, and a food containing the edible microcapsule.

Abstract: An edible microcapsule comprising a core and a capsule wall, wherein the core is an edible hydrophobic substance, the capsule wall is formed by salting-out of a combination of a protein and an edible salt, and transglutaminase is used as a crosslinking agent for hardening (solidifying) the capsule wall, and a food containing the edible microcapsule.

Abstract: An edible microcapsule comprising a core and a capsule wall, wherein the core is an edible hydrophobic substance, the capsule wall is formed by salting-out of a combination of a protein and an edible salt, and transglutaminase is used as a crosslinking agent for hardening (solidifying) the capsule wall, and a food containing the edible microcapsule.

Abstract: An automatic photosensitive material developing machine supplies a solid processing solution to be dissolved according to consumption of processing solution for a silver halide photosensitive material to be treated. The developing machine includes a solid processing solution supplying section for supplying the solid processing solution from a solid processing solution cartridge containing the solid processing solution, and a solid processing solution transferring section for receiving the solid processing solution supplied by the solid processing solution supplying section in a bucket, and for transferring the bucket upward.