Abstract: A conductor on glass security layer may be located within a printed circuit board (PCB) of a crypto adapter card or within a daughter card upon the crypto adapter card. The conductor on glass security layer includes a glass dielectric layer that remains intact in the absence of point force loading and shatters when a point load punctures or otherwise contacts the glass dielectric layer. The conductor on glass security layer also includes a conductive security trace upon the glass dielectric layer. A physical access attempt shatters a majority of the glass dielectric layer, which in turn fractures the security trace. A monitoring circuit that monitors the resistance of the conductive security trace detects the resultant open circuit or change in security trace resistance and initiates a tamper signal that which may be received by one or more computer system devices to respond to the unauthorized attempt of physical access.

Abstract: An ophthalmic device is described that includes a frame and an optically active component comprising a bistable dielectric electroactive polymer. The bistable dielectric electroactive polymer changes shape when exposed to a sufficiently strong electric field and does not completely revert to its former shape when the electric field is deactivated. The refractive properties of the ophthalmic devices described herein are adjusted by exposing the devices to electric fields.

Abstract: Systems and methods to safeguard data and hardware may include a memory configured to store a first image and sensitive data, and an optical sensor configured to capture a second image. A sensor signal comprising the captured second image may be generated. A controller having access to the memory may be configured to receive the sensor signal. The controller may be further configured to compare the stored first image to the captured second image, and based on the comparison, to determine whether the sensitive data is accessible.

Abstract: In an example, a method includes obtaining an expected biological sample value at a computing device. The expected biological sample value indicates an expected concentration of a material biologically processed by a courier. The computing device determines whether the measured biological sample value is associated with the courier based on a comparison of the expected biological sample value to the measured biological sample value. The method also includes determining a particular set of operations to be performed at the computing device based on a result of the comparison.

Abstract: Various back-drilled via probing techniques are described. In some cases, a screw may be utilized to establish a conductive pathway through a voided portion of a back-drilled via to a plated portion of the back-drilled via to enable back-drilled via probing. In other cases, a combination of solder paste and a wire may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a compliant pin that includes a metallized particle interconnect material may be utilized to establish the conductive pathway to enable back-drilled via probing. In other cases, a combination of an ultraviolet curable film and a light pipe may be utilized to establish a conductive pathway the conductive pathway to enable back-drilled via probing.

Abstract: A method, system and computer program product are provided for implementing tire tread depth and wear patterns monitoring. A radio frequency identification (RFID) tag is provided with an associated tire to be monitored. A dipole antenna structure is coupled to the RFID tag and routed within a position in the tire tread and routed substantially circumferentially in the associated tire. A resonant frequency of the dipole antenna structure is detected to monitor tire tread wear.

Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.

Abstract: An apparatus comprises a plurality of conductive elements arranged within at least a first conductive layer and a dielectric layer comprising a plurality of microcapsules. The first conductive layer is arranged on a first side of the dielectric layer. The apparatus further comprises monitoring circuitry coupled with the plurality of conductive elements and configured to detect a change in an electrical parameter for at least a first conductive element of the plurality of conductive elements. The change in the electrical parameter indicates a physical intrusion of the dielectric layer that causes a rupture of one or more microcapsules of the plurality of microcapsules.

Abstract: An apparatus is disclosed that comprises a first security arrangement that overlaps a plurality of electronic components arranged within one or more layers. The first security arrangement comprises a first conductive layer patterned as a first array of a plurality of first conductive elements, and a second conductive layer separated from the first conductive layer by a dielectric layer. The second conductive layer patterned as a second array of a plurality of second conductive elements, and the first array and the second array collectively form a plurality of capacitive elements. The apparatus further comprises monitoring circuitry coupled with the first security arrangement and configured to detect a change in a capacitance of a first capacitive element of the plurality of capacitive elements, and determine, based on a location of the first capacitive element within the first array, whether to perform a predefined security action.

Abstract: Apparatus and methods to determine a change in atmospheric pressure between a forward portion of a flying object and a rear portion of the flying object based on at least one radio frequency (RF) return signal, and to determine a password using the determined change in atmospheric pressure.

Abstract: An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.

Abstract: A process includes utilizing a pin array that includes multiple segmented pins for forming selectively plated through holes. The process includes forming a PCB laminate structure that includes multiple spinel-doped core layers and multiple through holes. Each spinel-doped core layer includes a heat-activated spinel material incorporated into a dielectric material. The process includes aligning individual segmented pins of a pin array with corresponding through holes of the PCB laminate structure, where each segmented pin includes heated segment(s) and insulating segment(s). The process includes inserting the segmented pins of the pin array into the corresponding through holes and generating heat within each heated pin segment that is sufficient to form metal nuclei sites in selected regions of the spinel-doped core layers adjacent to portions of the through holes that contain the heated pin segments. The metal nuclei sites function as seed layers to enable formation of selectively plated through holes.

Abstract: Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.

Abstract: In some embodiments, a tamper-respondent system includes a PCB having a coating on a surface thereof, wherein the coating includes spinel-based, non-conductive metal oxide mixed into a non-conductive supporting material. The tamper-respondent system also includes a conductive track writing unit, a sensor, and an enclosure substantially enclosing the PCB, conductive track writing unit, and sensor. Responsive to a determination that a signal output from the sensor is indicative of tampering, the conductive track writing unit writes a conductive track within a predetermined portion of the coating by irradiating the predetermined portion of the coating to reduce the spinel-based, non-conductive metal oxide in the predetermined portion of the coating to metal nuclei. In some embodiments, the conductive track may modify circuit paths of the PCB and/or create electrical features on the PCB detectable by monitoring agents.

Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.

Abstract: A conductor on glass security layer may be located within a printed circuit board (PCB) of a crypto adapter card or within a daughter card upon the crypto adapter card. The conductor on glass security layer includes a glass dielectric layer that remains intact in the absence of point force loading and shatters when a point load punctures or otherwise contacts the glass dielectric layer. The conductor on glass security layer also includes a conductive security trace upon the glass dielectric layer. A physical access attempt shatters a majority of the glass dielectric layer, which in turn fractures the security trace. A monitoring circuit that monitors the resistance of the conductive security trace detects the resultant open circuit or change in security trace resistance and initiates a tamper signal that which may be received by one or more computer system devices to respond to the unauthorized attempt of physical access.

Abstract: A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.

Abstract: A fusible via is disclosed. The fusible via includes an upper contact. The fusible via further includes a handle portion having a first end and a second end. The upper contact is disposed on the first end of the handle portion. The handle portion comprises an alloy and a blowing agent. The alloy melts above a predefined solder reflow temperature but below a thermal degradation temperature of the blowing agent. The fusible via further includes a lower contact disposed on the second end of the handle portion.

Abstract: A process of utilizing a heat-activated conductive spinel material for PCB via overcurrent protection includes forming a PCB laminate structure that includes a spinel-doped insulator layer having a heat-activated conductive spinel material incorporated into a dielectric material as a spinel-based electrically non-conductive metal oxide. A sensing via is formed in the PCB laminate structure at a location that is proximate to a power via in the PCB laminate structure. The sensing via is electrically isolated from the power via by a region of the spinel-doped insulator layer and is electrically connected to a monitoring component configured to detect current flow through the sensing via that results from an overcurrent event in the power via that generates sufficient heat to cause the spinel-based electrically conductive metal oxide to release metal nuclei into the region to provide a conductive pathway through the region from the power via to the sensing via.