Patents by Inventor Matthias Markert

Matthias Markert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250151634
    Abstract: A semiconductor device includes a semiconductor substrate, a phase change switching device formed over the semiconductor substrate and including a strip of phase change material connected between an RF input contact and an RF output contact, and a heating element thermally coupled to the strip of phase change material, and a silicon adhesion layer that forms a direct interface with a first surface of the strip of phase change material and separates the first surface from a dielectric material formed thereon.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 8, 2025
    Inventors: Sven Schmidbauer, Matthias Markert, Steffen Müller
  • Publication number: 20250089584
    Abstract: A method includes providing a substrate having a main surface, forming a layer of thermally insulating material on the main surface, forming strips of phase change material on the layer of thermally insulating material such that strips of phase change material are separated from the main surface by thermally insulating material, forming first and second RF terminals on the main surface that are laterally spaced apart from one another and connected to the strips of phase change material, and forming a heater structure having heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material, wherein each of the strips of phase change material includes multiple outer faces, and wherein portions of both outer faces from the strips of phase change material are disposed against one of the heating elements.
    Type: Application
    Filed: November 20, 2024
    Publication date: March 13, 2025
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Patent number: 12156488
    Abstract: A method includes providing a substrate having a main surface, forming a layer of thermally insulating material on the main surface, forming strips of phase change material on the layer of thermally insulating material such that strips of phase change material are separated from the main surface by thermally insulating material, forming first and second RF terminals on the main surface that are laterally spaced apart from one another and connected to the strips of phase change material, and forming a heater structure having heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material, wherein each of the strips of phase change material includes multiple outer faces, and wherein portions of both outer faces from the strips of phase change material are disposed against one of the heating elements.
    Type: Grant
    Filed: December 21, 2022
    Date of Patent: November 26, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Patent number: 11963466
    Abstract: A switch device including a semiconductor substrate is provided. A trench is formed in the substrate, and a phase change material is provided at least partially in the trench. A heater for heating the phase change material is also provided.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 16, 2024
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Publication number: 20230389451
    Abstract: A method includes providing a semiconductor substrate comprising a main surface, forming a dielectric region on the main surface, forming a recess in the dielectric region, forming a strip of phase change material within the recess, forming a heating element that is thermally coupled to the strip of phase change material, forming an interconnection region over the main surface before or after forming the recess, the interconnection region including a metallization layer and a dielectric layer, electrically connecting the strip of phase change material to a connecting one of the metallization layers from the interconnection region, and completing formation of the interconnection region after electrically connecting the strip of phase change material, wherein completing formation of the interconnection region includes forming an outer one of the dielectric layers from the interconnection region that is disposed over the connecting one of the metallization layers and comprises a planar upper surface.
    Type: Application
    Filed: May 27, 2022
    Publication date: November 30, 2023
    Inventors: Dominik Heiss, Matthias Markert
  • Patent number: 11730068
    Abstract: A method of forming a phase change switching device includes providing a substrate, forming first and second RF terminals on the substrate, forming a strip of phase change material on the substrate that is connected between the first and second RF terminals, forming a heating element adjacent to the strip of phase change material such that the heating element is configured to control a conductive state of the strip of phase change material. The first and second RF terminals and the heating element are formed by a lithography process that self-aligns the heating element with the first and second RF terminals.
    Type: Grant
    Filed: June 17, 2021
    Date of Patent: August 15, 2023
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Publication number: 20230119033
    Abstract: A method includes providing a substrate having a main surface, forming a layer of thermally insulating material on the main surface, forming strips of phase change material on the layer of thermally insulating material such that strips of phase change material are separated from the main surface by thermally insulating material, forming first and second RF terminals on the main surface that are laterally spaced apart from one another and connected to the strips of phase change material, and forming a heater structure having heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material, wherein each of the strips of phase change material includes multiple outer faces, and wherein portions of both outer faces from the strips of phase change material are disposed against one of the heating elements.
    Type: Application
    Filed: December 21, 2022
    Publication date: April 20, 2023
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Patent number: 11563174
    Abstract: A switching device includes first and second RF terminals disposed over a substrate, one or more strips of phase change material connected between the first and second RF terminals, a region of thermally insulating material that separates the one or more strips of phase change material from the substrate, and a heater structure comprising one or more heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material. Each of the one or more strips of phase change material includes a first outer face and a second outer face opposite from the first outer face. For each of the one or more strips of phase change material, at least portions of both of the first and second outer faces are disposed against one of the heating elements.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 24, 2023
    Assignee: Infineon Technologies AG
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Publication number: 20220407004
    Abstract: A method of forming a phase change switching device includes providing a substrate, forming first and second RF terminals on the substrate, forming a strip of phase change material on the substrate that is connected between the first and second RF terminals, forming a heating element adjacent to the strip of phase change material such that the heating element is configured to control a conductive state of the strip of phase change material.
    Type: Application
    Filed: June 17, 2021
    Publication date: December 22, 2022
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Patent number: 11393650
    Abstract: An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: July 19, 2022
    Assignee: BROSE FAHRZEUGTEILE GMBH & CO. KOMMANDITGESELLSCHAFT, Wuerzburg
    Inventors: Matthias Markert, Markus Boehm
  • Publication number: 20220028727
    Abstract: A method of manufacturing a semiconductor device is described. The method includes forming a hard mask over a semiconductor substrate. The hard mask is patterned to generate openings in the hard mask. Deep trenches are formed in the semiconductor substrate by etching through the openings in the hard mask. The openings in the hard mask are widened. A pre-filler side wall layer is formed over the widened openings of the hard mask and the side walls of the deep trenches. The pre-filler side wall layer is recessed down to at least a first depth in the semiconductor substrate. The deep trenches are filled with a filler material. A corresponding semiconductor device is also described.
    Type: Application
    Filed: July 20, 2021
    Publication date: January 27, 2022
    Inventors: Cornelius Fuchs, Kimberly Gerber, Frank Hoffmann, Matthias Markert, Rolf Weis
  • Publication number: 20210376234
    Abstract: A switch device including a semiconductor substrate is provided. A trench is formed in the substrate, and a phase change material is provided at least partially in the trench. A heater for heating the phase change material is also provided.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Inventors: Dominik Heiss, Christoph Kadow, Matthias Markert
  • Publication number: 20210320250
    Abstract: A switching device includes first and second RF terminals disposed over a substrate, one or more strips of phase change material connected between the first and second RF terminals, a region of thermally insulating material that separates the one or more strips of phase change material from the substrate, and a heater structure comprising one or more heating elements that are configured to control a conductive connection between the first and second RF terminals by applying heat to the one or more strips of phase change material. Each of the one or more strips of phase change material includes a first outer face and a second outer face opposite from the first outer face. For each of the one or more strips of phase change material, at least portions of both of the first and second outer faces are disposed against one of the heating elements.
    Type: Application
    Filed: April 9, 2020
    Publication date: October 14, 2021
    Inventors: Dominik Heiss, Martin Bartels, Christoph Glacer, Christoph Kadow, Matthias Markert, Hans Taddiken, Hans-Dieter Wohlmuth
  • Publication number: 20200381205
    Abstract: An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.
    Type: Application
    Filed: August 18, 2020
    Publication date: December 3, 2020
    Inventors: MATTHIAS MARKERT, MARKUS BOEHM
  • Patent number: 10784067
    Abstract: An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.
    Type: Grant
    Filed: January 15, 2019
    Date of Patent: September 22, 2020
    Assignee: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Wuerzburg
    Inventors: Matthias Markert, Markus Boehm
  • Patent number: 10595423
    Abstract: An electronics housing is specified for electronics in a motor vehicle. The electronics housing has a first housing shell with a first base plate and a first side wall as well as a second housing shell with a second base plate and a second side wall. The first side wall is embodied here with double walls either completely or at least in one section, with the result that a groove-shaped wall intermediate space is formed between an outer partial wall and an inner partial wall of the first side wall. In an assembled state of the housing, the second side wall dips into this wall intermediate space.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: March 17, 2020
    Assignee: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Bamberg
    Inventors: Karl-Heinz Rosenthal, Matthias Markert
  • Publication number: 20190148099
    Abstract: An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiply bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb has an oversize relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.
    Type: Application
    Filed: January 15, 2019
    Publication date: May 16, 2019
    Inventors: MATTHIAS MARKERT, MARKUS BOEHM
  • Publication number: 20190092204
    Abstract: A method for operating an electromotive massage device of a seat, in particular of a motor vehicle, comprising a massage drive having an electric motor. The electric motor is energized, and a torque of the electric motor is detected, and a first reference value is calculated therefrom. Based on the first reference value, the occupancy of at least one section of the seat is determined. An electromotive massage device of a seat and a seat of a motor vehicle are also provided.
    Type: Application
    Filed: September 28, 2018
    Publication date: March 28, 2019
    Applicant: Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Bamberg.
    Inventors: Christian MERGL, Thomas WEINGAERTNER, Peter HORN, Alexander MUELLER, Stefan BICKEL, Matthias MARKERT, Uwe SOMMER, Sebastian DORSCH
  • Publication number: 20180213666
    Abstract: An electronics housing is specified for electronics in a motor vehicle. The electronics housing has a first housing shell with a first base plate and a first side wall as well as a second housing shell with a second base plate and a second side wall. The first side wall is embodied here with double walls either completely or at least in one section, with the result that a groove-shaped wall intermediate space is formed between an outer partial wall and an inner partial wall of the first side wall. In an assembled state of the housing, the second side wall dips into this wall intermediate space.
    Type: Application
    Filed: March 23, 2018
    Publication date: July 26, 2018
    Inventors: KARL-HEINZ ROSENTHAL, MATTHIAS MARKERT
  • Patent number: 8536746
    Abstract: An electric-motor adjustment drive is provided for an adjustment element in a motor vehicle, in particular a window lifter, that has a drive module, which includes a pole pot that supports a motor shaft, and having an electronic module having a circuit board, which can be inserted into a housing of a brush holder, which housing is connected to the drive module. The circuit board is retained in an insertion plane perpendicular to the motor shaft by the housing of the brush holder in a form- and/or force-closed manner, wherein a number of contact elements for motor contacting and/or for interference suppression are arranged in the housing, which contact elements are contacted within the housing when the circuit board is inserted.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: September 17, 2013
    Assignees: Brose Fahrzeugteile GmbH & Co., Kommanditgesellschaft
    Inventors: Thorsten Kuhnen, Karl-Heinz Rosenthal, Matthias Markert, Uwe Christian