Abstract: Monodispersed silver nanowires are formed by a process utilizing a polyol. A capping agent is mixed in the polyol to form a substantially homogeneous solution. The solution is heated to a level below a boiling point of the polyol. The solution is diluted with a diluant which may consist of water and/or alcohol, and the solution is centrifuged to produce the silver nanowires.

Abstract: An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Abstract: An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.

Abstract: An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.

Abstract: An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.

Abstract: An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.

Abstract: Wetting and print transfer from a printing patterned transfer surface is enhanced by applying an ultraviolet radiation responsive material to the patterned transfer surface. Ultraviolet activation of the ultraviolet responsive coating is performed during a transfer of printing material to a substrate. The technique increases precision of the printing process and is useful for transfer of printing material to a substrate in order to establish printed circuit components such as circuit traces and printed circuit elements on the substrate. In a particular configuration the ultraviolet radiation responsive material can be made of azobenzene material or free radical initiators.

Abstract: The present invention relates to an RFID Tag and Antenna for use with an RFID tag and a method of radio frequency identification (RFID). The RFID Tag comprises a RFID chip 5 for storing data, an antenna 6 and an electromagnetic band gap substrate 12. The RFID chip 5 and the antenna 6 are mounted above the electromagnetic band gap substrate 12. The electromagnetic band gap substrate has a reflection phase which is different from 180° at the operation frequency of the antenna. The electromagnetic band gap substrate enables the RFID to operate even if it is mounted on a conductive object, as the reflection phase is not 180° so it does not destructively interfere with the radiation from the antenna at the operating frequency. Preferably the reflection phase is between 340° and 115° or ?95° and 145°. The preferred embodiment uses a band gap substrate having two mushroom-like conductive layers 3, 7 with a dielectric in between.

Abstract: The present invention relates to an RFID Tag and Antenna for use with an RFID tag and a method of radio frequency identification (RFID). The RFID Tag comprises a RFID chip 5 for storing data, an antenna 6 and an electromagnetic band gap substrate 12. The RFID chip 5 and the antenna 6 are mounted above the electromagnetic band gap substrate 12. The electromagnetic band gap substrate has a reflection phase which is different from 180° at the operation frequency of the antenna. The electromagnetic band gap substrate enables the RFID to operate even if it is mounted on a conductive object, as the reflection phase is not 180° so it does not destructively interfere with the radiation from the antenna at the operating frequency. Preferably the reflection phase is between 340° and 115° or ?95° and 145°. The preferred embodiment uses a band gap substrate having two mushroom-like conductive layers 3, 7 with a dielectric in between.