Integrated circuit

- Hewlett Packard
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Description

FIG. 1 is perspective view, taken from a front, lower-right elevation of a sensing and dispensing integrated circuit;

FIG. 2 is a front plan view of the sensing and dispensing integrated circuit shown in FIG. 1;

FIG. 3 is a back plan view of the sensing and dispensing integrated circuit shown in FIG. 1;

FIG. 4 is a right side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;

FIG. 5 is a left side plan view of the sensing and dispensing integrated circuit shown in FIG. 1;

FIG. 6 is a top plan view of the sensing and dispensing integrated circuit shown in FIG. 1; and,

FIG. 7 is a bottom plan view of the sensing and dispensing integrated circuit shown in FIG. 1.

Broken lines shown in the drawings represent portions of the integrated flex circuit that form no part of the claimed design.

Claims

The ornamental design for an integrated circuit, as shown and described.

Referenced Cited
U.S. Patent Documents
D440209 April 10, 2001 Kang
D457146 May 14, 2002 Yamamoto
D466093 November 26, 2002 Ebihara
D485536 January 20, 2004 Dang
D570307 June 3, 2008 Kobayashi
D597504 August 4, 2009 Kobayashi
D612347 March 23, 2010 Yokota
D639756 June 14, 2011 Greene, Jr.
D642546 August 2, 2011 Greene, Jr.
D720311 December 30, 2014 Shiroyama
D799438 October 10, 2017 Takahashi
D883240 May 5, 2020 Fathauer
D956707 July 5, 2022 Yamauchi
Patent History
Patent number: D1022931
Type: Grant
Filed: Aug 2, 2021
Date of Patent: Apr 16, 2024
Assignee: Hewlett-Packard Development Company, L.P. (Spring, TX)
Inventors: Vignesh Kannan (Corvallis, OR), Joshua M. Yu (Corvallis, OR), Matthew David Smith (Corvallis, OR), Jeffrey A. Nielsen (Corvallis, OR), Kenneth Duda (Corvallis, OR)
Primary Examiner: Amy C Wierenga
Assistant Examiner: Angel R Marrero-Arce
Application Number: 29/801,988