Patents by Inventor Masayuki Onishi

Masayuki Onishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10400662
    Abstract: A vehicular heat management device includes a first heat source, a second heat source, a first heat generator, a second heat generator, a heat generator pathway, a first heat source pathway, a second heat source pathway, and a switching portion. The first heat source and the second heat source heat a heat medium. The first heat generator generates heat according to operation. The second heat generator generates heat according to operation. The first heat generator and the second heat generator are provided in the heat generator pathway. The first heat generator is provided in the first heat generator pathway. The second heat generator is provided in the second heat generator pathway. The switching portion switches between a condition where the heat generator pathway is in flowing communication with the first heat generator pathway and a condition where the heat generator pathway is in flowing communication with the second heat generator pathway.
    Type: Grant
    Filed: September 6, 2016
    Date of Patent: September 3, 2019
    Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Norihiko Enomoto, Yoshiki Kato, Masayuki Takeuchi, Koji Miura, Keigo Sato, Kengo Sugimura, Nobuharu Kakehashi, Ikuo Ozawa, Ariel Marasigan, Yoshikazu Shinpo, Yoichi Onishi, Toshio Murata
  • Publication number: 20190236385
    Abstract: An occupant monitoring device is mountable in a vehicle, and configured to monitor one or more occupants riding in the vehicle. The occupant monitoring device includes: a recognizer that recognizes one or more occupants riding in the vehicle; a recognized occupant storage that stores occupant information recognized by the recognizer; a setting storage that stores setting for the one or more occupants, stored in the recognized occupant storage; and a monitor that monitors the one or more occupants riding in the vehicle based on the setting of the setting storage. When the recognizer is unable to identify an occupant by recognition processing, the recognized occupant storage stores guest information which does not identify the occupant, and the monitor monitors a guest who has ridden in the vehicle, based on the setting of the setting storage.
    Type: Application
    Filed: December 3, 2018
    Publication date: August 1, 2019
    Inventors: Ryota Nakamura, Masayuki Marubashi, Keita Onishi
  • Publication number: 20190236388
    Abstract: An occupant monitoring device which is provided in a vehicle, and monitors one or more occupants riding in the vehicle. The occupant monitoring device includes: a recognizer that recognizes one or more occupants riding in the vehicle; a monitor that monitors the one or more occupants riding in the vehicle according to a result of recognition of the one or more occupants by the recognizer; a start controller that individually starts or stops the recognizer and the monitor. The start controller starts the recognizer in a stopped state of the monitor.
    Type: Application
    Filed: December 3, 2018
    Publication date: August 1, 2019
    Inventors: Ryota Nakamura, Masayuki Marubashi, Keita Onishi
  • Publication number: 20190177487
    Abstract: A room temperature curable organopolysiloxane composition for protecting electric/electronic parts is disclosed. The composition comprises: (A) an organopolysiloxane having a viscosity at 25° C. of 20 to 1,000,000 mPa·s and having at least two silicon atom-bonded hydroxyl groups or silicon atom-bonded alkoxy groups in a molecule; (B) an alkoxysilane represented by the following general formula or a partial hydrolysis condensation product thereof: R1aSi(OR2)(4-a) wherein R1 is a monovalent hydrocarbon group having a carbon number of 1 to 12, R2 is an alkyl group having a carbon number of 1 to 3, and subscript “a” is an integer of 0 to 2; (C) a mercaptobenzothiazole based compound; (D) zinc oxide powder and/or zinc carbonate powder; and (E) a catalyst for condensation reactions. The composition and/or a cured product thereof can protect electric/electronic parts from corrosive gases such as hydrogen sulfide gas and sulfuric acid contained in the atmosphere.
    Type: Application
    Filed: August 10, 2017
    Publication date: June 13, 2019
    Inventors: Harumi KODAMA, Masayuki ONISHI
  • Patent number: 10150902
    Abstract: Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: December 11, 2018
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Tomoko Kato, Harumi Kodama, Masayuki Onishi
  • Patent number: 10077339
    Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: September 18, 2018
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Toyohiko Fujisawa, Tomoko Kato, Harumi Kodama, Masayuki Onishi
  • Patent number: 10072151
    Abstract: A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: September 11, 2018
    Assignee: DOW CORNING TORAY CO., LTD.
    Inventors: Harumi Kodama, Masayuki Onishi
  • Patent number: 10066138
    Abstract: A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.
    Type: Grant
    Filed: December 25, 2014
    Date of Patent: September 4, 2018
    Assignee: DOW CORNING TORAY CO., LTD.
    Inventors: Harumi Kodama, Masayuki Onishi
  • Patent number: 9947858
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: April 17, 2018
    Assignees: DOW CORNING CORPORATION, DOW CORNING TORAY CO., LTD.
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Publication number: 20170121462
    Abstract: A curable organopolysiloxane composition that can achieve excellent initial adhesion improvement effects towards various types of substrates, and a protective agent or adhesive composition for electric and electronic components, are provided. The curable organopolysiloxane composition comprises (A) either i) (a1) an organopolysiloxane having a specific alkoxysilyl-containing group and at least an average of 0.5 alkenyl groups, or ii) a mixture of (a1) and (a2) an organopolysiloxane that has at least two alkenyl groups in a molecule, and that does not have the aforementioned group having an alkoxysilyl group. In the mixture, the amount of component (a1) is 10 to less than 100 mass %. The curable organopolysiloxane composition further comprises (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in each molecule, (C) a catalyst for a hydrosilylation reaction, and (D) a catalyst for a condensation reaction.
    Type: Application
    Filed: March 26, 2015
    Publication date: May 4, 2017
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Toyohiko FUJISAWA, Tomoko KATO, Harumi KODAMA, Masayuki ONISHI
  • Publication number: 20170081578
    Abstract: Provided are a thermally conductive silicone composition excelling in heat resistance and thermal conductivity, in which thickening in an uncured state is suppressed, and which has excellent handling ease; and an electrical/electronic apparatus in which the thermally conductive silicone composition is used as a member. The thermally conductive silicone composition comprises (A) 100 parts by mass of either i) (a1) an organopolysiloxane having, in each molecule thereof, at least one alkoxysilyl-containing group bonded to a silicon atom and expressed by the general formula: and as generally described herein, or ii) a mixture of component (a1) and (a2) an organopolysiloxane having in each molecule thereof, at least two alkenyl groups but not the alkoxysilyl-containing group. In the mixture, the content of component (a1) is 10 to less than 100 mass %. The thermally conductive silicone composition further comprises (B) 400 to 3,500 parts by mass of a thermally conductive filler.
    Type: Application
    Filed: March 26, 2015
    Publication date: March 23, 2017
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Tomoko KATO, Harumi KODAMA, Masayuki ONISHI
  • Publication number: 20170037287
    Abstract: A room-temperature-curable silicone rubber composition which exhibits good adhesion to a substrate contacted during curing and which forms a silicone rubber cured product that can be efficiently peeled is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having in each molecule at least two specified alkoxysilyl-containing groups on silicon atoms in the molecular chain, (B) a diorganodialkoxysilane or partially hydrolyzed condensate thereof, and (C) a condensation-reaction catalyst.
    Type: Application
    Filed: December 25, 2014
    Publication date: February 9, 2017
    Inventors: Harumi KODAMA, Masayuki ONISHI
  • Publication number: 20170029622
    Abstract: A room-temperature-curable silicone rubber composition exhibiting good adhesion to a substrate contacted during curing and capable of suppressing the occurrence of oil bleeding is disclosed. The room-temperature-curable silicone rubber composition comprises: (A) a mixture of (A1) an organopolysiloxane having at least two specified alkoxysilyl-containing groups in the molecular and (A2) an organopolysiloxane having one specified alkoxysilyl-containing group in the molecular; (B) an organopolysiloxane lacking a hydroxyl group and an alkoxy group; (C) an alkoxysilane; and (D) a condensation-reaction catalyst.
    Type: Application
    Filed: December 25, 2014
    Publication date: February 2, 2017
    Inventors: Harumi KODAMA, Masayuki ONISHI
  • Publication number: 20150380636
    Abstract: The present invention provides a curable organopolysiloxane composition capable of producing a cured article that can be used as a transducer and provided with excellent mechanical characteristics and/or electrical characteristics. The present invention also relates to a novel curable organopolysiloxane composition for transducer use comprising a curable organopolysiloxane composition, dielectric inorganic fine particles having a specific dielectric constant of greater than or equal to 10, and fine particles having a specific dielectric constant of less than 10.
    Type: Application
    Filed: December 26, 2013
    Publication date: December 31, 2015
    Inventors: Toyohiko Fujisawa, Hiroshi Fukui, Haruhiko Furukawa, Peter Cheshire Hupfield, Hong Sub Kim, Eiji Kitaura, Kent R. Larson, Wataru Nishiumi, Takuya Ogawa, Masayuki Onishi, Kouichi Ozaki, Keiji Wakita
  • Patent number: 8957153
    Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: February 17, 2015
    Assignee: Dow Corning Toray Co., Ltd.
    Inventors: Harumi Kodama, Masayuki Onishi
  • Publication number: 20140227435
    Abstract: A method of protecting a transparent nonmetallic electroconductive part formed by, e.g., ITO, on a transparent substrate, e.g., a glass substrate, from electrochemical corrosion, is characterized by coating the transparent nonmetallic electroconductive part with a room-temperature-curable silicone rubber composition that contains from 1 weight-ppm to 30 weight % of a triazole compound, e.g., a 1,2,4-triazole compound or a benzotriazole compound; and thereafter curing the composition.
    Type: Application
    Filed: May 11, 2012
    Publication date: August 14, 2014
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Katsuya Baba, Masayuki Onishi
  • Publication number: 20140066570
    Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a re-inforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.
    Type: Application
    Filed: March 28, 2012
    Publication date: March 6, 2014
    Applicant: Dow Corning Toray Co., Ltd.
    Inventors: Harumi Kodama, Masayuki Onishi
  • Publication number: 20120292558
    Abstract: A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.
    Type: Application
    Filed: January 20, 2011
    Publication date: November 22, 2012
    Inventors: Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi
  • Patent number: 8247516
    Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.
    Type: Grant
    Filed: October 6, 2008
    Date of Patent: August 21, 2012
    Assignee: Dow Corning Toray Company, Ltd.
    Inventors: Akiko Nabeta, Masayuki Onishi, Yoshito Ushio
  • Publication number: 20110180938
    Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).
    Type: Application
    Filed: January 13, 2011
    Publication date: July 28, 2011
    Applicants: DENSO CORPORATION, Dow Corning Toray Co., Ltd.
    Inventors: Kazuya HIRASAWA, Yuuji Ootani, Akiyoshi Asai, Hirokazu Imai, Hiroyoshi Kunieda, Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi