Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: A layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.

Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.

Abstract: A process of manufacturing a layup for multiple-layer printed circuit board manufacturing is formed according to a process that includes selectively applying a dielectric resin to a high resin demand region of a circuitized core layer without applying the dielectric resin to another region of the circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple layer printed circuit board that includes the circuitized core layer within the high resin demand region. The process further includes forming a layup that includes a layer of pre-impregnated (prepreg) material adjacent to the partially cured dielectric resin within the high resin demand region of the circuitized core layer.

Abstract: Embodiments of the present invention provide systems and methods for destructive testing of a printed circuit board assembly (PCBA). The PCBA contains embedded components on a printed circuit board within a non-functional area. At least one of these embedded components is susceptible to defects and exposed to conditions that facilitate destructive testing which leads to accelerated measurements. The accelerated measurements on the non-functional area are more representative of variability than measurements on a functional module while providing insights into potential future defects.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.

Abstract: Embodiments of the present invention provide systems and methods for destructive testing of a printed circuit board assembly (PCBA). The PCBA contains embedded components on a printed circuit board within a non-functional area. At least one of these embedded components is susceptible to defects and exposed to conditions that facilitate destructive testing which leads to accelerated measurements. The accelerated measurements on the non-functional area are more representative of variability than measurements on a functional module while providing insights into potential future defects.

Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.

Abstract: An immersion weaving system includes a first drum immersed in a first bath of a liquid. The first drum is configured to form a glass strand from individual glass filaments. The immersion weaving system also includes a second drum immersed in the first bath of the liquid. The second drum is configured to form a yarn spool from the glass strand. The immersion weaving system further includes a loom immersed in a second bath of the liquid. The loom is configured to form a void-free glass cloth.

Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.

Abstract: Embodiments of the present invention provide methods for destructive testing of a printed circuit board assembly (PCBA). The PCBA contains embedded components on a printed circuit board within a non-functional area. At least one of these embedded components is susceptible to defects and exposed to conditions that facilitate destructive testing which leads to accelerated measurements. The accelerated measurements on the non-functional area are more representative of variability than measurements on a functional module while providing insights into potential future defects.

Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.

Abstract: A method for electrically insulating a connector module mounted on a printed circuit board assembly, the method including coating a first portion of a piece of sheet metal with an insulation material, forming the piece of sheet metal into a metal frame, wherein a second portion of the piece of sheet metal not coated with the insulation material is formed into a grounding pin, assembling the connector module, wherein components of the connector module include the metal frame, a housing, and a set of external pins, and mounting the connector module on a printed circuit board to form a printed circuit board assembly, wherein the set of external pins are electrically connected to a corresponding set of vias on the printed circuit board, and the grounding pin is electrically connected to a ground on the printed circuit board.

Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.

Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.