Abstract: A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.

Abstract: The invention relates to a method for securing an airbag (25) to a motor vehicle. Said method consists of the following steps: an airbag (25) that comprises a securing lug (20) and that can be filled with a gas is secured to a securing device (10) that comprises a plate (11) and an attachment device (16) that is secured to the plate. Said plate comprises a first plate section (12) having a first opening (14) provided with a screw thread (15) and a second plate section (13). Said attachment device (16) is secured to the first plate section (12) and the airbag is secured to the securing device (10) by bending the second plate section (13) in such a manner that the first plate section (12) and the second plate section (13) at least partially surround the securing lug (20) on both sides. The invention also relates to a securing device for an airbag, an airbag module and a motor vehicle.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays on the large area substrate. The apparatus includes a prober assembly that is movable relative to the large area substrate and/or the contact points, and may be configured to test various patterns of displays and contact points on various large area substrates. The prober assembly is also configured to test fractional sections of the large area substrate positioned on a testing table, and the prober assembly may be configured for different display and contact point patterns without removing the prober assembly from the testing table.

Abstract: The invention relates to a method of calibration of the beam position of a corpuscular beam. A calibration body with structures is used, wherein the structures have a structure period Ps in the plain section and within each structure there is a position L intended for the measurement. For the calibration, at least one detection signal each at structures in the plain section of the calibration body is generated, wherein the corpuscular beam is deflected with deflectors on beam target positions L1 with the beam target period P1, which is larger than half of the structure period Ps, whereby a basic calibration is used for the control of the deflectors, and wherein the beam target deflections intentionally deviate either in the beam target period P1 from the structure period Ps and/or in the beam target position L1 from the position L.

Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.

Abstract: An apparatus and method for testing large area substrates is described. The large area substrates include patterns of displays and contact points electrically coupled to the displays. The apparatus includes a prober assembly that is movable relative to the large area substrate and may be configured to test various patterns of displays and contact points. The prober assembly is also configured to test fractional sections of the large area substrate. The apparatus also includes a test chamber configured to store at least two prober assemblies within an interior volume.

Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.

Abstract: The present invention relates to a device for testing an optoelectronic module, comprising a first source for generating an electromagnetic beam or particle beam, a second source for illuminating the optoelectronic module; and a detector. In addition, a method for testing an optoelectronic module is provided comprising illuminating the optoelectronic module, directing an electromagnetic beam or particle beam and detecting defects in the optoelectronic module. The illumination additional to the electromagnetic beam or particle beam makes defects visible which otherwise would not be detected.

Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.

Abstract: Embodiments of the present invention relate to a drive electronics for driving a display with a matrix 101 of picture elements. The drive circuit 102x and 102y for generating signals for driving the pixels via control lines 103 is provided with signals at the input terminals 110 via contact areas 104. In addition to the contact areas used for the generation of arbitrary pictures, there exist contact areas 105 used within the framework of a testing method. These contact areas for the testing method are also connected with the input terminals 110 of the drive circuit and are used for generating a test pattern.

Abstract: The invention relates to methods for positioning of a substrate and contacting of the test object for testing with a test apparatus with an optical axis and corresponding devices. Thereby, the substrate is put on the holder. The substrate is positioned relative to the optical axis. A contact unit is also positioned relative to the optical axis, whereby the contact unit is positioned independent of the positioning activity of the substrate. Thereby, a flexible contacting of test objects on the substrate can be realized.

Abstract: Methods and apparatus for determining whether a malfunctioning pixel in a large area substrate, such as a liquid crystal display (LCD) panel, is due to the pixel itself or to the driver circuit for that pixel and for localizing any driver circuit defects are provided. In an effort to localize the driver circuit defects, test pads coupled to the input and/or output of certain driver circuits may be fabricated on the substrate. The voltage or charge of these test pads may be detected using any suitable sensing device, such as an electron beam, an electro-optical sensor, or an electrode in close proximity to the surface of the pixels and/or drivers capacitively coupled to the pixel or driver. For some embodiments, the defective driver circuits may be repaired in the same area as the test area or may be transported via conveyor or robot to a separate repair station.

Abstract: The present invention comprises a system and method for transferring a substrate into and out of a chamber configured to accommodate multiple substrates. In one embodiment, the system comprises a chamber housing that includes a first substrate support tray and a second substrate support tray independently movable along a vertical axis, and a substrate conveyor movable into and out of the chamber housing. The first substrate support tray and the second substrate support tray are movable to a position where a portion of the second substrate support tray is received in the first substrate support tray.

Abstract: A method and an apparatus for testing the function of a plurality of microstructural elements by irradiation with particle radiation. All of the microstructural elements detected as malfunctioning are listed in a first error list in a first test sequence. The microstructural elements listed in the first error list are tested once more in at least one further test sequence and at least the result of the test sequence last carried out is evaluated to establish the overall test result. The first test sequence is designed so that, if possible, all of the microstructural elements which are actually malfunctioning are detected. The invention further relates to a method for producing microstructural elements which are constructed as a plurality on a substrate and are tested according to the above test method.

Abstract: A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a known starting position toward an edge of the substrate that is supported by the stage; detect the edge of the substrate while the substrate is supported by the stage; generate a detection signal following said detection; and stop moving toward the edge of the substrate following said detection. A controller may determine an edge position of the substrate relative to the stage based on the known starting position of each detection portion and based on the detection signal generated by each detection portion. Numerous other aspects are provided.

Abstract: A clutch lever arrangement for a clutch, especially for a commercial motor vehicle clutch, having a clutch lever pivotably supported on a bearing point on a stationary component. The lever has a force-application section for introducing an actuating force by way of an actuating element and a force-transmission section for transmitting the actuating force to a clutch-release bearing, which is mounted with freedom to slide axially back and forth in the pivot plane of the clutch lever. To reduce undesirable vibrations of the clutch lever, the lever is guided in its pivot plane by a guide member.

Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame. The electrical pins may be movable along the axial length of the prober bars, or may be selectively pushed down to contact selected contact pads on the substrate.

Abstract: A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.

Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.

Abstract: A method and apparatus for identifying a location of a short between two or more signal lines on a substrate having a plurality of thin film transistors and a plurality of pixels associated with the thin film transistors. The method includes locating the two or more signal lines having the short, locating one or more defective pixels disposed between the two or more signal lines having the short, and identifying the defective pixels as the location of the short.