Patents by Inventor Masayuki Sasaki

Masayuki Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8022303
    Abstract: A feed-through for feeding electric power to a submerged pump installed in a tank for cryogenic liquefied gases such as (LNG) liquefied natural gas and (LPG) liquefied propane gas. In the feed-through, a bushing made of an insulating material is inserted in the bushing insertion hole of a flange, and a conductor is inserted in the hollow part of the bushing. A gap between the flange and each end of the bushing insertion hole and a gap between each end of the bushing and the conductor are sealed airtight by seal members. A through-hole is formed in the wall of the bushing, and a space part communicating with the through-hole is formed in the flange. The pressure in the space part of the flange is detected by a pressure detector.
    Type: Grant
    Filed: June 7, 2006
    Date of Patent: September 20, 2011
    Assignee: Furukawa Electric Industrial Cable Co., Ltd.
    Inventor: Masayuki Sasaki
  • Patent number: 7887319
    Abstract: An apparatus for cooling preformed articles, which is capable of very effectively cooling the preformed articles and is, further, capable of sufficiently suppressing or preventing the preformed articles from being locally damaged as a result of coming in contact with each other as they are conveyed neighboring one another in a state of not yet fully cooled. A spray is blown onto the preformed articles 34 conveyed passing through a predetermined conveyer passage 42, a cooling liquid is blown next thereto, and a gas stream is further blown thereto.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: February 15, 2011
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Kunihiro Takatomi, Shoichiro Takano, Masayuki Sasaki, Ken Itou
  • Publication number: 20100243597
    Abstract: To provide a preform, a bottle and a preform molding apparatus capable of preventing lowering in the mechanical strength of a preform, reducing the amount of a resin material, as well as improving productivity. A preform mold 1e used in the preform molding apparatus has a mouth neck part mold 2, a body part mold 3e and a core mold 163, and the body part mold 3e has, on the outer edge of the upper surface of a cylindrical protrusion part 31e, an annular protrusion 33 which controls the moving direction of a solidified film 118 and a solidified film 117 which have been peeled.
    Type: Application
    Filed: August 27, 2008
    Publication date: September 30, 2010
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Satoru Nemoto, Masayuki Sasaki, Tsuneo Imatani
  • Patent number: 7776245
    Abstract: An apparatus for feeding a molten resin is operated for extended periods of time maintaining stability without permitting volatile components of the molten resin to adhere on the surfaces of conveyer means. An extruder in the apparatus for feeding the molten resin to the compression-forming machine has an extrusion unit which discharges a molten resin through an extrusion opening of an extrusion nozzle. An air injection nozzle for injecting the cooling gas is provided along the outer circumference of the extrusion nozzle, and the cooling gas is blown onto the surface of the molten resin extruded from the extrusion opening to cool the surface of the molten resin.
    Type: Grant
    Filed: February 20, 2007
    Date of Patent: August 17, 2010
    Assignee: Toyo Seikan Kaisha, Ltd.
    Inventors: Kiyoshi Kawaguchi, Masayuki Sasaki, Jun Yonesato, Hiroyuki Hashimoto
  • Patent number: 7763809
    Abstract: A substrate of multilayered structure having a plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: July 27, 2010
    Assignee: Shink Electric Industries Co., Inc.
    Inventors: Akio Rokugawa, Masayuki Sasaki, Yuichi Matsuda
  • Publication number: 20100163280
    Abstract: A feed-through for feeding electric power to a submerged pump installed in a tank for cryogenic liquefied gases such as LNG and LPG. In the feed-through, a bushing made of an insulating material is inserted in the bushing insertion hole of a flange, and a conductor is inserted in the hollow part of the bushing. A gap between the flange and each end of the bushing insertion hole and a gap between each end of the bushing and the conductor are sealed airtight by seal members. A through-hole is formed in the wall of the bushing, and a space part communicating with the through-hole is formed in the flange. The pressure in the space part of the flange is detected by a pressure detector.
    Type: Application
    Filed: June 7, 2006
    Publication date: July 1, 2010
    Applicant: FURUKAWA ELECTRIC INDUSTRIAL CABLE CO., LTD.
    Inventor: Masayuki Sasaki
  • Publication number: 20090236767
    Abstract: An apparatus for feeding a molten resin is operated for extended periods of time maintaining stability without permitting volatile components of the molten resin to adhere on the surfaces of conveyer means. An extruder in the apparatus for feeding the molten resin to the compression-forming machine has an extrusion unit which discharges a molten resin through an extrusion opening of an extrusion nozzle. An air injection nozzle for injecting the cooling gas is provided along the outer circumference of the extrusion nozzle, and the cooling gas is blown onto the surface of the molten resin extruded from the extrusion opening to cool the surface of the molten resin.
    Type: Application
    Filed: February 20, 2007
    Publication date: September 24, 2009
    Applicant: Toyo Seikan Kaisha, Ltd
    Inventors: Kiyoshi Kawaguchi, Masayuki Sasaki, Jun Yonesato, Hiroyuki Hashimoto
  • Publication number: 20090229795
    Abstract: An apparatus for cooling preformed articles, which is capable of very effectively cooling the preformed articles and is, further, capable of sufficiently suppressing or preventing the preformed articles from being locally damaged as a result of coming in contact with each other as they are conveyed neighboring one another in a state of not yet fully cooled. A spray is blown onto the preformed articles 34 conveyed passing through a predetermined conveyer passage 42, a cooling liquid is blown next thereto, and a gas stream is further blown thereto.
    Type: Application
    Filed: September 7, 2006
    Publication date: September 17, 2009
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Kunihiro Takatomi, Shoichiro Takano, Masayuki Sasaki, Ken Itou
  • Publication number: 20070007694
    Abstract: When compression molding is performed continuously, lumps of molten synthetic resin (drops), which are supplied by extrusion, are continuously, accurately, and rapidly inserted into plurality of compression molding dies which are rotatingly movable. A method and device for continuously supplying drops into female moldings which are rotatingly movable for manufacturing moldings, wherein synthetic resin in molten condition extruded from an extrusion opening is cut by a cutter attached to a holding mechanism to form the molten resin into drops in a determined quantity, the drops are held and conveyed by the holding mechanism, and the drops are forcibly inserted and supplied into the concaves of the female moldings.
    Type: Application
    Filed: July 13, 2004
    Publication date: January 11, 2007
    Applicant: TOYO SEIKAN KAISHA, LTD.
    Inventors: Satoru Nemoto, Yoshihiko Kimura, Ken Itou, Shoichiro Takano, Hiroyuki Hashimoto, Masayuki Sasaki
  • Patent number: 7038253
    Abstract: According to the present invention, there is provided a new GaN-based field effect transistor of a normally-off type, which has an extremely small ON resistance during operation and is capable of a large-current operation.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: May 2, 2006
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Seikoh Yoshida, Masayuki Sasaki
  • Patent number: 7012908
    Abstract: The present invention uses a CDMA base transceiver system that performs wireless communications through the use of a CDMA method. The invention thereby copes with a plurality of communication methods, through the use of that system, through an efficient construction of the system, simply by changing the software even if making no changes of, for example, the hardware. For example, a base band part is constructed by using an FPGA for processing a chip-rate signal through FPGA program data and a DSP for processing a symbol-rate signal through DSP program data. Through the use of program data setting means, it is possible to change the FPGA program data used by the FPGA and the DSP program data used by the DSP to program data that corresponds to a different type of communication method.
    Type: Grant
    Filed: August 31, 2001
    Date of Patent: March 14, 2006
    Assignee: Hitachi Kokusai Electric Inc.
    Inventor: Masayuki Sasaki
  • Patent number: 6954637
    Abstract: Maintenance of a wireless base station can be easily performed even when a wireless base station is installed on an electric pole. A maintenance terminal for communicating with a maintenance unit in the wireless base station through a wireless link is prepared for the wireless base station. The maintenance unit receives maintenance information and transmits the maintenance information received to the maintenance terminal, which is monitored by an operator. Also, the maintenance unit receives a control data from the maintenance terminal and controls a circuit operation of the wireless base station.
    Type: Grant
    Filed: October 4, 2001
    Date of Patent: October 11, 2005
    Assignee: Hitachi Kokusai Electric Inc.
    Inventors: Masayuki Sasaki, Shinji Ohnishi
  • Publication number: 20050214601
    Abstract: An objective of this invention is to provide to provide a direct methanol type fuel cell power generator which can operate without destruction due to water freezing or reduction in an output even when the system is exposed to a low temperature, and an operating method thereof. This invention provides a method for operating a direct methanol type fuel cell power generator, comprising the steps of feeding an aqueous methanol solution into a fuel flow path in the direct methanol type fuel cell; replacing the aqueous methanol solution in the fuel flow path with a proton-acid antifreezing liquid; and replacing the proton-acid antifreezing liquid in the fuel flow path with the aqueous methanol solution. This invention further provides a direct methanol type fuel cell power generator, comprising at least a direct methanol type fuel cell; a fuel tank filled with an aqueous methanol solution; and an antifreezing liquid tank filled with a proton-acid antifreezing liquid.
    Type: Application
    Filed: March 25, 2005
    Publication date: September 29, 2005
    Applicant: NEC Tokin Corporation
    Inventors: Kunihiko Shimizu, Toshihiko Nishiyama, Takashi Mizukoshi, Masayuki Sasaki
  • Patent number: 6931724
    Abstract: A method of producing a multilayered substrate having: a first face being provided with pads bondable to electrode terminals of a semiconductor element, and a body containing a plurality of wiring line layers and insulation layers successively formed from the side of the multilayered substrate at which the face for mounting a semiconductor element is located, wherein the final insulating layer forms provides a second face of the multilayered substrate. The successive wiring line layers are connected by vias, and the second face has external connection terminal pads. The pads on the first face are formed on a metal sheet, a first layer of insulating material is formed on the metal sheet so as to cover the pads formed thereon, holes are formed through the insulating material to expose the end face of the pad, and a patterned metal layer is formed to provide a layer of wiring lines and vias connecting the pads with the wiring line on the layer of insulating material.
    Type: Grant
    Filed: July 30, 2002
    Date of Patent: August 23, 2005
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Akio Rokugawa, Masayuki Sasaki, Yuichi Matsuda
  • Publication number: 20050176439
    Abstract: A wireless base transceiver station unit that performs the wireless communication of communications signals makes effective use of the channel resources of a plurality of wireless base transceiver station units.
    Type: Application
    Filed: February 2, 2005
    Publication date: August 11, 2005
    Inventor: Masayuki Sasaki
  • Publication number: 20050023555
    Abstract: According to the present invention, there is provided a new GaN-based field effect transistor of a normally-off type, which has an extremely small ON resistance during operation and is capable of a large-current operation.
    Type: Application
    Filed: August 18, 2004
    Publication date: February 3, 2005
    Applicant: The Furukawa Electric Co., Ltd.
    Inventors: Seikoh Yoshida, Masayuki Sasaki
  • Publication number: 20050017271
    Abstract: A substrate of multilayered structure having a. plurality of sets of an insulation layer and a wiring line layer, and having one face for mounting a semiconductor element thereon and the other face on which external connection terminals are to be provided, the face for mounting a semiconductor element being provided with pads to be bonded to an electrode terminal of the semiconductor element, the other face being provided with pads to be bonded to an external connection terminal, such as a terminal formed of a solder ball, and the wiring line layers on both sides of an insulation layer being connected with each other by vias piercing the insulation layer, wherein the surfaces of the pads to be bonded to an electrode terminal of a semiconductor element are flat and are in the same plane. A method of manufacturing such a multilayered substrate is also disclosed.
    Type: Application
    Filed: August 18, 2004
    Publication date: January 27, 2005
    Inventors: Akio Rokugawa, Masayuki Sasaki, Yuichi Matsuda
  • Publication number: 20040209145
    Abstract: This invention relates to a unit cell for a fuel cell comprising a membrane electrode assembly comprising an electrolyte membrane and a pair of electrodes sandwiching the electrolyte membrane on its sides; conductive wires forcedly contact with the sides of the membrane electrode assembly; and a frame support for fixing the conductive wire. According to this invention, a membrane electrode assembly can be fixed by uniform clamping for smooth feeding of reactants and discharge of products, to provide a unit cell for a fuel cell having a structure exhibiting good battery properties with a low cost and a fuel cell therewith.
    Type: Application
    Filed: March 31, 2004
    Publication date: October 21, 2004
    Inventors: Takashi Mizukoshi, Toshihiko Nishiyama, Kunihiko Shimizu, Masayuki Sasaki
  • Patent number: 6778754
    Abstract: A wiring substrate; a wiring head which guides optical fibers to the lead end thereof and forms an optical fiber path; an optical fiber feed mechanism which feeds the optical fiber into the optical fiber path; an optical fiber contact mechanism which brings the optical fiber, which has been guided to the lead end of the wiring head, and the wiring substrate into contact; an XY movement mechanism, which moves the wiring substrate and the wiring head relative to one anther in the X and Y directions; and an optical fiber affixing mechanism which successively affixes, to the wiring substrate, the optical fiber which has been brought into contact with the wiring substrate during movement by the XY movement mechanism; are provided.
    Type: Grant
    Filed: June 15, 2000
    Date of Patent: August 17, 2004
    Assignee: Nippon Telegraph & Telephone Corporation
    Inventors: Mamoru Hirayama, Koichi Arishima, Tsuneo Tamagaki, Masayuki Sasaki, Chikao Nakagawa
  • Patent number: 6660213
    Abstract: A nozzle plate to be mounted on an ink jet print head includes a plate body on which is formed a plurality of jet aperture portions from which ink is jetted and a water-repellant film formed on this plate body. The diameter of jet aperture portions formed on the plate body and the diameter of water-repellant film apertures formed on the water-repellant film so as to connect with the nozzle apertures are the same diameter R3, so the ink jet flow can be accurately controlled.
    Type: Grant
    Filed: February 2, 1999
    Date of Patent: December 9, 2003
    Assignee: Fujitsu Limited
    Inventors: Kouichi Sanpei, Masayuki Sasaki, Hiromitsu Soneda, Mutsuo Watanabe