Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract: An integrated circuit (IC) package including an IC die and a conductive ink printed circuit layer electrically connected to the IC die.

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract: A method of making an electronic device having a discrete device mounted on a surface of an electronic die with both the discrete device and the die connected by heat cured conductive ink and covered with cured encapsulant including placing the discrete device on the die; and keeping the temperature of each of the discrete device and the die below about 200° C. Also disclosed is a method of electrically attaching a discrete device to a substrate that includes placing the device on the substrate, applying conductive ink that connects at least one terminal on the device to at least one contact on the substrate and curing the conductive ink. Also disclosed is an IC package with a discrete electrical device having electrical terminals; an electrical substrate having contact pads on a surface thereof; and cured conductive ink connecting at least one of the electrical terminals with at least one of the contact pads.

Abstract: One method of making an electronic assembly includes mounting one electrical substrate on another electrical substrate with a face surface on the one substrate oriented transversely of a face surface of the other substrate. The method also includes inkjet printing on the face surfaces a conductive trace that connects an electrical contact on the one substrate with an electrical connector on the other substrate. An electronic assembly may include a first substrate having a generally flat surface with a first plurality of electrical contacts thereon; a second substrate having a generally flat surface with a second plurality of electrical contacts thereon, the surface of the second substrate extending transversely of the surface of said first substrate; and at least one continuous conductive ink trace electrically connecting at least one of the first plurality of electrical contacts with at least one of the second plurality of electrical contacts.

Abstract: In a method and system for transferring at least one of power and ground signal between a die and a package base of a semiconductor device, a connector is formed there between. The connector, which is disposed above the die attached to the package base, includes a center pad electrically coupled to the die by a plurality of conductive bumps and a finger extending outward from the center pad towards the package base. The finger is electrically coupled to the package base by a conductive pad. A plurality of bond wires are formed to electrically couple the package base and the die. A resistance of a conductive path via the connector is much less than a resistance of a conductive path via any one of the plurality of bond wires to facilitate an efficient transfer of the at least one of power and ground signal.

Abstract: In a method and system for transferring at least one of power and ground signal between a die and a package base of a semiconductor device, a connector is formed there between. The connector, which is disposed above the die attached to the package base, includes a center pad electrically coupled to the die by a plurality of conductive bumps and a finger extending outward from the center pad towards the package base. The finger is electrically coupled to the package base by a conductive pad. A plurality of bond wires are formed to electrically couple the package base and the die. A resistance of a conductive path via the connector is much less than a resistance of a conductive path via any one of the plurality of bond wires to facilitate an efficient transfer of the at least one of power and ground signal.

Abstract: A method and structure for an unencapsulated wafer section such as a wafer chip scale package (WCSP) includes a plurality of interconnect terminals and a pad metallization structure on an active surface of a WCSP chip. An area of the pad metallization structure is larger than an area of one of the interconnect terminals and, in an embodiment, larger than an area of two interconnect terminals. A plurality of conductive interconnects are attached to the plurality of interconnect terminals. The conductive interconnects are placed in contact with first lands of a supporting substrate, which can be a printed circuit board. Subsequently, a conductive mass is electrically coupled with a second land of the receiving substrate, with the second land being connected to at least one via of the supporting substrate which can, in turn, be connected to a plane of the supporting substrate. Improved thermal characteristics can result.

Abstract: In a method and system for transferring at least one of power and ground signal between a die and a package base of a semiconductor device, a connector is formed there between. The connector, which is disposed above the die attached to the package base, includes a center pad electrically coupled to the die by a plurality of conductive bumps and a finger extending outward from the center pad towards the package base. The finger is electrically coupled to the package base by a conductive pad. A plurality of bond wires are formed to electrically couple the package base and the die. A resistance of a conductive path via the connector is much less than a resistance of a conductive path via any one of the plurality of bond wires to facilitate an efficient transfer of the at least one of power and ground signal.