Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract: A cooling assembly comprising a plurality of fin elements stacked in a stack direction, a plurality of coolant channels each located between adjacent fin elements and extending in a coolant channel direction perpendicular to the stack direction, a first heat transfer surface adapted to be in contact with a heat generating element, and a second heat transfer surface spaced apart from the first heat transfer surface, the plurality of fin elements and the plurality of coolant channels being located between the first heat transfer surface and the second heat transfer surface. Each of the fin elements comprises a pulsating heat pipe embedded therein, a main pulsating direction of each of the pulsating heat pipes being substantially parallel to a normal of the first heat transfer surface.

Abstract: The invention relates to a heat exchanger comprising a base plate for receiving a heat load from one or more electric components, an evaporator being in thermal contact with a surface of the base plate for transferring said heat load into a first fluid in the evaporator channels, and a condenser dissipating heat from the first fluid. In order to provide an efficient heat exchanger the heat exchanger comprises a collector space receiving first fluid from the condenser, and the collector space which is located higher than the lower ends of the evaporator channels is in fluid communication with lower ends of the evaporator channels for passing first fluid received from the condenser to the lower ends of the evaporator channels.

Abstract: An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.

Abstract: A heat exchange device may be based on a pulsating heat pipe and a cooling arrangement. The heat exchange device may include a plurality of pipes to provide fluid paths between a first fluid distribution element and a second fluid distribution element. Each pipe of the plurality of pipes may include a group of channels. Each of the first and second fluid distribution elements may include a plate of a first type. Each plate of the first type may include openings for providing alignment functionality for the plurality of pipes. The first fluid distribution element may include a plate of a second type that may include openings for providing fluid paths between the pipes. The plate of the second type may be positioned on a side of the plate of the first type of plates of the first fluid distribution element that is opposite to the second fluid distribution element.

Abstract: This invention relates to a cooling apparatus comprising a first cooling element (5) with first channels (6) extending between a first manifold (1) and a second manifold (2) and with a base plate (9) with a first surface (10) for receiving a heat load from an electric component (11), and a second cooling element (14) with second channels (16) extending between a third manifold (3) and a fourth manifold (4). A first section (21) of the second cooling element (14) is provided with openings (19) for allowing an airflow (18) to pass through the first section (21). The second cooling element (14) comprises a second section (22) provided with openings (19), and the cooling apparatus is configured to conduct the airflow (18) which has passed through the first section (21) through the openings (19) of the second section (22).

Abstract: The invention relates to an apparatus (1) comprising a generator (5), an evaporator (6), an absorber (8) and a condenser (9) circulating a refrigerant (R), an inert (I) and an absorbent (A) in a diffusion-absorption cycle. The generator (5) and the evaporator (6) are arranged in an electric cabinet (2) to receive a heat load from primary electric components (3) and secondary electric components (4). The absorber (8) and the condenser (9) are arranged outside of the electric cabinet (2) and at a higher level than the evaporator (6) to receive fluid from the generator (5) and the evaporator (6) and for dissipating heat from the received fluid to the surrounding environment. The inert (I) and refrigerant (R) are selected such that the inert (I) is heavier than the refrigerant (R) in order to obtain fluid circulation where the inert (I) exiting the absorber (8) flows downwards to the evaporator (6) and the inert (I) exiting the evaporator (6) flows upwards to the absorber (8).

Abstract: A cooling assembly is disclosed having a device chamber, a cooling chamber, a heat exchanger, a fan and a controller, the heat exchanger having a first heat exchanger unit and a second heat exchanger unit located above the first heat exchanger unit. The fan includes a first fan adapted to generate a first cooling air flow. The cooling assembly further includes a first dust tray located between the first heat exchanger unit and the second heat exchanger unit, the first cooling air flow being directed towards the first dust tray. The first dust tray is adapted to receive and retain at least part of contaminant particles present in the first cooling air flow, the device chamber being separated from the cooling chamber.

Abstract: The invention relates to a cooling element (11) comprising: a fluid channel (1) providing a pulsating heat pipe, a first evaporator (14) for receiving heat from electric components (15) and for passing the heat into fluid in the fluid channel (1), and a first condenser (18) for receiving fluid from the first evaporator (14) via the fluid channel (1) and for cooling fluid in the fluid channel. In order to obtain an even temperature distribution at the first evaporator (14) an adiabatic zone where the temperature of the fluid in the fluid channel (1) remains unchanged or a cooling zone, with a second condenser (20) cooling fluid in the fluid channel (1), separates the first evaporator (14) from the loops (6) in the second end (12) of the fluid channel.

Abstract: The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.

Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.

Abstract: An electric machine including a closed chamber with a wall and enclosing a stator, a rotor and a first fluid and a heat exchanging unit stretching from the chamber through the wall to a fluid transporting passage. The heat exchanging unit includes conduits provided in a loop, containing a working fluid and equipped with evaporator channels and condenser channels, first heat transfer elements inside the chamber for transferring heat from the first fluid to the working fluid via the evaporator channels and second heat transfer elements in the passage for transferring heat out of the working fluid via the condenser channels to a second fluid, a first fluid propagating unit inside the chamber forcing the first fluid to circulate and a second fluid propagating unit in the passage forcing the second fluid to flow past the second heat transfer element.

Abstract: An exemplary evaporating unit for cooling a heat emitting device includes a cooling circuit having a stack of evaporating units arranged alternately with heat emitting devices. Each evaporating unit is connected to a condenser and includes a first inlet channel, a first plurality of evaporation channels, and a first outlet channel. The evaporating unit is designed for pre-heating the cooling fluid flowing therein.

Abstract: An exemplary modular cooling system for cooling a plurality of electronic components is provided. The cooling system includes a plurality of cooling modules and a clamping arrangement. Each cooling module includes an evaporator unit, a condenser, a first pipe system, and a second pipe system. The clamping arrangement is adapted for holding and pressing an alternation stack in which the evaporator units are stacked in alternation with the power electronic components.

Abstract: A cooling apparatus for electric equipment includes a generator configured to receive a heat load from first electric components, a evaporator configured to receive a heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a absorber transferring heat from heated fluid to the outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, the cooling apparatus includes a first expansion device which reduces the pressure of the fluid, and forwards the fluid in a liquid state and with a lower pressure to the secondary cooling element, which transfers heat to the received fluid from the second electric components for evaporating the fluid.

Abstract: An apparatus is disclosed which includes a generator receiving a heat load from first electric components, an evaporator for receiving a heat load from second electric components, a tight enclosure, and an absorber-condenser arranged outside of the tight enclosure. For efficient cooling of the apparatus, one or more of the generator, evaporator and absorber-condenser is entirely or partly manufactured of aluminum. The inert and refrigerant can be selected such that R134a is used as the inert and butane as the refrigerant fluid, or R32 is used as the inert and cyclopropane is used as the refrigerant, and the absorber is selected to include an alkyl acetamide, a carbonate ester or a glycol ester.

Abstract: An electric apparatus is disclosed having at least two cooling elements and a first fan arrangement for cooling the at least two cooling elements with a first air flow. A second fan arrangement can cool the at least two cooling elements with a second air flow. The second fan arrangement passes a second air flow in a different flow direction as compared to the first air flow, and the first and second air flows are arranged to cool different parts of the at least two cooling elements.

Abstract: A cooling apparatus for electric equipment includes a generator configured to receive a heat load from first electric components, a evaporator configured to receive a heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a absorber transferring heat from heated fluid to the outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, the cooling apparatus includes a first expansion device which reduces the pressure of the fluid, and forwards the fluid in a liquid state and with a lower pressure to the secondary cooling element, which transfers heat to the received fluid from the second electric components for evaporating the fluid.

Abstract: A cooling apparatus includes a generator for receiving a first heat load from first electric components, a evaporator for receiving a second heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a third cooling element arranged outside of the closed compartment for receiving heated fluid from at least one of the generator and evaporator and for transferring heat from the heated fluid to outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, a flow channel of the evaporator is configured to receive a fluid in a liquid state and a fluid in a gas state, where the fluid in the gas state reduces a partial pressure of the fluid in a liquid state and the temperature required for evaporating the fluid in the liquid state, such that the fluid in the liquid state is evaporated.

Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.