Patents by Inventor Matthew J. Traverso

Matthew J. Traverso has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10320151
    Abstract: The embodiments herein describe a single-frequency laser source (e.g., a distributed feedback (DFB) laser or distributed Bragg reflector (DBR) laser) that includes a feedback grating or mirror that extends along a waveguide. The grating may be disposed over a portion of the waveguide in an optical gain region in the laser source. Instead of the waveguide or cavity being linear, the laser includes a U-turn region so that two ends of the waveguide terminate at the same facet. That facet is coated with an anti-reflective (AR) coating.
    Type: Grant
    Filed: April 13, 2018
    Date of Patent: June 11, 2019
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew J. Traverso, Dominic F. Siriani, Mark Webster
  • Patent number: 10145758
    Abstract: Embodiments herein describe techniques for testing optical components in a photonic chip using a testing structure disposed in a sacrificial region of a wafer. In one embodiment, the wafer is processed to form multiple photonic chips integrated into the wafer. While forming optical components in the photonic chips (e.g., modulators, detectors, waveguides, etc.), a testing structure can be formed in one or more sacrificial regions in the wafer. In one embodiment, the testing structure is arranged near an edge coupler in the photonic chip such that an optical signal can be transferred between the photonic chip and the testing structure. Moreover, the testing structure has a grating coupler disposed at or near a top surface of the wafer which permits optical signals to be transmitted into, or received from, the grating coupler when an optical probe is arranged above the grating coupler.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: December 4, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: Matthew J. Traverso, Ravi S. Tummidi, Mark A. Webster, Sandeep Razdan
  • Publication number: 20180313718
    Abstract: Embodiments herein describe techniques for testing optical components in a photonic chip using a testing structure disposed in a sacrificial region of a wafer. In one embodiment, the wafer is processed to form multiple photonic chips integrated into the wafer. While forming optical components in the photonic chips (e.g., modulators, detectors, waveguides, etc.), a testing structure can be formed in one or more sacrificial regions in the wafer. In one embodiment, the testing structure is arranged near an edge coupler in the photonic chip such that an optical signal can be transferred between the photonic chip and the testing structure. Moreover, the testing structure has a grating coupler disposed at or near a top surface of the wafer which permits optical signals to be transmitted into, or received from, the grating coupler when an optical probe is arranged above the grating coupler.
    Type: Application
    Filed: April 28, 2017
    Publication date: November 1, 2018
    Applicants: Cisco Technology, Inc., Cisco Technology, Inc.
    Inventors: Matthew J. TRAVERSO, Ravi S. TUMMIDI, Mark A. WEBSTER, Sandeep RAZDAN
  • Patent number: 9964719
    Abstract: The present disclosure discloses an assembly. The assembly includes a photonic chip and an electrical chip disposed side by side. The assembly also includes mold compound that encapsulates the photonic chip and the electrical chip. The assembly further includes a redistribution layer (RDL) that extends across the top surface of the photonic chip and the top surface of the electrical chip and connects the photonic chip with the electrical chip. Moreover, the photonic chip includes an exposed optical interface for transmitting optical signals between the photonic chip and an external optical device.
    Type: Grant
    Filed: April 28, 2017
    Date of Patent: May 8, 2018
    Assignee: Cisco Technology, Inc.
    Inventors: Sandeep Razdan, Vipulkumar Patel, Matthew J. Traverso