Abstract: A system for optically stabilizing the projection light from a vehicle. The system includes a light source for generating and emitting light, an aperture, and a spatial light modulator for altering an illumination pattern of the light. The spatial light modulator disposed along an optical path extending from the light source to the aperture, wherein the light projects from the aperture. The system also includes an inertial-sensing. The inertial-sensing unit generates signals representing a position of the vehicle, an orientation of the vehicle, or both. The system further includes a control unit. The control unit receives signals from the inertial-sensing unit to determine changes in position and/or orientation of the vehicle relative to the road and sends signals to the spatial light modulator adjust an illumination pattern of the light to steer the light to a nominal value, defined by a vehicle in a level plane relative to a road system.

Abstract: Some embodiments provide an autonomous navigation system which enables autonomous navigation of a vehicle along one or more portions of a driving route based on monitoring, at the vehicle, various features of the route as the vehicle is manually navigated along the route to develop a characterization of the route. The characterization is progressively updated with repeated manual navigations along the route, and autonomous navigation of the route is enabled when a confidence indicator of the characterization meets a threshold indication. Characterizations can be updated in response to the vehicle encountering changes in the route and can include a set of driving rules associated with the route, where the driving rules are developed based on monitoring the navigation of one or more vehicles of the route. Characterizations can be uploaded to a remote system which processes data to develop and refine route characterizations and provide characterizations to one or more vehicles.

Abstract: Some embodiments provide a system which includes a layered transparent surface which includes a UV absorption layer configured to be located between a user environment and an external environment and a phosphor layer configured to be located between the user environment and the UV absorption layer. An image projection system can project an ultraviolet image upon the phosphor layer, which can generate a visual image based on a fluorescent reaction of the phosphor layer to the ultraviolet image which can be perceived by a user in the user environment. The image projection system can include a plurality of image projection systems which can project separate images on separate projection fields, which can result in the phosphor layer generating an image which can be perceived by a user, in the user environment, as a stereoscopic image.

Abstract: An ultrasonic biometric scanner includes an ultrasonic multiple scan element array with multiple scan elements. The array includes piezoelectric material such as lead zirconate titanate or polyvinylidene difluoride with a first electrode on a first surface and a second electrode on a second, opposite surface. At least one of the first electrode or the second electrode include multiple electrodes wherein the number of the multiple electrodes corresponds to a number of the multiple scan elements. A substrate is electrically coupled to the second electrode and/or the first electrode. A cover may be positioned over the first electrode. The cover has an acoustic impedance matching ultrasonic signals emitted by the piezoelectric material.

Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.

Abstract: A light detection and ranging (LIDAR) system has an emitter which produces a sequence of outgoing pulses of coherent collimated light that transmitted in a given direction, a mirror system having a scanning mirror that is positioned to deflect the outgoing pulse sequence towards a scene, and a detector collocated with the emitter and aimed to detect a sequence of incoming pulses being reflections of the outgoing pulses that are returning from said given direction and have been deflected by the scanning mirror. An electronic controller communicates with the emitter and the detector and controls the scanning mirror, so that the outgoing pulses scan the scene and the controller computes a radial distance or depth for each pair of outgoing and incoming pulses and uses the computed radial distance to provide a scanned 3D depth map of objects in the scene. Other embodiments are also described.

Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.

Abstract: An electronic device may be provided with electronic components such as buttons and environmental sensors. An environmental sensor may be temperature sensor for gathering temperature data associated with the environment surrounding the device. The temperature sensor may be mounted to a button member for the button. The button member may be an actuating member that moves within an opening in a device housing and that extends beyond an outer surface of the housing into the surrounding environment. The button member may be arranged so that an internal electronic switch is activated when the button member is moved within the opening. The button member may be thermally isolated from other device structures using insulating material on the button member. The button member may be formed from a thermally conductive material that transmits the temperature of environmental materials that contact the button member to the temperature sensor.

Abstract: One embodiment of a perimeter trench sensor array package can include a thinned substrate device that includes a perimeter trench formed near the edges of the device that can be configured to be thinner than a central portion of the thinned substrate device. The perimeter trench can include bond pads that can couple to electrical elements included in the thinned substrate device. The thinned substrate device can be attached to a core layer that can in turn support one or more resin layers. The core layer and the resin layers can form a printed circuit board assembly, a flex cable assembly or a stand-alone module.

Abstract: An electronic device may be provided with environmental sensors. Environmental sensors may include one or more environmental sensor components and one or more acoustic components. Acoustic components may include a speaker or a microphone. Environmental sensor components may include a temperature sensor, a pressure sensor, a humidity sensor, or other sensors or combinations of sensors for sensing attributes of the environment surrounding the device. The environmental sensor may have an enclosure with an opening. The enclosure may be formed from a rigid support structure and a portion of a printed circuit. The opening may be formed in the rigid support structure or the printed circuit. The opening in the enclosure for the environmental sensor may be aligned with an opening in an outer structural member for the device. The outer structural member may be a housing structure or a cover layer for a device display.

Abstract: A semiconductor strain gauge may be incorporated into a flexible printed circuit. The semiconductor strain gauge may be mounted in an opening in the flexible printed circuit. Electrical connections such as wire bonds may couple the semiconductor strain gauge to metal traces on a flexible printed circuit substrate in the flexible printed circuit. A flexible printed circuit opening may be filled with an encapsulant that encapsulates a semiconductor strain gauge. Vias may be formed through the encapsulant to contact the semiconductor strain gauge. Metal traces that run across the surface of the substrate and the encapsulant may contact the vias to form paths to the semiconductor strain gauge. A semiconductor strain gauge may be mounted on a substrate and covered with dielectric. Metal traces in a redistribution layer in the dielectric may overlap the semiconductor strain gauge and make contact to the semiconductor strain gauge.

Abstract: An electronic device may be provided with a flexible printed circuit. The flexible printed circuit may have layers of metal and dielectric. Strain gauge resistors may be formed from a strain gauge metal such as constantan. The strain gauge metal may be formed within the flexible printed circuit layers. A strain gauge may include strain gauge circuitry coupled to a strain gauge bridge circuit. Strain gauge resistors for the bridge circuit may be formed from traces that follow parallel meandering paths in the flexible printed circuit layers. A component such as a fingerprint sensor may overlap the strain gauge resistors. Strain gauge resistors may be formed in different overlapping metal layers in the flexible printed circuit layers or may be formed from the same metal layer. Electroplating techniques may be used to form metal traces to which solder balls or wire bonds are coupled.

Abstract: A direct multiple substrate die assembly can include a first and a second substrate, wherein each substrate can include at least one interlocking edge feature. An electrical interconnection area can be formed adjacent to or within the interlocking edge feature on each substrate and can be configured to couple one or more electrical signals between the substrates. In one embodiment, the interlocking edge feature can include one or more keying features that can enable accurate alignment between the substrates. In yet another embodiment, the direct multiple substrate die assembly can be mounted out of plane with respect to a supporting substrate.

Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.

Abstract: One embodiment for forming a shaped substrate for an electronic device can form a shaped perimeter to define the substrate shape on the surface of a substrate. The shaped perimeter can extend at least part way into the substrate. A subsequent thinning process can remove substrate material and expose the shaped perimeter effectively forming shaped dies from the substrate.

Abstract: Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.

Abstract: A personal audio device has a bone conduction pickup transducer, having a housing of which a rigid outer wall has an opening formed therein. A volume of yielding material fills the opening in the rigid outer wall. An electronic vibration sensing element is embedded in the volume of yielding material. The housing is shaped, and the opening is located, so that the volume of yielding material comes into contact with an ear or cheek of a user who is using the personal audio device. Other embodiments are also described and claimed.

Abstract: A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the signal trench and can couple to sensor signal pads. Bond wires can be attached to the conductive layers and can be arranged to be below a surface plane of the sensor. The sensor array package can be embedded in a printed circuit board enabling the bond wires to terminate at other conductors within the printed circuit board.

Abstract: An electronic device may be provided with proximity sensor capabilities for monitoring for the presence of nearby external objects. The electronic device may make temperature measurements such as measurements involving the monitoring of nearby objects for emitted blackbody light indicative of whether or not the external object is a heat-emitting object such as a human body part. The same sensor that is used in gathering temperature readings may be used in gathering proximity sensor data or separate temperature sensor and proximity sensor detector structures may be used. Motion sensor capabilities may be provided using sensor structures having an array of heat sensing elements. Signals from the array of heat sensing elements may be used in making temperature measurements and in gathering proximity sensor readings. Sensor structures may operate at wavelengths longer than 3 microns such as wavelengths from 3-5 microns or 10-15 microns.

Abstract: A method of unlocking a locked device includes receiving a device identifier over a wireless communication protocol, determining if the device identifier is associated with a list of trusted devices, transmitting a request to generate an acoustic signal over the wireless communication protocol based on the determination, receiving the acoustic signal as an audio sound generated external to the locked device, estimating a distance between a source of the audio sound and the locked device, and unlocking the locked device based on the estimation.