Abstract: A memory cell includes a transistor with a first source/drain terminal spaced apart from a second source/drain terminal with a semiconductor material; a gate terminal located proximate the semiconductor material such that an increase in a gate terminal voltage increases a conductivity of the semiconductor material; and the first source/drain terminal being connected in series to a negative differential resistance material.

Abstract: A method of shielding a memory device (110) from high write rates comprising receiving instructions to write data at a memory container (105), the memory controller (105) composing a cache (120) comprising a number of cache lines defining stored data, with the memory controller (105), updating a cache line in response to a write hit in the cache (120), and with the memory controller (105), executing the instruction to write data in response to a cache miss to a cache line within the cache (120) in which the memory controller (105) prioritizes for writing to the cache (120) over writing to the memory device (110).

Abstract: A switchable junction (600) having an intrinsic diode (634) formed with a voltage dependent resistor (640) is disclosed. The switchable junction comprises a first electrode (618), a second electrode (622), and a memristive matrix (620) configured to form an electrical interface (626) with the first electrode (618). The electrical interface has a programmable conductance. The voltage dependent resistor (640) is in electrical contact with the memristive matrix (620). The voltage dependent resistor is configured to form a rectifying diode interface (628) with the second electrode (622).

Abstract: A nonlinear memristor includes a bottom electrode, a top electrode, and an insulator layer between the bottom electrode and the top electrode. The insulator layer comprises a metal oxide. The nonlinear memristor further includes a switching channel within the insulator layer, extending from the bottom electrode toward the top electrode, and a nano-cap layer of a metal-insulator-transition material between the switching channel and the top electrode. The top electrode comprises the same metal as the metal in the metal-insulator-transition material.

Abstract: A display matrix may have a resistance switch and a display element formed on a common display substrate. The resistance switch may have a metal insulator transition (MIT) material that has a negative differential resistance (NDR) characteristic that exhibits a discontinuous resistance.

Abstract: A voltage-controlled switch comprises a first electrode, a second electrode, a switching junction situated between the first electrode and the second electrode, a conducting channel extending from adjacent to the origin through the switching junction and having a channel end situated near the second electrode, and a layer of dopants situated adjacent to an interface between the switching junction and the second electrode, wherein the dopants are capable of being activated to form switching centers.

Abstract: Word shift static random access memory (WS-SRAM) cell, word shift static random access memory (WS-SRAM) and method using the same employ dynamic storage mode switching to shift data. The WS-SRAM cell includes a static random access memory (SRAM) cell having a pair of cross-coupled elements to store data, a dynamic/static (D/S) mode selector to selectably switch the WS-SRAM cell between the dynamic storage mode and a static storage mode, and a column selector to selectably determine whether or not the WS-SRAM cell accepts shifted data. The WS-SRAM includes a plurality of WS-SRAM cells arranged in an array and a controller to shift data. The method includes switching a storage mode and activating a column selector of, coupling data from an adjacent memory cell to, and storing the coupled data in, a selected WS-SRAM cell.

Abstract: A printhead assembly for a printing device is provided that includes a printhead comprising non-volatile memory elements. The memory elements include memristive elements. Each memristive element includes an active region disposed between two electrodes. The active region includes a switching layer formed of a switching material capable of carrying a species of dopants and a conductive layer in electrical contact with the switching layer, the conductive layer being formed of a dopant source material that includes the species of dopants that are capable of drifting into the switching layer under an applied potential.

Abstract: A hierarchical on-chip memory (400) includes an area distributed CMOS layer (310) comprising input/output functionality and volatile memory and via array (325, 330), the area distributed CMOS layer (310) configured to selectively address the via array (325, 330). A crossbar memory (305) overlies the area distributed CMOS layer (310) and includes programmable crosspoint devices (315) which are uniquely accessed through the via array (325, 330). A method for utilizing hierarchical on-chip memory (400) includes storing frequently rewritten data in a volatile memory and storing data which is not frequently rewritten in a non-volatile memory (305), where the volatile memory is contained within an area distributed CMOS layer (310) and the non-volatile memory (305) is formed over and accessed through the area distributed CMOS layer (310).

Abstract: A metal-insulator phase transition (MIT) flip-flop employs a selected one of a pair of bi-stable operating states to represent a logic state of the MIT flip-flop. The MIT flip-flop includes an MIT device having a current-controlled negative differential resistance (CC-NDR) to provide the pair of bi-stable operating states. A bi-stable operating state of the pair is capable of being selected by a programing voltage. Once the bi-stable operating state is selected, the bi-stable operating state is capable of being maintained by a bias voltage applied to the MIT device.

Abstract: Shiftable memory employs ring registers to shift a contiguous subset of data words stored in the ring registers within the shiftable memory. A shiftable memory includes a memory having built-in word-level shifting capability. The memory includes a plurality of ring registers to store data words. A contiguous subset of data words is shiftable between sets of the ring registers of the plurality from a first location to a second location within the memory. The contiguous subset of data words has a size that is smaller than a total size of the memory. The memory shifts only data words stored inside the contiguous subset when the contiguous subset is shifted.

Abstract: A metal-insulator transition (MIT) latch includes a first electrode spaced apart from a second electrode and an MIT material disposed between said first and second electrodes. The MIT material comprises a negative differential resistance (NDR) characteristic that exhibits a discontinuous resistance change at a threshold voltage or threshold current. Either the first or second electrode is electrically connected to an electrical bias source regulated to set a resistance phase of the MIT material.

Abstract: A device (10) may include a semiconductor layer section (25) and a memory layer section (45) disposed above the semiconductor layer section (25). The semiconductor layer section (25) may include a processor (12; 412) and input/output block (16; 416), and the memory layer section (45) may include memristive memory (14; 300). A method of forming such device (10), and an apparatus (600) including such device (10) are also disclosed. Other embodiments are described and claimed.

Abstract: Decoder circuits having negative differential resistance (NDR) devices are described. In an example, a decoder circuit includes a plurality of input lines to receive select signals, a bias logic to provide a voltage bias, a plurality of output lines to provide output signals, and a plurality of metal-insulator-metal (MIM) threshold switches coupled to the plurality of input lines, the bias logic, and the plurality of output lines. Each of the plurality of MIM threshold switches operating as either a current-controlled positive or negative resistance to map an input logic state of the select signals to an output logic state of the output signals.

Abstract: Examples disclose a crossbar memory with a first crossbar to write data values corresponding to a word. The crossbar memory further comprises a second crossbar, substantially parallel to the first crossbar, to receive voltage for activation of data values across the second crossbar. Additionally, the examples of the crossbar memory provide an output line that interconnects with the crossbars at junctions, to read the data values at the junctions. Further, the examples of the crossbar memory provide a logic module to determine whether the second crossbar data values correspond to the word written in the first crossbar.

Abstract: A method to operate an integrated circuit includes operating a locally active memristive device in a locally reactive region of an operating domain where the device exhibits inductor-like behavior, such as a phase shift where a voltage across the device leads a current through the device.

Abstract: A memcapacitor device includes a memcapacitive matrix interposed between a first electrode and a second electrode. The memcapacitive matrix includes deep level dopants having a first decay time constant and shallow level dopants having a second decay time constant. The second decay time constant is substantially shorter than the first decay time constant. The capacitance of the memcapacitor device depends upon an initial voltage applied across the memcapacitive matrix and a time dependent change in capacitance of the memcapacitor device depends upon the first decay time constant. A method for forming a memcapacitive device is also provided.

Abstract: Storing data in a non-volatile latch may include applying a bias voltage to a memristor pair in electrical communication with at least one logic gate and applying a gate voltage to a transmission gate to allow an input voltage to be applied to the at least one logic gate where the input voltage is greater than the bias voltage and the input voltage determines a resistance state of the memristor pair.

Abstract: A memory device includes a first conductive layer, a second conductive layer, an in-bit current limiter including a voltage controlled negative differential resistance (VC-NDR) layer in electrical contact with the first conductive layer and a memristor element in electrical contact with the VC-NDR layer and the second conductive layer. A method for programming a memory device that comprises a VC-NDR device is also provided.

Abstract: A multilayer structure is disclosed that includes a conductive layer, a layer of a negative differential resistance (NDR) material disposed above the conductive layer, a layer M2 disposed above the NDR material, a second layer of NDR material disposed above layer M2, and a conductive layer disposed above the second NDR layer. Layer M2 can include a conductive material interspersed with regions of a dielectric material or a layer of the dielectric material and regions of the conductive material disposed above and below the dielectric material.