Abstract: The invention relates to methods for positioning of a substrate 140 and contacting of the test object 301 for testing with a test apparatus with an optical axis and corresponding devices. Thereby, the substrate is put on the holder 130. The substrate is positioned relative to the optical axis. A contact unit 150 is also positioned relative to the optical axis, whereby the contact unit is positioned independent of the positioning activity of the substrate. Thereby, a flexible contacting of test objects on the substrate can be realized.

Abstract: A method and apparatus for testing a substrate, wherein a particle beam is directed onto the substrate and emitted secondary particles are detected with a detector and then evaluated. The location of the site at which the secondary particles are emitted on the substrate relative to the position of the detector is taken into consideration during testing.

Abstract: A release mechanism for actuating a friction clutch is concentric to a center axis of a guide sleeve mounted in turn on a transmission shaft. The release mechanism includes a clutch release bearing and a device for compensating for the tilt of the center axis of the friction clutch with respect to the center axis of the guide sleeve and/or for the wobbling eccentricity of the release spring. The clutch release bearing includes an inner ring, an outer ring, and an adjusting sleeve. One of the inner ring or outer ring communicates with a release spring of the friction clutch. The device for compensating for the tilt of the center axis of the friction clutch with respect to the center axis of the guide sleeve and/or for the wobbling eccentricity of the release spring includes a release ring and a load ring. The release ring is in contact with a finger of the release spring of the friction clutch and includes a spherical surface having a center on the axis of the transmission shaft.

Abstract: A system and method for testing substrates is generally provided. In one embodiment, a test system for testing a substrate includes a load lock chamber, a transfer chamber and a test station. The load lock chamber and the test station are disposed on top of one another and coupled to the transfer chamber. The transfer chamber includes a robot adapted to transfer a substrate between the load lock chamber, which is at a first elevation, and the test station, which is at a second elevation. In another embodiment, a test station is provided having a turntable adapted to rotate the substrate. The turntable enables the range of motion required to test the substrate to be substantially reduced while facilitating full test and/or inspection of the substrate.

Abstract: In a charged particle or electron beam system, gas, such as argon or helium, is introduced over the surface of a substrate and ionized to neutralize charge accumulating on the surface from interactions caused by the impinging charged particles. The gas can be distributed throughout the gas chamber or confined to an area above the substrate. The radiation beam to ionize the gas can be directed across or towards the surface of the substrate. In the latter case, the gas pressure may be reduced to zero.

Abstract: The invention relates to a method and to apparatus for testing a substrate, in which a particle beam is directed onto the substrate and emitted secondary particles are detected with a detector and then evaluated. According to the invention the location of the secondary particles emitted on the substrate relative to the position of the detector is taken into consideration during testing.

Abstract: The invention relates to a method as well as to apparatus for testing the function of microstructure elements, wherein the microstructure element is driven for testing the emission and/or mechanical properties and the corpuscles emitted or reflected by it are detected and evaluated.

Abstract: Method for particle beam testing of substrates for liquid crystal displays (LCD). This is directed to methods wherein, given a substrate (SUB1) for a liquid crystal display, either potentials or, respectively, currents are set in defined fashion with a particle beam (S1, S2 and S4) and/or potentials are measured by detecting secondary electrons (S5) at different switch statuses of the switch elements (T) of the substrate (SUB1). The geometrical integrity and the electrical functionability of the substrate (SUB1) are thereby tested, even though, for example, a supplementary plane electrode is not present for forming a capacitor. An important advantage of the method is that faulty substrates can be repaired or can be segregated even before further-processing and, thus, costs can be reduced.

Abstract: Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.

Abstract: Method for particle beam testing of substrates for liquid crystal displays (LCD). This is directed to methods wherein, given a substrate (SUB1) for a liquid crystal display, either potentials or, respectively, currents are set in defined fashion with a particle beam (S1, S2 and S4) and/or potentials are measured by detecting secondary electrons (S5) at different switch statuses of the switch elements (T) of the substrate (SUB1). The geometrical integrity and the electrical functionability of the substrate (SUB1) are thereby tested, even though, for example, a supplementary plane electrode is not present for forming a capacitor. An important advantage of the method is that faulty substrates can be repaired or can be segregated even before further-processing and, thus, costs can be reduced.

Abstract: Method for particle beam testing of substrates for liquid crystal displays (LCD). This invention is directed to methods wherein, given a substrate (SUB1) for a liquid crystal display, either potentials or, respectively, currents are set in defined fashion with a particle beam (S1, S2 and S4) and/or potentials are measured by detecting secondary electrons (S5) at different switch statuses of the switch elements (T) of the substrate (SUB1). The geometrical integrity and the electrical functionability of the substrate (SUB1) are thereby tested, even though, for example, a supplementary plane electrode is not present for forming a capacitor. An important advantage of the method is that faulty substrates can be repaired or can be segregated even before further-processing and, thus, costs can be reduced.

Abstract: Method for the recognition of testing errors in a test of microwirings. The method for the recognition of testing errors in the test is used in particular in an electron beam test of microwirings in the form of a printed circuit board (LP) having a plurality of networks (NW1 . . . NW9). Every network has a plurality of contact points (1 . . . 24). Interruptions (U) in networks (NW 2) and shorts (K1, K2) between networks (NW1 . . . NW3) of a test group (TG1) or, respectively, shorts (K3) between networks (NW2, NW4) of different test groups (TG1, TG2), that are found in a respective main test, are confirmed in a respective follow-up test or testing errors that arose in the main test, for example due to microfields or surface contaminations, are identified.

Abstract: A method of thermal disposal of sewage sludge. The sludge is dried and incinerated. The flue gases from the incineration are washed. The flue gas dust resulting from the incineration and the sludge resulting from washing of the flue gases are treated together with high temperature combustion which includes melting of solids.

Abstract: Modified scanning electron microscopes are usually employed for the implementation of methods for testing the electrical properties of printed circuit boards with the electron probe. As a consequence of the deflection, chromatic aberration and of the aberrations of the objective lens increasing greatly with the deflection angle, however, their scanning field is limited. In order to be able to test larger printed circuit boards without involved improvement of electron optics, it is proposed that the printed circuit board be subdivided into a plurality of adjoining regions, whereby the size of the regions respectively approximately corresponds to the size of the scanning field. Each of the networks lying only within one of the regions is then tested in a known manner. In order to detect shorts between networks of different regions as well as interruptions between contact points of networks extending beyond regions, the known testing method is followed by a further test cycle.

Abstract: For testing an interconnect network for shorts and interruptions, a point of the network to be tested is charged with a particle beam. Subsequently, a potential at least one further contact point is read with the same particle beam and an unaltered primary energy. An identification of potential occurs by documenting the secondary electrons triggered at the contact points. In order to avoid a disturbing change of potential during the measuring phase, the measuring time is only a fraction of the time for charging the network.

Abstract: A device for the detection of secondary electrons triggered at a large-area specimen is composed of a tube electrode arranged concentrically relative to the primary beam axis of an electron beam measuring device and an electrostatic or magnetic octupole for the deflection of the secondary electrons in the direction of a detector. An opposing electrical field is formed by two hemispherically shaped electrodes. The tube electrode which is arranged immediately above the specimen, and preferably has a circular cross-sectional area, whereby the tube diameter is selected larger than the diagonal of the specimen. An electrical extraction field that is rotationally symmetric with respect to the primary beam axis is generated inside the device. The secondary particles will be accelerated in the direction of the deflection unit.In the electrical extraction field, the particles are detected independently of the location of the respective measuring point inside the scanned field that is 20.times.20 cm.sup.2 in size.

Abstract: For localization of the defects on mask and wafers generated by particle occupation, electron-optical imaging methods have been developed where the subject to be examined is scanned with a focused electron beam. Since the signal-to-noise ratio needed for a reliable defect recognition limits the scan rate, the throughput of inspected subjects remains low. It is therefore proposed that the subject be scanned with a line-shaped electron probe and that the triggered secondary electons be imaged onto a detector with the assistance of an electron optics comprising an immersion lens, whereby one line element of the surface region illuminated by the electron probe is assigned to each detector element.

Abstract: A method of testing conductor networks on printed circuit boards and wiring modules comprising charging various points on the conductor network with one or more charging beams while simultaneously irridating the conductor network with a large area holding beam which compensates for charge losses during the charge detecting period which determines whether shorts or open circuits occur in the network.

Abstract: A detector for charged particles includes three grid electrodes arranged approximately parallel to the surface of a specimen and separated from one another by insulating spacers, as well as a charged particle sensitive part nearly completely covering the specimen. The particle sensitive part includes a plurality of rod shaped scintillators or light conductors lying at a high potential for post acceleration of secondary particles and lying in a plane approximately parallel to the surface of the specimen.

Abstract: To measure high frequency signal curves at nodes and interconnections of integrated circuits and achieve a good chronological resolution in accordance with the sampling method, extremely short primary electron pulses are used. For such extremely short pulse widths obtainable with beam blanking systems, only individual statistically appearing secondary electrons are registered per pulse, these electrons generating current pulses having different amplitudes and different time behaviors at the output of an energy analyzer. It is proposed that the number of current pulses occurring at the output of the energy analyzer within a prescribed time interval be identified and the quotient, or ratio, thereof, be kept constant with the assistance of a feedback circuit for connection to the voltage of a retarding field electrode. The feedback circuit includes a pulse counter, a digital-to-analog converter, and a spectrometer drive.