Patents by Inventor Masayuki Onishi
Masayuki Onishi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8957153Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a reinforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.Type: GrantFiled: March 28, 2012Date of Patent: February 17, 2015Assignee: Dow Corning Toray Co., Ltd.Inventors: Harumi Kodama, Masayuki Onishi
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Publication number: 20140227435Abstract: A method of protecting a transparent nonmetallic electroconductive part formed by, e.g., ITO, on a transparent substrate, e.g., a glass substrate, from electrochemical corrosion, is characterized by coating the transparent nonmetallic electroconductive part with a room-temperature-curable silicone rubber composition that contains from 1 weight-ppm to 30 weight % of a triazole compound, e.g., a 1,2,4-triazole compound or a benzotriazole compound; and thereafter curing the composition.Type: ApplicationFiled: May 11, 2012Publication date: August 14, 2014Applicant: Dow Corning Toray Co., Ltd.Inventors: Katsuya Baba, Masayuki Onishi
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Publication number: 20140066570Abstract: A room-temperature-curable silicone rubber composition comprises: (A) an organopolysiloxane having on silicon atoms in the molecular chain in one molecule at least two specific alkoxysilyl-containing groups; (B) an organopolysiloxane having on silicon atom in the molecular chain neither a hydroxyl group nor an alkoxy group; (C) an alkoxysilane or its partial hydrolysis and condensation product; (D) a condensation reaction catalyst; and optionally comprises (E) an adhesion promoter and/or (F) a re-inforcing filler. The composition cures at room temperature due to contact with atmospheric moisture and exhibits an excellent adhesiveness to substrate in contact with the composition during the cure of the composition.Type: ApplicationFiled: March 28, 2012Publication date: March 6, 2014Applicant: Dow Corning Toray Co., Ltd.Inventors: Harumi Kodama, Masayuki Onishi
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Publication number: 20120292558Abstract: A thermally conductive silicone rubber composition comprises: (A) an organopolysiloxane that contains at least two silicon-bonded alkenyl groups in each molecule, that does not contain silicon-bonded hydroxyl and alkoxy groups, and that has a content of cyclic siloxanes having from 4 to 20 siloxane units of not more than 1,000 ppm in mass units; (B) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule and that does not contain silicon-bonded alkenyl, hydroxyl group, and alkoxy groups; (C) an adhesion promoter; (D) a thermally conductive filler; and (E) a hydrosilylation reaction catalyst; wherein the total quantity of components (B) and (C) is from 0.5 to 10 mass % of the total quantity of components (A), (B), and (C). The composition is characterized by reduced oil fraction that bleeds out during the course of curing, and by reduced low-boiling fraction that volatilizes during the course of curing.Type: ApplicationFiled: January 20, 2011Publication date: November 22, 2012Inventors: Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi
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Patent number: 8247516Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.Type: GrantFiled: October 6, 2008Date of Patent: August 21, 2012Assignee: Dow Corning Toray Company, Ltd.Inventors: Akiko Nabeta, Masayuki Onishi, Yoshito Ushio
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Publication number: 20110180938Abstract: In an electronic device, a silicone adhesive bonding first and second members is made from a composition comprising: (A) 100 parts by mass of an organopolysiloxane containing in one molecule at least two alkenyl groups and being free of silicon-bonded hydroxyl and alkoxy groups wherein the content of cyclic siloxanes having 4 to 20 siloxane units is at most 0.1 mass %; (B) an organopolysiloxane containing in one molecule at least two silicon-bonded hydrogen atoms and being free of an alkenyl group, and silicon-bonded hydroxyl and alkoxy groups; (C) at least 0.05 parts by mass of an adhesion promoter; (D) 100 to 2000 parts by mass of a thermally conductive filler; and (E) a hydrosilylation-reaction catalyst. (B) is contained such that the silicon-bonded hydrogen atoms is in the range of 0.5 to 10 mol per 1 mol of the alkenyl groups of (A), and the sum of (B) and (C) is 0.5 to 10 mass % of the sum of (A), (B) and (C).Type: ApplicationFiled: January 13, 2011Publication date: July 28, 2011Applicants: DENSO CORPORATION, Dow Corning Toray Co., Ltd.Inventors: Kazuya HIRASAWA, Yuuji Ootani, Akiyoshi Asai, Hirokazu Imai, Hiroyoshi Kunieda, Harumi Kodama, Masayuki Onishi, Ryo Sakaguchi, Kazumi Nakayoshi
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Publication number: 20100236450Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) a diorganopolysiloxane capped at both molecular terminals with trialkoxysilyl groups and having viscosity of 100 to 1,000,000 mPas at 25° C.; (B) a diorganodimethoxysilane or a partially hydrolyzed product thereof; (C) a diorganodialkoxysilane having silicon-bonded alkoxy group with two or more carbon atoms or a partially hydrolyzed product thereof; and (D) a titanium chelate catalyst, exhibits excellent storage stability and easiness of controlling curing speed as well as by strong adhesion to a substrate with which this composition is in contact during curing along with the possibility of interfacial peeling of the cured product from the aforementioned substrate.Type: ApplicationFiled: October 6, 2008Publication date: September 23, 2010Inventors: Akiko Nabeta, Masayuki Onishi, Yoshito Ushio
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Patent number: 7592070Abstract: Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.Type: GrantFiled: August 27, 2004Date of Patent: September 22, 2009Assignee: Dow Corning Toray Company, Ltd.Inventors: Akiko Takanami, Yoshito Ushio, Osamu Mitani, Masayuki Onishi
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Patent number: 7550548Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) 100 parts by weight of an organopolysiloxane having a viscosity of from 100 to 500,000 mPa·s at 25° C. and having in one molecule 1.5 or more end groups represented by the general formula: (X)aR13-aSi—, where each X is independently a hydroxyl group or a hydrolyzable group, each R1 is independently a monovalent hydrocarbon group or a halogen-substituted monovalent hydrocarbon group, and a is 1, 2, or 3; (B) 0.01 to 40 parts by weight of a cross-linking agent selected from a silane or a siloxane oligomer where the cross-linking agent has three or more silicon-bonded hydrolyzable groups per molecule; and (C) microparticles of thermoplastic resin containing a platinum compound in such an amount that the content of metallic platinum in component (C) is within the range of 0.01 to 5 wt. %, where the microparticles have an average diameter from 0.Type: GrantFiled: June 20, 2007Date of Patent: June 23, 2009Assignee: Dow Corning Toray Company, Ltd.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Publication number: 20080319121Abstract: A room-temperature curable organopolysiloxane composition comprising: (A) organopolysiloxane that contains in each molecule at least two trialkoxysilyl-containing groups that are bonded to silicon atoms of the molecular chain; (B) diorganodi-alkoxysilane or product of its partial hydrolyzation; (C) organopolysiloxane that contains at least one silicon-bonded phenyl group in each molecule and is free of alkoxy groups; and (D) a titanium chelate catalyst, adheres during curing to a substrate with a sufficient strength but allows separation of a cured body of the composition from the substrate at the interface even after a long period of time.Type: ApplicationFiled: June 17, 2005Publication date: December 25, 2008Applicant: DOW CORNING TORAY COMPANY, LTD.Inventors: Osamu Mitani, Masayuki Onishi, Harumi Kodama
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Publication number: 20080262157Abstract: A curable organopolysiloxane composition comprising: (A) an organopolysiloxane having an average of at least 1.5 alkenyl groups per molecule; (B) an organopolysiloxane having an average of at least 1.5 silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; and (D) microscopic particles of thermoplastic resin, said particles comprising a thermoplastic resin and at least one type of an organometallic compound selected from the group consisting of organotitanium compound, organozirconium compound, organoaluminum compound, and organotin compound, said organometallic compound being either admixed or encapsulated with said thermoplastic resin, allows obtaining of a cured body not subject to decrease in hardness with the lapse of time during storage of the composition, and forms cured body exhibiting excellent adhesion to various substrates by heating.Type: ApplicationFiled: June 7, 2005Publication date: October 23, 2008Applicant: DOW CORNING TORAY COMPANY, LTD.Inventors: Toshiki Nakata, Masayuki Onishi, Kouichi Ozaki
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Patent number: 7329706Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.Type: GrantFiled: May 14, 2002Date of Patent: February 12, 2008Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Hiroshi Fukui, Manabu Sutoh, Hiroji Enami, Masayuki Onishi, Tadashi Okawa, Satoshi Onodera
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Publication number: 20070244287Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).Type: ApplicationFiled: June 20, 2007Publication date: October 18, 2007Applicant: DOW CORNING TORAY COMPANY, LTD.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Patent number: 7250467Abstract: A room-temperature-curable organopolysiloxane composition comprising: (A) an organopolysiloxane having 1.5 or more end groups having at least one hydroxyl group on the average; (B) a silane or a siloxane oligomer having three or more silicon-bonded hydrolyzable groups; (D) an inorganic powder; and either (C) microparticles of thermoplastic resin containing a platinum compound having an average diameter from 0.1 to 20 ?m; or (C1) a platinum compound; and (C2) an organosiloxane oligomer which contains aryl and alkenyl groups and has 8 or less silicon atoms in each molecule and which contains in each molecule at least one divalent organosiloxane as represented by the formula: —(R2)(R3)SiO—(R2)(R3)Si—, (where R2 is an aryl group, and R3 is an alkenyl group), in a quantity of at least 2 moles of component (C2) per 1 mole platinum atoms in component (C1).Type: GrantFiled: July 26, 2002Date of Patent: July 31, 2007Assignee: Dow Corning Toray Silcone Co., Ltd.Inventors: Hidekatsu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koji Nakanishi
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Publication number: 20070009748Abstract: Adhesive silicone elastomer sheet afforded by the cure of a hydrosilylation-curing silicone elastomer composition comprising: (A) an organopolysiloxane that contains at least one diorganosiloxane unit and that has at least two silicon-bonded alkenyl groups in each molecule, (B) an organopolysiloxane resin with the average unit formula: (R13SiO1/2)x(SiO4/2)1.0 in which R1 is substituted or unsubstituted monovalent hydrocarbon group and x is a number from 0.5 to 1.0, (C) an organopolysiloxane that contains at least two silicon-bonded hydrogen atoms in each molecule, and (D) a hydrosilylation catalyst. The adhesive silicone elastomer sheet is transparent, and whose surface exhibits a stable and permanent adhesiveness.Type: ApplicationFiled: August 27, 2004Publication date: January 11, 2007Inventors: Akiko Takanami, Yoshito Ushio, Osamu Mitani, Masayuki Onishi
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Patent number: 7094306Abstract: A photocurable organic polymer composition can be quickly cured into a moisture-penetration-resistant solid body by irradiation with ultraviolet rays, electron beams, or the like, and imparts adhesiveness to a cured body after aging. The photocurable organic polymer composition includes: (D) a photoinitiator and either (I) a composition or (II) a reaction product; where (I) the composition includes (A) a liquid organic polymer having at least one hydroxy group per molecule; (B) a radiation curable alkoxysilane; and (C) a condensation-reaction catalyst; and (II) the reaction product comprises (F) a reaction product of components (A), (B), and (C).Type: GrantFiled: December 17, 2002Date of Patent: August 22, 2006Assignee: Dow Corning Toray Silicone Co., Ltd.Inventors: Osamu Mitani, Masayuki Onishi, Akiko Takanami
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Publication number: 20050090574Abstract: A photocurable organic polymer composition can be quickly cured into a moisture-penetration-resistant solid body by irradiation with ultraviolet rays, electron beams, or the like, and imparts adhesiveness to a cured body after aging. The photocurable organic polymer composition includes: (D) a photoinitiator and either (I) a composition or (II) a reaction product; where (I) the composition includes (A) a liquid organic polymer having at least one hydroxy group per molecule; (B) a radiation curable alkoxysilane; and (C) a condensation-reaction catalyst; and (II) the reaction product comprises (F) a reaction product of components (A), (B), and (C).Type: ApplicationFiled: December 17, 2002Publication date: April 28, 2005Inventors: Osamu Mitani, Masayuki Onishi, Akiko Takanami
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Publication number: 20040254275Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.Type: ApplicationFiled: August 16, 2004Publication date: December 16, 2004Inventors: Hiroshi Fukui, Manabu Sutoh, Hiroji Enami, Masayuki Onishi, Tadashi Okawa, Satoshi Onodera
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Publication number: 20040176517Abstract: A room-temperature-curable organopolysiloxane composition comprising:Type: ApplicationFiled: January 5, 2004Publication date: September 9, 2004Inventors: Hidekatu Hatanaka, Harumi Kodama, Masayuki Onishi, Hiroji Enami, Koii Nakanishi
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Publication number: 20030120016Abstract: A silalkylene oligosiloxane described by general formula 1Type: ApplicationFiled: May 31, 2001Publication date: June 26, 2003Inventors: Tadashi Okawa, Masaaki Amako, Hiroji Enami, Masayuki Onishi