Patents by Inventor Mathieu Habert
Mathieu Habert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11761806Abstract: A thermal flowmeter for measuring the mass flow rate of a medium in a measuring tube, includes: a measuring tube having a measuring tube wall; a sensor having four probes that project into the measuring tube from a main sensor body; and an electronic measuring/operating circuit designed to operate at least three probes and to generate and provide flow measurement values by operating the probes, each probe having a main probe body and an active probe body, the active probe body designed to heat the medium, to determine the temperature of the medium and/or to influence a flow of the medium in the measuring tube, wherein the main probe bodies span a rhombus on a surface of the main sensor body, and the rhombus is defined by centroid points of cross-sections of the main probe bodies.Type: GrantFiled: May 4, 2020Date of Patent: September 19, 2023Assignee: Endress+Hauser Flowtec AGInventors: Alexander Grün, Mathieu Habert
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Publication number: 20220341767Abstract: A thermal flowmeter for measuring the mass flow rate of a medium in a measuring tube, includes: a measuring tube having a measuring tube wall; a sensor having four probes that project into the measuring tube from a main sensor body; and an electronic measuring/operating circuit designed to operate at least three probes and to generate and provide flow measurement values by operating the probes, each probe having a main probe body and an active probe body, the active probe body designed to heat the medium, to determine the temperature of the medium and/or to influence a flow of the medium in the measuring tube, wherein the main probe bodies span a rhombus on a surface of the main sensor body, and the rhombus is defined by centroid points of cross-sections of the main probe bodies.Type: ApplicationFiled: May 4, 2020Publication date: October 27, 2022Inventors: Alexander Grün, Mathieu Habert
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Publication number: 20220196450Abstract: A method for producing a probe of a thermal flowmeter for measuring mass flow of a medium in a measuring tube, wherein a probe core is provided arranged loosely in a probe sleeve having a longitudinal axis, wherein the probe sleeve is deformed relative to the longitudinal axis completely radially in the direction of the probe core by means of high energy rate forming, wherein a material-locking connection between probe sleeve and probe core results and a rod is formed, wherein the rod represents a base body that is used for probe production, wherein a deformation speed reaches values greater than 100 m/s, and wherein the high energy rate forming includes explosive forming or magnetic forming.Type: ApplicationFiled: March 31, 2020Publication date: June 23, 2022Inventors: Anastasios Badarlis, Stephan Gaberthüel, Alexander Grün, Hanno Schultheis, Tobias Baur, Martin Barth, Martin Arnold, Mathieu Habert
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Patent number: 10674630Abstract: A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.Type: GrantFiled: April 4, 2016Date of Patent: June 2, 2020Assignee: ABB Technology AGInventors: Francesco Agostini, Daniele Torresin, Bruno Agostini, Mathieu Habert, Francesco Moraschinelli, Antonello Antoniazzi
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Patent number: 10517195Abstract: A heat exchanger assembly is disclosed.Type: GrantFiled: August 27, 2018Date of Patent: December 24, 2019Assignee: ABB Schweiz AGInventors: Francesco Agostini, Daniele Torresin, Mathieu Habert, Bruno Agostini
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Patent number: 10212862Abstract: This invention relates to a cooling apparatus comprising a base plate, an evaporator and a condenser. In order to obtain a simple and efficient cooling apparatus the evaporator is a porous aluminum evaporator having a capillary structure with pores and a plurality of larger sized evaporator channels extending through the evaporator between a second end and the first end of the evaporator. A compensation chamber extending along a second surface of the evaporator receives first fluid from the condenser such that pores opening up into the second surface of the evaporator are provided with first fluid.Type: GrantFiled: June 28, 2016Date of Patent: February 19, 2019Assignee: ABB Schweiz AGInventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Gernot Riedel, Mathieu Habert
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Publication number: 20180368292Abstract: A heat exchanger assembly (1) is disclosed.Type: ApplicationFiled: August 27, 2018Publication date: December 20, 2018Inventors: Francesco Agostini, Daniele Torresin, Mathieu Habert, Bruno Agostini
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Patent number: 10096538Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.Type: GrantFiled: April 12, 2017Date of Patent: October 9, 2018Assignee: ABB Schweiz AGInventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert, Munaf Rahimo
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Patent number: 10080315Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion.Type: GrantFiled: September 25, 2016Date of Patent: September 18, 2018Assignee: ABB Schweiz AGInventors: Francesco Agostini, Daniele Torresin, Mathieu Habert, Bruno Agostini
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Patent number: 10077947Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.Type: GrantFiled: September 21, 2016Date of Patent: September 18, 2018Assignee: ABB Schweiz AGInventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert, Timo Koivuluoma
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Patent number: 9958213Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.Type: GrantFiled: July 7, 2016Date of Patent: May 1, 2018Assignee: ABB Schweiz AGInventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert
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Patent number: 9909817Abstract: The invention relates to a cooling element (11) comprising: a fluid channel (1) providing a pulsating heat pipe, a first evaporator (14) for receiving heat from electric components (15) and for passing the heat into fluid in the fluid channel (1), and a first condenser (18) for receiving fluid from the first evaporator (14) via the fluid channel (1) and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator (14) an adiabatic zone where the temperature of the fluid in the fluid channel (1) remains unchanged or a cooling zone, with a second condenser (20) cooling fluid in the fluid channel (1), separates the first evaporator (14) from the loops (6) in the second end (12) of the fluid channel.Type: GrantFiled: August 13, 2015Date of Patent: March 6, 2018Assignee: ABB Technology OyInventors: Francesco Agostini, Daniele Torresin, Mathieu Habert, Bruno Agostini
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Patent number: 9888612Abstract: It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.Type: GrantFiled: January 9, 2017Date of Patent: February 6, 2018Assignee: ABB Schweiz AGInventors: Daniele Torresin, Bruno Agostini, Francesco Agostini, Thomas Gradinger, Mathieu Habert
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Publication number: 20170301607Abstract: A power device comprises at least one power semiconductor module comprising a wide bandgap semiconductor element; and a cooling system for actively cooling the wide bandgap semiconductor element with a cooling medium, wherein the cooling system comprises a refrigeration device for lowering a temperature of the cooling medium below an ambient temperature of the power device; wherein the cooling system is adapted for lowering the temperature of the cooling medium in such a way that a temperature of the wide bandgap semiconductor element is below 100° C.Type: ApplicationFiled: April 12, 2017Publication date: October 19, 2017Inventors: Bruno Agostini, Daniele Torresin, Francesco Agostini, Mathieu Habert, Munaf Rahimo
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Patent number: 9763358Abstract: The invention relates to an apparatus (1) comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4). The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).Type: GrantFiled: November 12, 2015Date of Patent: September 12, 2017Assignee: ABB Technology OYInventors: Mathieu Habert, Bruno Agostini, Francesco Agostini
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Publication number: 20170202108Abstract: It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.Type: ApplicationFiled: January 9, 2017Publication date: July 13, 2017Inventors: Daniele Torresin, Bruno Agostini, Francesco Agostini, Thomas Gradinger, Mathieu Habert
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Publication number: 20170181319Abstract: The invention relates to a cooling apparatus, comprising a first evaporator section with first channels, and a first condenser section with second channels. In order to provide adequate cooling for electric components the cooling apparatus further comprises a second evaporator section with third channels, and a base plate with a first surface for receiving a heat load from electric components. The first condenser section is in fluid communication with the second evaporator section for receiving fluid from the second evaporator section, for passing heat from the fluid to surroundings and for returning fluid to the second evaporator section.Type: ApplicationFiled: December 21, 2016Publication date: June 22, 2017Inventors: Francesco Agostini, Daniele Torresin, Bruno Agostini, Mathieu Habert
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Patent number: 9618244Abstract: An exemplary evaporating unit for cooling a heat emitting device includes a cooling circuit having a stack of evaporating units arranged alternately with heat emitting devices. Each evaporating unit is connected to a condenser and includes a first inlet channel, a first plurality of evaporation channels, and a first outlet channel. The evaporating unit is designed for pre-heating the cooling fluid flowing therein.Type: GrantFiled: March 3, 2015Date of Patent: April 11, 2017Assignee: ABB Schweiz AGInventors: Anders Blomberg, Bruno Agostini, Jing Ni, Jürgen Hafner, Mathieu Habert
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Publication number: 20170094843Abstract: A cooling device for cooling at least two power electronic devices by a working fluid. The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement with a heat dissipator portion of the Pulsating Heat Pipe circuit system and a plurality of fins thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion.Type: ApplicationFiled: September 25, 2016Publication date: March 30, 2017Inventors: Francesco Agostini, Daniele Torresin, Mathieu Habert, Bruno Agostini
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Patent number: 9607924Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.Type: GrantFiled: August 12, 2015Date of Patent: March 28, 2017Assignee: ABB Technology OYInventors: Daniel Kearney, Francesco Agostini, Didier Cottet, Daniele Torresin, Mathieu Habert