Patents by Inventor Matthew S. Kelly
Matthew S. Kelly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9662732Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: GrantFiled: June 21, 2016Date of Patent: May 30, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20170142845Abstract: An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: January 31, 2017Publication date: May 18, 2017Applicant: International Business Machines CorporationInventors: STEPHEN M. HUGO, Matthew S. Kelly
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Patent number: 9563739Abstract: For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.Type: GrantFiled: March 7, 2016Date of Patent: February 7, 2017Assignee: International Business Machines CorporationInventors: Mitchell G. Ferrill, Curtis Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low
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Publication number: 20160297022Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: June 21, 2016Publication date: October 13, 2016Applicant: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9427828Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: GrantFiled: August 8, 2014Date of Patent: August 30, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20160188786Abstract: For a printed circuit board assembly (“PCBA”) selected electronic components are highlighted on a graphic representation of the PCBA on a display of a computer system. The components are selected responsive to temperature and time limits of the selected components. Ones of the highlighted components are associated to respective temperature sensors on the PCBA. Responsive to where the one or more additional ones of the highlighted components are located on the PCBA relative to the at least one of the respective temperature sensors, one or more additional ones of the highlighted components are associated with at least one of the respective temperature sensors. The computer system receives data for respective signals indicating temperatures encountered by the respective temperature sensors when the PCBA is heated in a manufacturing process. The computer system shows whether any of the time and temperature limits were exceeded during the manufacturing process.Type: ApplicationFiled: March 7, 2016Publication date: June 30, 2016Inventors: Mitchell G. Ferrill, Curtis Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low
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Patent number: 9317643Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.Type: GrantFiled: May 22, 2014Date of Patent: April 19, 2016Assignee: International Business Machines CorporationInventors: Mitchell G. Ferrill, Curtis Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low
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Publication number: 20160044791Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.Type: ApplicationFiled: August 8, 2014Publication date: February 11, 2016Inventors: Stephen M. Hugo, Matthew S. Kelly
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Patent number: 9232664Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: GrantFiled: December 11, 2013Date of Patent: January 5, 2016Assignee: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20150342056Abstract: A method for printed circuit board design of temperature sensitive components includes a scrub tool receiving a list of part numbers for electronic components of a printed circuit board assembly (“PCBA”). The scrub tool sends one or more queries for finding temperature and time limits of the electronic components to a database. A mapping tool receives a selection of one or more part numbers responsive to the one or more queries, wherein the selection is responsive to the temperature and time limits. The mapping tool sends a data structure to a physical design tool which is configured with physical design data for generating a graphic representation of the PCBA. The data structure from the mapping tool provides the received selection of one or more part numbers and configures the physical design tool to highlight components having part numbers of the selection on the PCBA graphic representation.Type: ApplicationFiled: May 22, 2014Publication date: November 26, 2015Applicant: International Business Machines CorporationInventors: Mitchell G. Ferrill, Curtis Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low
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Patent number: 9148962Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: GrantFiled: January 2, 2013Date of Patent: September 29, 2015Assignee: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20140183250Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: ApplicationFiled: December 11, 2013Publication date: July 3, 2014Applicant: International Business Machines CorporationInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20140182909Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.Type: ApplicationFiled: January 2, 2013Publication date: July 3, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Stephen M. Hugo, Matthew S. Kelly
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Publication number: 20120300423Abstract: An apparatus is provided and includes a substrate, a connector, including discrete elements, each discrete element having a first end tied to a compliant spine and an opposite second end including a lead and a fastener, which is disposable to extend through the substrate and into the connector, the fastener and the connector being configured such that mechanical interference therebetween caused by fastener operation urges the connector toward the substrate to advance each of the leads toward respective solder positions in a common plane.Type: ApplicationFiled: May 26, 2011Publication date: November 29, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gerald G. Advocate, JR., Mitchell G. Ferrill, Michael J. Fisher, Matthew S. Kelly, Theron L. Lewis
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Patent number: 8299393Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.Type: GrantFiled: August 17, 2010Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: Matthew S. Kelly, Kirit R. Shah, Thomas S. Truman
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Publication number: 20120043305Abstract: An embodiment of the invention comprises a method associated with a PCB having a first component, and a second component, that has substantially less thermal mass than the first component. During an initial time period, the PCB and its components are placed at an initial position proximate to a first heat source, which is operable to provide heat energy in accordance with a thermal profile comprising successive phases. After the initial time period, the first heat source is operated during each of the phases in accordance with the thermal profile to selectively apply heat to the PCB and to the plurality of components thereon. During the initial time period or a specified one of the phases, selectively, heat energy from a focused heat source is directed only to the first component, and not to other components.Type: ApplicationFiled: August 17, 2010Publication date: February 23, 2012Applicant: International Business Machines CorporationInventors: Matthew S. Kelly, Kirit R. Shah, Thomas S. Truman
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Patent number: 7856341Abstract: Sensors are located on first and second regions of a heat sink, with a portion of the heat sink interposed between the first and second region sensors. The heat sink is connected to a component by an attachment that conducts heat from the component to the heat sink, and a third sensor is located on the component or the attachment with a portion of the attachment disposed between the third sensor and the first and second heat sink region sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment portion, and the component with respect to heat conduction, which includes identifying the interposed heat sink portion as failing in response to a divergence between temperature inputs from the first and second heat sink region sensors. Rate-of-rise temperature readings may also be observed and compared, including to historical values.Type: GrantFiled: February 19, 2008Date of Patent: December 21, 2010Assignee: International Business Machines CorporationInventors: Brian L. Carlson, Bruce J. Chamberlin, Mark K. Hoffmeyer, Ahmad D. Katnani, Matthew S. Kelly, Gregory S. Killinger, Eric V. Kline, Wayne J. Rothschild, Jeffrey A. Taylor
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Publication number: 20090210190Abstract: Where an attachment means connects a heat sink to a system component, heat is thereby conducted to the heat sink from the component, a temperature sensor is located on the heat sink and another on the component or the attachment means, a portion of the attachment means is disposed between the sensors. Temperature readings from the sensors are compared to identify a failing one of the heat sink, the attachment means portion, and the component, with respect to heat conduction. Corrective action may be identified, and self-power means may also be provided to supply operative power. A wireless output circuit may be provided. Multiple heat sink sensors may be provided in any element. Rate-of-rise temperature readings may be observed and compared, including to historical values.Type: ApplicationFiled: February 19, 2008Publication date: August 20, 2009Applicant: International Business Machine CorporationInventors: Brian L. Carlson, Bruce J. Chamberlin, Mark K. Hoffmeyer, Ahmad D. Katnani, Matthew S. Kelly, Gregory S. Killinger, Eric V. Kline, Wayne J. Rothschild, Jeffrey A. Taylor