Patents by Inventor Masud Beroz
Masud Beroz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10847469Abstract: A microelectronic structure having CTE compensation for use in wafer-level and chip-scale packages, comprising a plurality of substrate tiles each having a generally planar upper surface, the upper surfaces of the tiles disposed within a common plane to provide a generally planar grid of the tiles, each respective pair of adjacent tiles having a gap disposed therebetween.Type: GrantFiled: July 17, 2017Date of Patent: November 24, 2020Assignee: CUBIC CORPORATIONInventors: Kenneth J. Vanhille, Aaron C. Caba, Masud Beroz, Jared W. Jordan, Timothy A. Smith, Anatoliy O. Boryssenko, Steven E. Huettner
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Patent number: 10748858Abstract: High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.Type: GrantFiled: July 17, 2019Date of Patent: August 18, 2020Assignee: Invensas CorporationInventors: Liang Wang, Ilyas Mohammed, Masud Beroz
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Publication number: 20190341361Abstract: High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.Type: ApplicationFiled: July 17, 2019Publication date: November 7, 2019Applicant: Invensas CorporationInventors: Liang Wang, Ilyas Mohammed, Masud Beroz
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Patent number: 10396041Abstract: High yield substrate assembly. In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.Type: GrantFiled: March 5, 2017Date of Patent: August 27, 2019Assignee: Invensas CorporationInventors: Liang Wang, Ilyas Mohammed, Masud Beroz
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Patent number: 10128601Abstract: A contactor device includes: a first body substrate; a second body substrate; a flexible membrane connected to the first body substrate and second body substrate, wherein the second substrate body is movable relative to the first substrate body by flexure of the flexible membrane; an electrical contact member carried by the second substrate body; a microfluidic-channeled substrate coupled to the first body substrate, the microfluidic-channeled substrate having a chamber and a microfluidic channel in fluid communication with the chamber; and a 3-dimensional flexible membrane enclosing the chamber, wherein the 3-dimensional flexible membrane flexes toward the second body substrate when a fluid pressure is applied to the chamber through the microfluidic channel whereby a force or a movement is transferred to the second body substrate by the 3-dimensional flexible membrane.Type: GrantFiled: February 13, 2018Date of Patent: November 13, 2018Assignee: Componentzee, LLCInventor: Masud Beroz
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Patent number: 10003149Abstract: A contactor device includes: a first body substrate; a second body substrate; a flexible membrane connected to the first body substrate and second body substrate, wherein the second substrate body is movable relative to the first substrate body by flexure of the flexible membrane; an electrical contact member carried by the second substrate body; a microfluidic-channeled substrate coupled to the first body substrate, the microfluidic-channeled substrate having a chamber and a microfluidic channel in fluid communication with the chamber; and a 3-dimensional flexible membrane enclosing the chamber, wherein the 3-dimensional flexible membrane flexes toward the second body substrate when a fluid pressure is applied to the chamber through the microfluidic channel whereby a force or a movement is transferred to the second body substrate by the 3-dimensional flexible membrane.Type: GrantFiled: October 25, 2017Date of Patent: June 19, 2018Assignee: COMPONENTZEE, LLCInventor: Masud Beroz
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Patent number: 9947643Abstract: Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.Type: GrantFiled: March 21, 2016Date of Patent: April 17, 2018Assignee: INVENSAS CORPORATIONInventors: Ilyas Mohammed, Masud Beroz, Liang Wang
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Publication number: 20180048084Abstract: A contactor device includes: a first body substrate; a second body substrate; a flexible membrane connected to the first body substrate and second body substrate, wherein the second substrate body is movable relative to the first substrate body by flexure of the flexible membrane; an electrical contact member carried by the second substrate body; a microfluidic-channeled substrate coupled to the first body substrate, the microfluidic-channeled substrate having a chamber and a microfluidic channel in fluid communication with the chamber; and a 3-dimensional flexible membrane enclosing the chamber, wherein the 3-dimensional flexible membrane flexes toward the second body substrate when a fluid pressure is applied to the chamber through the microfluidic channel whereby a force or a movement is transferred to the second body substrate by the 3-dimensional flexible membrane.Type: ApplicationFiled: October 25, 2017Publication date: February 15, 2018Inventor: Masud Beroz
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Patent number: 9842745Abstract: Heat spreading substrate with embedded interconnects. In an embodiment in accordance with the present invention, an apparatus includes a metal parallelepiped comprising a plurality of wires inside the metal parallelepiped. The plurality of wires have a different grain structure than the metal parallelepiped. The plurality of wires are electrically isolated from the metal parallelepiped. The plurality of wires may be electrically isolated from one another.Type: GrantFiled: January 20, 2015Date of Patent: December 12, 2017Assignee: Invensas CorporationInventors: Ilyas Mohammed, Masud Beroz
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Publication number: 20170330836Abstract: CTE compensation for wafer-level and chip-scale packages and assemblies.Type: ApplicationFiled: July 17, 2017Publication date: November 16, 2017Inventors: Kenneth J. Vanhille, Aaron C. Caba, Masud Beroz, Jared W. Jordan, Timothy A. Smith, Anatoliy O. Boryssenko, Steven E. Huettner
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Patent number: 9805891Abstract: A fluid pressure actuated device for establishing electrical contact includes a first side and a second side each defining a respective cavity. A respective flexible membrane is positioned across each cavity. Each membrane has an outer side that carries an electrically conducting contactor. The contactors are electrically connected to a conducting connector that extends at least partially through the device. Each flexible membrane extends and withdraws moving the associated electrically conducting contactor in opposing directions when fluid pressure is increased and decreased in the associated cavity. Each membrane may have an undulating shape by including concentric frustum portions that narrow in opposite directions. The contacts may have neutral positions that are internal relative to outer surfaces of the device until fluid pressure is increased in the respective cavities causing extension by movement of the membranes.Type: GrantFiled: October 23, 2015Date of Patent: October 31, 2017Assignee: Componentzee, LLCInventor: Masud Beroz
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Publication number: 20170179046Abstract: In accordance with a first method embodiment, a plurality of piggyback substrates are attached to a carrier substrate. The edges of the plurality of the piggyback substrates are bonded to one another. The plurality of piggyback substrates are removed from the carrier substrate to form a substrate assembly. The substrate assembly is processed to produce a plurality of integrated circuit devices on the substrate assembly. The processing may use manufacturing equipment designed to process wafers larger than individual instances of the plurality of piggyback substrates.Type: ApplicationFiled: March 5, 2017Publication date: June 22, 2017Applicant: Invensas CorporationInventors: Liang Wang, Ilyas Mohammed, Masud Beroz
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Patent number: 9583671Abstract: Improved quantum efficiency of multiple quantum wells. In accordance with an embodiment of the present invention, an article of manufacture includes a p side for supplying holes and an n side for supplying electrons. The article of manufacture also includes a plurality of quantum well periods between the p side and the n side, each of the quantum well periods includes a quantum well layer and a barrier layer, with each of the barrier layers having a barrier height. The plurality of quantum well periods include different barrier heights.Type: GrantFiled: February 23, 2015Date of Patent: February 28, 2017Assignee: Invensas CorporationInventors: Liang Wang, Ilyas Mohammed, Masud Beroz
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Patent number: 9577358Abstract: A fluid pressure actuated device for establishing electrical contact includes a substrate defining a chamber, a flexible membrane having a first side facing a first direction away from the substrate and a second side facing into the chamber in a second direction opposite the first direction, and an electrically conducting contactor mounted on the first side of the flexible membrane. The flexible membrane extends and withdraws moving the electrically conducting contactor in the first direction and second direction respectively when fluid pressure is increased and decreased in the chamber. The flexible membrane includes at least two concentric frustum portions that narrow in opposite directions, including a central frustum portion and a second frustum portion that encircles the central frustum portion. Multiple chambers may be maintained in pressure equilibrium by at least one channel for the concurrent extension of multiple membranes and contactors.Type: GrantFiled: May 27, 2015Date of Patent: February 21, 2017Inventor: Masud Beroz
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Patent number: 9570416Abstract: A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.Type: GrantFiled: September 30, 2015Date of Patent: February 14, 2017Assignee: Tessera, Inc.Inventors: Belgacem Haba, Craig S. Mitchell, Masud Beroz
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Publication number: 20160204091Abstract: Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.Type: ApplicationFiled: March 21, 2016Publication date: July 14, 2016Inventors: Ilyas Mohammed, Masud Beroz, Liang Wang
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Publication number: 20160118210Abstract: A fluid pressure actuated device for establishing electrical contact includes a first side and a second side each defining a respective cavity. A respective flexible membrane is positioned across each cavity. Each membrane has an outer side that carries an electrically conducting contactor. The contactors are electrically connected to a conducting connector that extends at least partially through the device. Each flexible membrane extends and withdraws moving the associated electrically conducting contactor in opposing directions when fluid pressure is increased and decreased in the associated cavity. Each membrane may have an undulating shape by including concentric frustum portions that narrow in opposite directions. The contacts may have neutral positions that are internal relative to outer surfaces of the device until fluid pressure is increased in the respective cavities causing extension by movement of the membranes.Type: ApplicationFiled: October 23, 2015Publication date: April 28, 2016Inventor: Masud Beroz
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Publication number: 20160118737Abstract: A fluid pressure actuated device for establishing electrical contact includes a substrate defining a chamber, a flexible membrane having a first side facing a first direction away from the substrate and a second side facing into the chamber in a second direction opposite the first direction, and an electrically conducting contactor mounted on the first side of the flexible membrane. The flexible membrane extends and withdraws moving the electrically conducting contactor in the first direction and second direction respectively when fluid pressure is increased and decreased in the chamber. The flexible membrane includes at least two concentric frustum portions that narrow in opposite directions, including a central frustum portion and a second frustum portion that encircles the central frustum portion. Multiple chambers may be maintained in pressure equilibrium by at least one channel for the concurrent extension of multiple membranes and contactors.Type: ApplicationFiled: May 27, 2015Publication date: April 28, 2016Inventor: Masud Beroz
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Patent number: 9293641Abstract: Inverted optical device. In accordance with an embodiment of the present invention, a plurality of piggyback substrates are attached to a carrier wafer. The plurality of piggyback substrates are dissimilar in composition to the carrier wafer. The plurality of piggyback substrates are processed, while attached to the carrier wafer, to produce a plurality of integrated circuit devices. A flip wafer is attached to the plurality of light emitting diodes, away from the carrier wafer and the carrier wafer is removed. The plurality of light emitting diodes may be singulated to form individual light emitting diode devices.Type: GrantFiled: November 18, 2011Date of Patent: March 22, 2016Assignee: Invensas CorporationInventors: Ilyas Mohammed, Masud Beroz, Liang Wang
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Publication number: 20160035692Abstract: A plurality of microelectronic assemblies are made by severing an in-process unit including an upper substrate and lower substrate with microelectronic elements disposed between the substrates. In a further embodiment, a lead frame is joined to a substrate so that the leads project from this substrate. Lead frame is joined to a further substrate with one or more microelectronic elements disposed between the substrates.Type: ApplicationFiled: September 30, 2015Publication date: February 4, 2016Applicant: TESSERA, INC.Inventors: Belgacem Haba, Craig S. Mitchell, Masud Beroz