Abstract: A silicon-on-insulator device having multiple crystal orientations is disclosed. In one embodiment, the silicon-on-insulator device includes a substrate layer, an insulating layer disposed on the substrate layer, a first silicon layer, and a strained silicon layer. The first silicon layer has a first crystal orientation and is disposed on a portion of the insulating layer, and the strained silicon layer is disposed on another portion of the insulating layer and has a crystal orientation different from the first crystal orientation.

Abstract: A method of forming an integrated circuit device is disclosed. A polycrystalline silicon layer is formed in direct contact with a dielectric material so that the dielectric material induces a stress in the polycrystalline silicon layer as the polycrystalline silicon layer is formed. A MOS transistor that includes a gate comprising the polycrystalline silicon is then completed.

Abstract: A method of forming an integrated circuit device is disclosed. A polycrystalline silicon layer is formed in direct contact with a dielectric material so that the dielectric material induces a stress in the polycrystalline silicon layer as the polycrystalline silicon layer is formed. A MOS transistor that includes a gate including the polycrystalline silicon is then completed.

Abstract: An embodiment of the invention provides a semiconductor fabrication method. The method comprises forming an isolation region between a first and a second region in a substrate, forming a recess in the substrate surface, and lining the recess with a uniform oxide. Embodiments further include doping a channel region under the bottom recess surface in the first and second regions and depositing a gate electrode material in the recess. Preferred embodiments include forming source/drain regions adjacent the channel region in the first and second regions, preferably after the step of depositing the gate electrode material. Another embodiment of the invention provides a semiconductor device comprising a recess in a surface of the first and second active regions and in the isolation region, and a dielectric layer having a uniform thickness lining the recess.

Abstract: Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame.

Abstract: Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame.

Abstract: An embodiment of the invention provides a semiconductor fabrication method. The method comprises forming an isolation region between a first and a second region in a substrate, forming a recess in the substrate surface, and lining the recess with a uniform oxide. Embodiments further include doping a channel region under the bottom recess surface in the first and second regions and depositing a gate electrode material in the recess. Preferred embodiments include forming source/drain regions adjacent the channel region in the first and second regions, preferably after the step of depositing the gate electrode material. Another embodiment of the invention provides a semiconductor device comprising a recess in a surface of the first and second active regions and in the isolation region, and a dielectric layer having a uniform thickness lining the recess.

Abstract: Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame.

Abstract: Test structures for semiconductor devices, methods of forming test structures, semiconductor devices, methods of manufacturing thereof, and testing methods for semiconductor devices are disclosed. In one embodiment, a test structure for a semiconductor device includes at least one first contact pad disposed in a first material layer in a scribe line region of the semiconductor device. The at least one first contact pad has a first width. The test structure also includes at least one second contact pad disposed in a second material layer proximate the at least one first contact pad in the first material layer. The at least one second contact pad has a second width that is greater than the first width.

Abstract: An embodiment of the invention provides a semiconductor fabrication method. The method comprises forming an isolation region between a first and a second region in a substrate, forming a recess in the substrate surface, and lining the recess with a uniform oxide. Embodiments further include doping a channel region under the bottom recess surface in the first and second regions and depositing a gate electrode material in the recess. Preferred embodiments include forming source/drain regions adjacent the channel region in the first and second regions, preferably after the step of depositing the gate electrode material. Another embodiment of the invention provides a semiconductor device comprising a recess in a surface of the first and second active regions and in the isolation region, and a dielectric layer having a uniform thickness lining the recess.

Abstract: A silicon-on-insulator device having multiple crystal orientations is disclosed. In one embodiment, the silicon-on-insulator device includes a substrate layer, an insulating layer disposed on the substrate layer, a first silicon layer, and a strained silicon layer. The first silicon layer has a first crystal orientation and is disposed on a portion of the insulating layer, and the strained silicon layer is disposed on another portion of the insulating layer and has a crystal orientation different from the first crystal orientation.

Abstract: Capacitors are formed in metallization layers of semiconductor device in regions where functional conductive features are not formed, more efficiently using real estate of integrated circuits. The capacitors may be stacked and connected in parallel to provide increased capacitance, or arranged in arrays. The plates of the capacitors are substantially the same dimensions as conductive features, such as conductive lines or vias, or are substantially the same dimensions as fill structures of the semiconductor device.

Abstract: A method and apparatus for crystallizing a semiconductor that includes a first layer having a first crystal lattice orientation and a second layer having a second crystal lattice orientation, comprising amorphizing at least a portion of the second layer, applying a stress to the second layer and heating the second layer above a recrystallization temperature.

Abstract: Method and apparatus for semiconductor device fabrication using a reconstituted wafer is described. In one embodiment, diced semiconductor chips are placed within openings on a frame. A reconstituted wafer is formed by filling a mold compound into the openings. The mold compound is formed around the chips. Finished dies are formed within the reconstituted wafer. The finished dies are separated from the frame.

Abstract: A method of forming an integrated circuit device is disclosed. A polycrystalline silicon layer is formed in direct contact with a dielectric material so that the dielectric material induces a stress in the polycrystalline silicon layer as the polycrystalline silicon layer is formed. A MOS transistor that includes a gate comprising the polycrystalline silicon is then completed.

Abstract: Capacitors are formed in metallization layers of semiconductor device in regions where functional conductive features are not formed, more efficiently using real estate of integrated circuits. The capacitors may be stacked and connected in parallel to provide increased capacitance, or arranged in arrays. The plates of the capacitors are substantially the same dimensions as conductive features, such as conductive lines or vias, or are substantially the same dimensions as fill structures of the semiconductor device.

Abstract: System and method for creating stressed polycrystalline silicon in an integrated circuit. A preferred embodiment includes manufacturing an integrated circuit, including forming a trench in an integrated circuit substrate, forming a cavity within the integrated circuit substrate, wherein the cavity is linked to the trench, depositing a dielectric layer within the cavity, and depositing polycrystalline silicon over the dielectric layer, wherein an inherent stress is induced in the polycrystalline silicon that grows on the dielectric layer. The dielectric layer may be, for example, silicon aluminum oxynitride (SiAlON), mullite (3Al2O3.2SiO2), and alumina (Al2O3).

Abstract: Test structures for semiconductor devices, methods of forming test structures, semiconductor devices, methods of manufacturing thereof, and testing methods for semiconductor devices are disclosed. In one embodiment, a test structure for a semiconductor device includes at least one first contact pad disposed in a first material layer in a scribe line region of the semiconductor device. The at least one first contact pad has a first width. The test structure also includes at least one second contact pad disposed in a second material layer proximate the at least one first contact pad in the first material layer. The at least one second contact pad has a second width that is greater than the first width.

Abstract: Capacitors are formed in metallization layers of semiconductor device in regions where functional conductive features are not formed, more efficiently using real estate of integrated circuits. The capacitors may be stacked and connected in parallel to provide increased capacitance, or arranged in arrays. The plates of the capacitors are substantially the same dimensions as conductive features, such as conductive lines or vias, or are substantially the same dimensions as fill structures of the semiconductor device.

Abstract: A method, apparatus and system are provided for relieving stress in the via structures of semiconductor structures whenever a linewidth below a via is larger than a ground-rule, including providing a via at least as large as the groundrule, providing a landing pad above the via, providing a via bar in place of a via, slotting the metal linewidth below the via, or providing an oversize via with a sidewall spacer.