Patents by Inventor Matthew I. Egbe
Matthew I. Egbe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160152930Abstract: Stripping and cleaning compositions suitable for the removal of film resists include about 2-55% by weight of at least one alkanolamine or at least one morpholine or mixtures thereof; about 20-94% by weight of at least one organic solvent; and about 0.5-60% by weight water based on the total weight of the composition.Type: ApplicationFiled: February 8, 2016Publication date: June 2, 2016Applicant: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Aiping Wu, Madhukar Bhaskara Rao
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Patent number: 9217929Abstract: Compositions containing certain organic solvents comprising at least 50% by weight of a glycol ether and a quaternary ammonium compound are capable of removing residues such as photoresist and/or etching residue from an article.Type: GrantFiled: July 22, 2004Date of Patent: December 22, 2015Assignee: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Matthew I. Egbe, Denise Geitz
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Publication number: 20140100151Abstract: Stripping and cleaning compositions suitable for the removal of film resists include about 2-55% by weight of at least one alkanolamine or at least one morpholine or mixtures thereof; about 20-94% by weight of at least one organic solvent; and about 0.5-60% by weight water based on the total weight of the composition.Type: ApplicationFiled: October 1, 2013Publication date: April 10, 2014Applicant: AIR PRODUCTS AND CHEMICALS INC.Inventors: Matthew I. Egbe, Aiping Wu, Madhukar Bhaskara Rao
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Patent number: 8440599Abstract: A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.Type: GrantFiled: August 25, 2011Date of Patent: May 14, 2013Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza, Thomas Michael Weider, Jennifer May Rieker
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Patent number: 8357646Abstract: The present invention, in a preferred embodiment, is a photoresist stripper formulation, comprising: Hydroxylamine ; Water; a solvent selected from the group consisting of dimethylsulfoxide; N-methylpyrrrolidine; dimethylacetamide; dipropylene glycol monomethyl ether; monoethanolamine and mixtures thereof; a base selected from the group consisting of choline hydroxide, monoethanolamine, tetramethylammonium hydroxide; aminoethylethanolamine and mixtures thereof; a metal corrosion inhibitor selected from the group consisting of catechol, gallic acid, lactic acid, benzotriazole and mixtures thereof; and a bath life extending agent selected from the group consisting of glycerine, propylene glycol and mixtures thereof. The present invention is also a method for using formulations as exemplified in the preferred embodiment.Type: GrantFiled: February 27, 2009Date of Patent: January 22, 2013Assignee: Air Products and Chemicals, Inc.Inventors: Wen Dar Liu, Yi Chia Lee, Archie Liao, Madhukar Bhaskara Rao, Matthew I. Egbe, Chimin Sheu, Michael Walter Legenza
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Publication number: 20120295828Abstract: Compositions containing certain organic solvents comprising at least 50% by weight of a glycol ether and a quaternary ammonium compound are capable of removing residues such as photoresist and/or etching residue from an article.Type: ApplicationFiled: July 31, 2012Publication date: November 22, 2012Applicant: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Denise Geitz
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Patent number: 8231733Abstract: The present invention relates to a method used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. In one aspect, the method involves contacting the substrate with a composition are comprised of a water soluble organic solvent, a sulfonic acid and water.Type: GrantFiled: May 27, 2005Date of Patent: July 31, 2012Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Darryl W. Peters
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Patent number: 8110535Abstract: The present invention relates to semi-aqueous formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, as well as contaminations. The formulation comprises: an alkanolamine, a water miscible organic co-solvent, a quarternary ammonium compound, a non-free acid functionality corrosion inhibitor, and remainder water. The pH is greater than 9.Type: GrantFiled: July 22, 2010Date of Patent: February 7, 2012Assignee: Air Products and Chemicals, Inc.Inventor: Matthew I. Egbe
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Publication number: 20110311921Abstract: A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.Type: ApplicationFiled: August 25, 2011Publication date: December 22, 2011Applicant: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza, Thomas Michael Wieder, Jennifer May Rieker
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Patent number: 8030263Abstract: A composition comprising one or more water soluble organic solvents comprising a glycol ether; water; a fluoride containing compound provided that if the fluoride containing compound is ammonium fluoride than no additional fluoride containing compound is added to the composition; optionally a quaternary ammonium compound; and optionally a corrosion inhibitor is disclosed herein that is capable of removing residues from an article such as photoresist and/or etching residue. Also disclosed herein is a method for removing residues from an article using the composition disclosed herein.Type: GrantFiled: June 20, 2005Date of Patent: October 4, 2011Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza, Thomas Michael Wieder, Jennifer May Rieker
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Publication number: 20110034362Abstract: The present invention relates to semi-aqueous formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, as well as contaminations. The formulation comprises: an alkanolamine, a water miscible organic co-solvent, a quarternary ammonium compound, a non-free acid functionality corrosion inhibitor, and remainder water. The pH is greater than 9.Type: ApplicationFiled: July 22, 2010Publication date: February 10, 2011Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventor: Matthew I. Egbe
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Patent number: 7700533Abstract: The present invention relates to an aqueous cleaning composition used to remove unwanted organic and inorganic residues and contaminants from a substrate such as, for example, a semiconductor substrate. The cleaning composition comprises from about 0.01% to about 40% by weight of a salt selected from a guanidinium salt, an acetamidinium salt, a formamidinium salt, and mixtures thereof; water; and optionally a water soluble organic solvent. Compositions according to the present invention are free of an oxidizer and abrasive particles and are capable of removing residues from a substrate and, particularly, a substrate having silicon-containing BARC and/or photoresist residue.Type: GrantFiled: June 14, 2006Date of Patent: April 20, 2010Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza
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Patent number: 7687447Abstract: The present invention relates to semi-aqueous compositions and the method using same, to remove highly cross-linked resists and etch-residues. The compositions are comprised of aminobenzenesulfonic acid, water miscible organic solvent and water.Type: GrantFiled: March 13, 2008Date of Patent: March 30, 2010Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza, Dana L. Durham
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Patent number: 7674755Abstract: A formulation for removing photoresist, ion implanted photoresist, etch residue or BARC comprises: an ammonium hydroxide and a 2-aminobenzothiazole, remainder water. Preferably the formulation comprises: tetramethyl ammonium hydroxide, tolyltriazole, propylene glycol, 2-aminobenzothiazole, dipropylene glycol monomethyl ether, remainder water; more preferably: tetramethyl ammonium hydroxide 1-15 wt %, tolyltriazole 1-5 wt %, propylene glycol 5-15 wt %, 2-aminobenzothiazole 1-10 wt %; dipropylene glycol monomethyl ether 20-45 wt %, remainder water. The invention is also a method of removing materials selected from the group consisting of photoresist, etch residue, BARC and combinations thereof, from a substrate comprising: applying a formulation, described above, to the substrate to remove the material from the substrate.Type: GrantFiled: November 21, 2006Date of Patent: March 9, 2010Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Michael Walter Legenza
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Publication number: 20090233827Abstract: The present invention relates to semi-aqueous compositions and the method using same, to remove highly cross-linked resists and etch-residues. The compositions are comprised of aminobenzenesulfonic acid, water miscible organic solvent and water.Type: ApplicationFiled: March 13, 2008Publication date: September 17, 2009Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Matthew I. Egbe, Michael Walter Legenza, Dana L. Durham
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Publication number: 20090229629Abstract: The present invention is a chemical stripper formulation for removing photoresist and the residue of etching and ashing of electronic device substrates, comprising: deionized water, acetic acid, polyethylene glycol, dipropylene glycol monomethyl ether and ammonium fluoride. The present invention is also a process for removing photoresist and the residue of etching and ashing of electronic device substrates by contacting the substrate with a formulation, comprising: deionized water, acetic acid, polyethylene glycol, dipropylene glycol monomethyl ether and ammonium fluoride.Type: ApplicationFiled: March 9, 2009Publication date: September 17, 2009Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Yi-Chia Lee, Wen Dar Liu, Archie Liao, Matthew I. Egbe, Madhukar Bhaskara Rao, Michael Walter Legenza, Chimin Sheu
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Publication number: 20090227483Abstract: The present invention, in a preferred embodiment, is a photoresist stripper formulation, comprising: Hydroxylamine ; Water; a solvent selected from the group consisting of dimethylsulfoxide; N-methylpyrrrolidine; dimethylacetamide; dipropylene glycol monomethyl ether; monoethanolamine and mixtures thereof; a base selected from the group consisting of choline hydroxide, monoethanolamine, tetramethylammonium hydroxide; aminoethylethanolamine and mixtures thereof; a metal corrosion inhibitor selected from the group consisting of catechol, gallic acid, lactic acid, benzotriazole and mixtures thereof; and a bath life extending agent selected from the group consisting of glycerine, propylene glycol and mixtures thereof. The present invention is also a method for using formulations as exemplified in the preferred embodiment.Type: ApplicationFiled: February 27, 2009Publication date: September 10, 2009Applicant: AIR PRODUCTS AND CHEMICALS, INC.Inventors: Wen Dar Liu, Yi Chia Lee, Archie Liao, Madhukar Bhaskara Rao, Matthew I. Egbe, Chimin Sheu, Michael Walter Legenza
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Patent number: 7361631Abstract: A composition and method using same for removing photoresist and/or processing residue from a substrate are described herein. In one aspect, there is provided a composition for removing residue consisting essentially of: an acidic buffer solution having an acid selected from a carboxylic acid or a polybasic acid and an ammonium salt of the acid in a molar ratio of acid to ammonium salt ranging from 10:1 to 1:10; an organic polar solvent that is miscible in all proportions in water; a fluoride, and water wherein the composition has a pH ranging from about 3 to about 7.Type: GrantFiled: September 15, 2004Date of Patent: April 22, 2008Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Jennifer M. Rieker, Darryl W. Peters, Irl E. Ward
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Publication number: 20070149430Abstract: A formulation for removing photoresist, ion implanted photoresist, etch residue or BARC comprises: an ammonium hydroxide and a 2-aminobenzothiazole, remainder water. Preferably the formulation comprises: tetramethyl ammonium hydroxide, tolyltriazole, propylene glycol, 2-aminobenzothiazole, dipropylene glycol monomethyl ether, remainder water; more preferably: tetramethyl ammonium hydroxide 1-15 wt %, tolyltriazole 1-5 wt %, propylene glycol 5-15 wt %, 2-aminobenzothiazole 1-10 wt %; dipropylene glycol monomethyl ether 20-45 wt %, remainder water. The invention is also a method of removing materials selected from the group consisting of photoresist, etch residue, BARC and combinations thereof, from a substrate comprising: applying a formulation, described above, to the substrate to remove the material from the substrate.Type: ApplicationFiled: November 21, 2006Publication date: June 28, 2007Inventors: Matthew I. Egbe, Michael Walter Legenza
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Patent number: 6943142Abstract: The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water.Type: GrantFiled: January 9, 2002Date of Patent: September 13, 2005Assignee: Air Products and Chemicals, Inc.Inventors: Matthew I. Egbe, Darryl W. Peters