Abstract: An intermediate transfer belt has metal oxide particles as a solid lubricant on a surface of the intermediate transfer belt, in which an average spacing between the metal oxide particles on the surface is 1,000 nm or less, and an average height of the metal oxide particles from the surface is 15 nm or more and 320 nm or less.

Abstract: An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Abstract: An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Abstract: An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Abstract: An electronic device includes a substrate, a first insulating film on the substrate, a second insulating film on the first insulating film, first and second coils respectively in the first and second insulating films, first and second terminals, and first and second connection conductors. The first and second insulating films contact each other so that the first and second coils are magnetically coupled. The first insulating film includes a first non-contact portion not contacting the second insulating film. One of the first and second insulating films includes a second non-contact portion not contacting the first or second insulating film. The first terminal is provided on the first non-contact portion and electrically connected to the first coil. The second terminal is provided on the second non-contact portion and electrically connected to the second coil. The first and second connection conductors are connected to the first and second terminals, respectively.

Abstract: An anvil in which a plurality of convex portions are formed on the surface of a roll, a plurality of horns that are ultrasonically vibrated to repeatedly make contact with the convex portions through an elastic sheet so as to perform melting and cutting and a plurality of vibration devices that ultrasonically vibrate the horns are included, the tip ends of the horns are arranged so as to be opposite the anvil and the horns are arranged in different positions in the axial direction of the roll so that the horns make contact with different convex portions of the convex portions.

Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.

Abstract: After molten metal has been poured from a ladle 6 into a converter, metal 6b adhering to the ladle 6 is dropped into the ladle 6 on-line, and molten metal is poured from an electric furnace into the ladle 6 into which the metal 6b has been dropped. As a result, the metal 6b is melted and is recovered as a material.

Abstract: After molten metal has been poured from a ladle 6 into a converter, metal 6b adhering to the ladle 6 is dropped into the ladle 6 on-line, and molten metal is poured from an electric furnace into the ladle 6 into which the metal 6b has been dropped. As a result, the metal 6b is melted and is recovered as a material.

Abstract: A semiconductor device includes a gate electrode, source regions and drain regions, a body contact region, and a body bias control electrode. The gate electrode includes a plurality of first portions arranged in parallel with a first distance therebetween, and a second portion connecting the plurality of first portions. The source regions and the drain regions are provided between the plurality of first portions. The body contact region is disposed on the other side of the source regions and the drain regions relative to the second portion. The body bias control electrode is provided on the body contact region in parallel with the second portion at a second distance from the second portion that is greater than the first distance, and is electrically connected to the body contact region.

Abstract: An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles.

Abstract: A semiconductor device includes a gate electrode, source regions and drain regions, a body contact region, and a body bias control electrode. The gate electrode includes a plurality of first portions arranged in parallel with a first distance therebetween, and a second portion connecting the plurality of first portions. The source regions and the drain regions are provided between the plurality of first portions. The body contact region is disposed on the other side of the source regions and the drain regions relative to the second portion. The body bias control electrode is provided on the body contact region in parallel with the second portion at a second distance from the second portion that is greater than the first distance, and is electrically connected to the body contact region.

Abstract: A switch circuit, a control circuit, a grounding wire and a control wire are formed on a substrate. The switch circuit connects an antenna terminal with one of multiple high frequency terminals. The control circuit outputs a control signal to the switch circuit. The grounding wire is disposed between the switch circuit and the control circuit and extends from a location proximate to an edge of the substrate to a location proximate to an opposite edge of the substrate. The control wire that carries the control signal is disposed between one end of the grounding wire and an edge of the semiconductor substrate.

Abstract: A switch circuit, a control circuit, a grounding wire and a control wire are formed on a substrate. The switch circuit connects an antenna terminal with one of multiple high frequency terminals. The control circuit outputs a control signal to the switch circuit. The grounding wire is disposed between the switch circuit and the control circuit and extends from a location proximate to an edge of the substrate to a location proximate to an opposite edge of the substrate. The control wire that carries the control signal is disposed between one end of the grounding wire and an edge of the semiconductor substrate.

Abstract: A method for stirring chrome-containing molten iron comprises mechanically stirring chrome-containing molten iron contained in a refining vessel by the use of an impeller having a rotation axis in the vertical direction where the refining vessel is such that the horizontal cross section of the inner wall thereof is circular around the central axis of the vessel in the vertical direction and the impeller, as integrated with the axial rod covered with a refractory, rotates around the central axis of the axial rod, as the rotation axis thereof. The stirring mode is regularly or irregularly switched between a concentric stirring of the molten iron in a state where the rotation axis of the impeller is centered in the central axis of the vessel and an eccentric stirring of the molten iron in a state where the rotation axis of the impeller is decentered from the central axis of the vessel.