Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: A photonic integrated circuit (PIC) chip comprising an array of modulated sources, each providing a modulated signal output at a channel wavelength different from the channel wavelength of other modulated sources and a wavelength selective combiner having an input optically coupled to received all the signal outputs from the modulated sources and provide a combined output signal on an output waveguide from the chip. The modulated sources, combiner and output waveguide are all integrated on the same chip.

Abstract: Optical autodiscovery is provide between two optical modules to insure that when an optical signal is coupled between the two optical module, the optical signal from a first module does not interfere with operation of a second module. The autodiscovery is implemented by sending an optical identification signal from the first optical module via the coupling to the second optical module from which signal, the second optical module can verify and determined acceptance of the coupled first optical module. During this autodiscovery process, the optical identification signal from the first optical module may be attenuated or shifted in optical spectrum so as not to interfere with the operation of the second optical module. Autodiscovery may also be employed in cases where a first optical module is to receive an optical signal from a second module.

Abstract: A system, apparatus and method are described for controlling the gain across one or more amplifier nodes within an optical span. In one embodiment, a fast local amplifier constant gain control loop is provided that maintains a constant gain across an amplifier node for each of the channels within an optical signal. A slow link level gain setting control loop is provided to set and/or adjust the target gain on the amplifier node(s). A gain adjust sequence is performed by the slow link level gain setting control loop to adjust the target gain(s) in response to various events and mechanisms. A “time of flight” protection method is also provided to ensure consistency between the fast local amplifier gain control loop and the slow link level gain setting control loop.

Abstract: A system, apparatus and method are described for deployment of a control loop between optical or electro-optical modules and a multiplexing module to provide a desired power profile of banded optical channel groups. The power output characteristics of the optical or electro-optical modules, the properties of the transmission paths of the banded optical channel groups, and other factors may be analyzed to allow the control loop to achieve the desired power profile on the banded optical channel groups. The control loop may adjust the output power on the optical or electro-optical modules so that the banded optical channel groups are delivered to an optical component, such as an optical multiplexer or photo-detector, having a particular optical power profile.

Abstract: A method of forming a workpiece into sectioned parts using a pair of laterally translatable chipping heads and, downstream, a cutting device of the type having a plurality of rotatable cutting members mounted for rotation on a common axis which is movable and including workpiece transport means for moving the workpiece from a starting position to a final position along a path which extends first past the chipping heads and then past the cutting device.

Abstract: Compositions and methods for promoting mesenchymal stem cell expansion while maintaining a pluripotent phenotype are disclosed. Serum-free cell culture systems and kits and methods of use for mesenchymal stem cell expansion are provided. Methods also comprise the use of the expanded mesenchymal stem cells to treat various disorders or diseases, particularly those of the cardiovascular system, bone, or cartilage.

Abstract: In a regenerator for a regenerative cycle machine, regenerator foil is grooved on both sides, with intersections of grooves on opposite side forming holes at which separate flows of fluid interact to induce flows ancillary to the overall direction of flow in the regenerator, thereby enhancing heat transfer to and from the material of the regenerator and improving thermodynamic performance of the gas cycle machine.

Abstract: A cooling load 90 is enclosed within the envelope of the pressure vessel that contains the working fluid in a pulse tube cooler in a load space 95 adjacent to a regenerator 58 of that pulse tube cooler. Flow-smoothing means 63, which include stacked screens and perforated plates, or diffuser nozzle 104 or diffuser cone 106, spreads the flow of fluid that enters the cold end of pulse tube 66.

Abstract: An optical communication module comprises at least one monolithic semiconductor transmitter photonic integrated circuit chip having a plurality of optical signal channels approximating wavelengths on a standardized grid. Each of said channels comprises a laser source optically coupled to an electro-optic modulator. The outputs of the electro-optic modulators are coupled to inputs of an integrated optical combiner for combining the inputs to form a combined signal output from the chip. A booster optical amplifier is optically coupled to receive and amplify the combined signal output from the chip.

Abstract: A photonic integrated circuit (PIC) chip with a plurality of electro-optic components formed on a major surface of the chip and a submount that includes a substrate that extends over the major surface of the chip forming an air gap between the substrate and the major surface, the substrate to support electrical leads for electrical connection to some of the electro-optic components on the chip major surface.

Abstract: A method of forming a workpiece into sectioned parts using a pair of laterally translatable chipping heads and, downstream, a cutting device of the type having a plurality of rotatable cutting members mounted for rotation on a common axis which is movable and including workpiece transport means for moving the workpiece from a starting position to a final position along a path which extends first past the chipping heads and then past the cutting device.