Abstract: A method is provided for assessing and categorizing temporomandibular disorder (TMD). In some cases, the method can include receiving data representing a potential for TMD of a patient. The method can include processing the data to identify an indicator of the TMD. The method can include identifying a treatment recommendation based on the indicator of the TMD. The method can include providing the treatment recommendation for display on a user device.

Abstract: A method is provided for measuring and categorizing gingival recession. In some cases, the method can include receiving intraoral scan data of a dentition of a patient. The method can include segmenting the intraoral scan data into a plurality of oral structures that comprise at least a tooth in the dentition of the patient, a gingiva, and a representation of an intersection between a first portion of the tooth and a second portion of the tooth. The method can include determining a gingival recession measurement indicative of a distance between the gingiva and the intersection. The method can include providing, to the user device, the gingival recession measurement.

Abstract: In one example in accordance with the present disclosure, a fluid ejection system is described. The fluid ejection system includes a frame to retain a number of fluid ejection devices. Each fluid ejection device includes a reservoir disposed on a first side of the frame and a fluid ejection die disposed on an opposite side of the frame. Each fluid ejection die includes 1) a fluid feed slot formed in a substrate to receive fluid from the reservoir, 2) an array of nozzles formed in the substrate to eject fluid, and 3) an ejection adjustment system to selectively adjust an amount of fluid ejected from the fluid ejection devices.

Abstract: An example microfluidic device comprises a microfluidic channel fluidically coupled to a reservoir containing a fluid, a first sensor disposed within the microfluidic channel, a second sensor disposed within the microfluidic channel, a first dielectrophoretic (DEP) actuator disposed within the microfluidic channel between the first sensor and the second sensor, and a fluid ejection device fluidically coupled to the microfluidic channel.

Abstract: Various aspects of the subject technology relate to systems, methods, and machine-readable media for rendering audio via a game engine for a game. Various aspects may include determining sound source reverb metrics and listener reverb metrics. Aspects may include determining reverbs within a reverb possibility space for all rooms or spaces of the game rendered by the game engine. Aspects may also include determining sound tuning parameters describing reverb attenuation over distance. Aspects may include calculating acoustic parameters based on the reverb metrics, relative positions, and sound tuning parameters. Aspects may include rendering audio according to a fit of determined reverbs to the acoustic parameters.

Abstract: Digital image segmentation is provided. The method comprises training a neural network for image segmentation with a labeled training dataset from a first domain, wherein a subset of nodes in the neural net are dropped out during training. The neural network receives image data from a second, different domain. A vector of N values that sum to 1 is calculated for each image element, wherein each value represents an image segmentation class. A label is assigned to each image element according to the class with the highest value in the vector. Multiple inferences are performed with active dropout layers for each image element, and an uncertainty value is generated for each image element. Uncertainty is resolved according to expected characteristics. The label of any image element with an uncertainty above a threshold is replaced with a new label corresponding to a segmentation class based on domain knowledge.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first insulating member, and a nitride member. The third electrode includes a first electrode portion. The first electrode portion is between the first and second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The first semiconductor portion is electrically connected with the first electrode. The second semiconductor portion is electrically connected with the second electrode. The first insulating member includes a first insulating region. The first insulating region is between the third partial region and the first electrode portion. The nitride member includes a first nitride region.

Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.

Abstract: Various aspects of the subject technology relate to systems, methods, and machine-readable media for rendering audio via a game engine for a game. Various aspects may include determining sound source reverb metrics and listener reverb metrics. Aspects may include determining reverbs within a reverb possibility space for all rooms or spaces of the game rendered by the game engine. Aspects may also include determining sound tuning parameters describing reverb attenuation over distance. Aspects may include calculating acoustic parameters based on the reverb metrics, relative positions, and sound tuning parameters. Aspects may include rendering audio according to a fit of determined reverbs to the acoustic parameters.

Abstract: In one example in accordance with the present disclosure, a particle detection system is described. The particle detection system includes a microfluidic channel through which fluid is to flow. The fluid includes particles. The particle detection system also includes a sensing circuit to output a resonant frequency. The sensing circuit includes a pair of electrodes disposed within the microfluidic channel. Contents of a volume between the pair of electrodes changes a capacitance between the pair of electrodes. A change in the capacitance changes the resonant frequency output by the sensing circuit. The particle detection system also includes a controller to determine the contents of the volume based on the resonant frequency.

Abstract: In one example in accordance with the present disclosure, a fluidic ejection controller is described. The fluidic ejection controller includes a firing board to pass electrical control signals for ejecting fluid from a fluidic ejection device. An ejection board of the fluidic ejection controller is electrically coupled to, and selectively removable from, the firing board to pass the electrical control signals to the fluidic ejection device. Electrical pins are disposed on the ejection board in a pattern that matches a pattern of electrical pads on the fluidic ejection device. The electrical pins interface with corresponding electrical pads to pass the electrical control signals from the ejection board to the fluidic ejection device.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor region, a first electrode, and a first insulating member. The first semiconductor region includes Alz1Ga1-z1N (0?z1<1). The first semiconductor region includes a first partial region. The first insulating member includes a first insulating portion between the first partial region and the first electrode. The first insulating portion includes a first insulating region and a second insulating region. The second insulating region is provided between the first insulating region and the first electrode. The first insulating region includes Al1-x1Six1O (x1<0.5). The second insulating region includes Al1-x2Six2O (0.5<x2).

Abstract: A method may include maintaining a sample comprising an ionic species and an optical indicator at an elevated temperature above 25° C. on a semi-conductive microfluidic die during an incubation period, intermittently interrogating the sample with an interrogating light during the incubation period and sensing a response of the sample to the interrogating light, wherein the sample is interrogated with the interrogating light only during those times at which the sample is being sensed.

Abstract: According to the embodiment of the invention, the semiconductor device includes a semiconductor member, a first electrode, a second electrode, a third electrode, a first conductive member, and a first insulating member. The first semiconductor member includes a first semiconductor region, a second semiconductor region, and a third semiconductor region. The second semiconductor region includes one of a first material and a second material. The third semiconductor region is provided between at least a part of the first semiconductor region and the second semiconductor region. The first electrode is electrically connected with the first semiconductor region. The second electrode is electrically connected with the second semiconductor region. At least a part of the third semiconductor region is between an other portion of the third electrode and the first conductive member. At least a part of the first insulating member is between the third electrode and the semiconductor member.

Abstract: According to one embodiment, a semiconductor device includes first, second, third electrodes, a semiconductor member, and a first compound member. The third electrode is between the first and second electrodes in a first direction from the first to second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first, second, third, fourth, and fifth partial regions. A second direction from the first partial region to the first electrode crosses the first direction. The fourth partial region is between the first and third partial regions in the first direction. The fifth partial region is between the third and second partial regions in the first direction. The second semiconductor region includes first and second semiconductor portions. The first compound member includes first, second and third compound regions.

Abstract: According to one embodiment, a semiconductor device includes first to third electrodes, a semiconductor member, a first insulating member, and a nitride member. The third electrode includes a first electrode portion. The first electrode portion is between the first and second electrodes. The semiconductor member includes first and second semiconductor regions. The first semiconductor region includes first to fifth partial regions. The second semiconductor region includes first and second semiconductor portions. The first semiconductor portion is electrically connected with the first electrode. The second semiconductor portion is electrically connected with the second electrode. The first insulating member includes a first insulating region. The first insulating region is between the third partial region and the first electrode portion. The nitride member includes a first nitride region.

Abstract: According to one embodiment, a semiconductor device includes first, second, and third electrodes, a semiconductor member, and a first insulating member. The semiconductor member includes a first face and a first side face. A third insulating region is between the first face and the third electrode in a second direction. A first insulating region is between the first side face and the third electrode in a first direction. The first side face includes first and second side face portions. The first side face portion is between the first face and the second side face portion in the second direction. At least a first angle between a first plane including the first face and the first side face portion and a second angle between the first plane and the second side face portion is less than 90 degrees. The second angle is different from the first angle.

Abstract: According to one embodiment, a semiconductor device includes a first semiconductor region, a first electrode, and a first insulating member. The first semiconductor region includes Alz1Ga1-z1N (0?z1<1). The first semiconductor region includes a first partial region. The first insulating member includes a first insulating portion between the first partial region and the first electrode. The first insulating portion includes a first insulating region and a second insulating region. The second insulating region is provided between the first insulating region and the first electrode. The first insulating region includes Al1-x1Six1O (x1<0.5). The second insulating region includes Al1-x2Six2O (0.5<x2).

Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.