Integrated circuit
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Broken lines shown in the drawings represent portions of the integrated flex circuit that form no part of the claimed design.
Claims
The ornamental design for an integrated circuit, as shown and described.
D440209 | April 10, 2001 | Kang |
D457146 | May 14, 2002 | Yamamoto |
D466093 | November 26, 2002 | Ebihara |
D485536 | January 20, 2004 | Dang |
D570307 | June 3, 2008 | Kobayashi |
D597504 | August 4, 2009 | Kobayashi |
D612347 | March 23, 2010 | Yokota |
D639756 | June 14, 2011 | Greene, Jr. |
D642546 | August 2, 2011 | Greene, Jr. |
D720311 | December 30, 2014 | Shiroyama |
D799438 | October 10, 2017 | Takahashi |
D883240 | May 5, 2020 | Fathauer |
D956707 | July 5, 2022 | Yamauchi |
Type: Grant
Filed: Aug 2, 2021
Date of Patent: Apr 16, 2024
Assignee: Hewlett-Packard Development Company, L.P. (Spring, TX)
Inventors: Vignesh Kannan (Corvallis, OR), Joshua M. Yu (Corvallis, OR), Matthew David Smith (Corvallis, OR), Jeffrey A. Nielsen (Corvallis, OR), Kenneth Duda (Corvallis, OR)
Primary Examiner: Amy C Wierenga
Assistant Examiner: Angel R Marrero-Arce
Application Number: 29/801,988