Abstract: Some implementations provide a semiconductor device that includes a first die and an optical receiver. The first die includes a back side layer having a thickness that is sufficiently thin to allow an optical signal to traverse through the back side layer. The optical receiver is configured to receive several optical signals through the back side layer of the first die. In some implementations, each optical signal originates from a corresponding optical emitter coupled to a second die. In some implementations, the back side layer is a die substrate. In some implementations, the optical signal traverses a substrate portion of the back side layer. The first die further includes an active layer. The optical receiver is part of the active layer. In some implementations, the semiconductor device includes a second die that includes an optical emitter. The second die coupled to the back side of the first die.

Abstract: Methods for transformer signal coupling and impedance matching for flip-chip circuit assemblies are presented. In one embodiment, a method for providing an inductive coupling between dies may include fabricating a first inductor on a first die using a passive process, fabricating a second inductor on a second die using a semiconductor process, and assembling each die so the first and second inductor are configured as a transformer. In another embodiment, a method for matching impedance in an RF circuit fabricated using flip-chip techniques may include passing an RF input signal through a first inductor formed using a passive process, inducing a time varying magnetic flux in proximity to a second inductor formed using an active process, and passing an RF signal induced by the time varying magnetic flux through the second inductor.

Abstract: Systems, circuits and methods for controlling word line (WL) power levels at a WL of a Magnetoresistive Random Access Memory (MRAM). The disclosed power control scheme uses existing read/write commands and an existing power generation module associated, with the MRAM to supply and control WL power levels, thereby eliminating the cost and increased die-size of schemes that control WL power through relatively large and expensive power control switches and control circuitry on the MRAM macro.

Abstract: A memory device includes a magnetic tunnel junction (MTJ) bitcell. The MTJ bitcell includes a first MTJ and a second MTJ. The memory device further includes programming circuitry configured to generate a non-reversible state at the bitcell by applying a program signal to a selected one of the first MTJ and the second MTJ of the bitcell. The non-reversible state corresponds to a value of the MTJ bitcell that is determined by comparing a first value read at the first MTJ and a second value read at the second MTJ.

Abstract: Methods and apparatuses for matching impedances in a flip-chip circuit assembly are presented. An apparatus for matching impedances in a flip-chip circuit assembly may include a first circuit associated with a first die and a through silicon via (TSV) coupling the first circuit to a second circuit. The apparatus may further include a first impedance matching inductor interposed between the TSV and the second circuit. A method for matching impedances in a flip-chip circuit assembly may include providing a die having a first circuit, and forming a TSV over the die. The method may further include providing a second circuit and forming a first impedance matching inductor interposed between the TSV and second circuit.

Abstract: Electrostatic discharge susceptibility is reduced when assembling a stacked IC device by coupling a ground plane of a first semiconductor device and a ground plane of a second semiconductor device to place the ground plane at substantially a same electrical potential. Active circuitry on the first semiconductor device and active circuitry on the second semiconductor device are electrically coupled after the ground planes are coupled. Electrically coupling the ground planes of the first and the second semiconductor device creates a preferred electrostatic discharge path to ground, thus reducing potential damage to sensitive circuit elements.

Abstract: External memory having a high density, high latency memory block; and a low density, low latency memory block. The two memory blocks may be separately accessed by one or more processing functional units. The access may be a direct memory access, or by way of a bus or fabric switch. Through-die vias may connect the external memory to a die comprising the one or more processing functional units.

Abstract: A first apparatus, such as a die or a semiconductor package, has signal paths extending through the apparatus. The signal paths can include through vias and other components. The signal paths are operable to communicate with a second apparatus when the second apparatus is stacked with the first apparatus. The first apparatus also has pass gates. Each pass gate is configurable in response to a signal, to short a pair of the signal paths to enable substantially simultaneous testing of the signal paths. The pass gates may be configurable to isolate the signal paths during operation of the first apparatus.

Abstract: A memory device may comprise a magnetic tunnel junction (MTJ) stack, a bottom electrode (BE) layer, and a contact layer. The MTJ stack may include a free layer, a barrier, and a pinned layer. The BE layer may be coupled to the MTJ stack, and encapsulated in a planarized layer. The BE layer may also have a substantial common axis with the MTJ stack. The contact layer may be embedded in the BE layer, and form an interface between the BE layer and the MTJ stack.

Abstract: Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.

Abstract: A system and method to manufacture magnetic random access memory is disclosed. In a particular embodiment, a method of making a magnetic tunnel junction memory system includes forming a portion of a metal layer into a source line having a substantially rectilinear portion. The method also includes coupling the source line, at the substantially rectilinear portion, to a first transistor using a first via. The first transistor is configured to supply a first current received from the source line to a first magnetic tunnel junction device. The method includes coupling the source line to a second transistor using a second via, where the second transistor is configured to supply a second current received from the source line to a second magnetic tunnel junction device.

Abstract: External memory having a high density, high latency memory block; and a low density, low latency memory block. The two memory blocks may be separately accessed by one or more processing functional units. The access may be a direct memory access, or by way of a bus or fabric switch. Through-die vias may connect the external memory to a die comprising the one or more processing functional units.

Abstract: A three-dimensional inductor or transformer for an electronic packaging system that includes a plurality of conductive traces and a plurality of conductive wire bonds. The traces are located in a single layer, and each have a first and second pad. Each of the wire bonds couples the second pad of one trace to the first pad of another trace. The trace and wire bonds create a continuous conductive path from the first pad of a first trace to the second pad of a last trace. Passing a current from the first trace to the last trace creates an electromagnetic field between the single layer and the wire bonds. The transformer includes two independent and electromagnetically coupled inductors that can be interleaved. The continuous conductive path can be solenoid-shaped. A shielding layer can also be included that blocks the substrate from the electromagnetic field of the inductor or transformer.

Abstract: Methods and apparatuses for matching impedances in a flip-chip circuit assembly are presented. An apparatus for matching impedances in a flip-chip circuit assembly may include a first circuit associated with a first die and a through silicon via (TSV) coupling the first circuit to a second circuit. The apparatus may further include a first impedance matching inductor interposed between the TSV and the second circuit. A method for matching impedances in a flip-chip circuit assembly may include providing a die having a first circuit, and forming a TSV over the die. The method may further include providing a second circuit and forming a first impedance matching inductor interposed between the TSV and second circuit.

Abstract: Method of forming a radio frequency integrated circuit (RFIC) is provided. The RFIC comprises one or more electronic devices formed in a semiconductor substrate and one or more passive devices on a dielectric substrate, arranged in a stacking manner. Electrical shield structure is formed in between to shield electronic devices in the semiconductor substrate from the passive devices in the dielectric substrate. Vertical through-silicon-vias (TSVs) are formed to provide electrical connections between the passive devices in the dielectric substrate and the electronic devices in the semiconductor substrate.

Abstract: A system and method to manufacture magnetic random access memory is disclosed. In a particular embodiment, a method of making a magnetic tunnel junction memory system includes forming a portion of a metal layer into a source line having a substantially rectilinear portion. The method also includes coupling the source line, at the substantially rectilinear portion, to a first transistor using a first via. The first transistor is configured to supply a first current received from the source line to a first magnetic tunnel junction device. The method includes coupling the source line to a second transistor using a second via, where the second transistor is configured to supply a second current received from the source line to a second magnetic tunnel junction device.

Abstract: A memory including a memory cell and method for producing the memory cell are disclosed. The memory includes a substrate in a first plane. A first metal connection extending in a second plane is provided. The second plane is substantially perpendicular to the first plane. A magnetic tunnel junction (MTJ) is provided having a first layer coupled to the metal connection such that the first layer of the MTJ is oriented along the second plane.

Abstract: An integrated circuit die contains a total of at least 10,000 bipolar logica cells that dissipate at least 75 watts of power. To supply such a large amount of power to the logic cells, thin sputtered power busses of 3 .mu.m thickness overlie the logic cells; an insulating layer surrounds the power busses; openings in the insulating layer defined plating regions on the power busses; an electroplating base film lies throughout the plating regions; and, a thick plated conductor, of at least 16 .mu.m thickness, lies on the electroplating base film. By supplying power to the bipolar logic cells via the composite structure of the thin power busses and thick plated conductors, a noise margin problem in the logic cell output signals is avoided. With 16 .mu.m thick plated conductors, the total number of logic cells on the die can be increased until their total power dissipation reaches 75 watts. With 21 .mu.m thick plated conductors, total die power can be increased to 100 watts.

Abstract: An integrated circuit having improved planarity includes a substrate, a plurality of transistors integrated into a top surface of the substrate, and a plurality of insulating layers over the top surface which are interleaved with respective sets of signal conductors. These signal conductors are spaced apart on the insulating layers and are routed through holes in the insulating layers to the transistors in order to carry signals to and from the transistors. Also, in accordance with the invention, the integrated circuit further includes dummy conductors on the insulating layers in the spaces between the signal conductors. These dummy conductors are open circuited and consequently carry no signals. Their function is purely mechanical; and specifically, they function to partially fill the spaces between the signal conductors such that an overlying insulating layer can be formed without peaks and valleys.