Patents by Inventor Matthias Sabathil

Matthias Sabathil has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10903392
    Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: January 26, 2021
    Assignee: OSRAM OLED GmbH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Patent number: 10879426
    Abstract: A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: December 29, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Lutz Hoeppel, Matthias Sabathil, Norwin Von Malm
  • Patent number: 10763396
    Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: September 1, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Patent number: 10727384
    Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: July 28, 2020
    Assignee: OSRAM OLED GMBH
    Inventors: Florian Bösl, Matthias Sabathil
  • Patent number: 10411168
    Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: September 10, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Joachim Reill, Frank Singer, Norwin von Malm, Matthias Sabathil
  • Patent number: 10396260
    Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact b
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: August 27, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Matthias Sabathil, Jürgen Moosburger, Frank Singer
  • Patent number: 10355174
    Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: July 16, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Markus Maute, Lutz Höppel, Jürgen Moosburger, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov, Johannes Baur
  • Publication number: 20190189874
    Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.
    Type: Application
    Filed: December 20, 2018
    Publication date: June 20, 2019
    Inventors: Florian Bösl, Matthias Sabathil
  • Publication number: 20190189598
    Abstract: A multi-chip module is disclosed. In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.
    Type: Application
    Filed: August 1, 2017
    Publication date: June 20, 2019
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Frank Singer, Jürgen Moosburger, Thomas Schwarz, Lutz Hoeppel, Matthias Sabathil
  • Publication number: 20190157339
    Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.
    Type: Application
    Filed: May 11, 2017
    Publication date: May 23, 2019
    Inventors: Peter Brick, Matthias Sabathil, Frank Singer, Thomas Schwarz
  • Patent number: 10276752
    Abstract: An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the radiation side of the semiconductor body and at least partially covers this side, wherein the current expansion layer includes an electrically-conductive material transparent to the light radiated by the semiconductor body, and particles of a further material, and an electrical contact arranged on a side of the current expansion layer facing away from the semiconductor body.
    Type: Grant
    Filed: July 11, 2016
    Date of Patent: April 30, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Johannes Baur, Jürgen Moosburger, Lutz Höppel, Markus Maute, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov
  • Publication number: 20190123238
    Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.
    Type: Application
    Filed: April 6, 2017
    Publication date: April 25, 2019
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Publication number: 20190103516
    Abstract: A light-emitting module and a display device including the same are disclosed. In an embodiment a light-emitting module includes a plurality of emission regions configured to emit light, at least one first emission region and at least one second emission region of a first type configured to emit light of a first color locus and at least one first emission region and at least one second emission region of a second type configured to emit light of a second color locus and a control device for supplying the emission regions with current, wherein the emission regions are arranged on a common semiconductor chip, wherein the first color locus is different from the second color locus, wherein the first and second emission regions of the first type are adjacent to one another, and wherein the first and second emission regions of the second type are adjacent to one another.
    Type: Application
    Filed: March 29, 2017
    Publication date: April 4, 2019
    Inventors: Jürgen Moosburger, Matthias Sabathil, Frank Singer
  • Patent number: 10217910
    Abstract: A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: February 26, 2019
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Matthias Sabathil, Alexander Linkov, Britta Göötz, Georg Dirscherl
  • Publication number: 20190006562
    Abstract: An optoelectronic semiconductor component includes a light-emitting semiconductor body having a radiation side, a current expansion layer arranged on the radiation side of the semiconductor body and at least partially covers this side, wherein the current expansion layer includes an electrically-conductive material transparent to the light radiated by the semiconductor body, and particles of a further material, and an electrical contact arranged on a side of the current expansion layer facing away from the semiconductor body.
    Type: Application
    Filed: July 11, 2016
    Publication date: January 3, 2019
    Inventors: Johannes Baur, Jurgen Moosburger, Lutz Hoppel, Markus Maute, Thomas Schwarz, Matthias Sabathil, Ralph Wirth, Alexander Linkov
  • Patent number: 10091889
    Abstract: A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a laser process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.
    Type: Grant
    Filed: May 28, 2013
    Date of Patent: October 2, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ion Stoll, Matthias Sabathil
  • Patent number: 10091890
    Abstract: A process of producing a component includes providing a substrate having an electrically conductive surface in the form of an electrically conductive layer; subdividing the layer with the aid of a scratching process into a first electrically autonomous region and a second electrically autonomous region, wherein an electrically insulating region is formed in the electrically conductive layer to electrically separate the electrically autonomous regions; forming an electrical potential difference between the first electrically autonomous region and the second electrically autonomous region; and applying an electrically charged substance or an electrically charged substance mixture onto the first electrically autonomous region and/or the second electrically autonomous region, wherein the electrically autonomous region and/or an amount of the applied electrically charged substance or of the electrically charged substance mixture are adjusted by the electrical potential difference.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 2, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ion Stoll, Matthias Sabathil
  • Publication number: 20180261730
    Abstract: A mount (10) and an optoelectronic component (100) with the mount (10) are provided, wherein the mount (10) comprises a moulding (5), at least one through-contact (41, 42) and a plurality of reinforcing fibres (52), wherein the moulding (5) is formed from an electrically insulating moulding material (53), the through-contact (41, 42) is formed from an electrically conductive material, and the reinforcing fibres (52) produce a mechanical connection between the moulding (5) and the through-contact (41, 42) by the reinforcing fibres (52) being arranged in certain regions of the moulding (5) and arranged in certain regions of the through-contact (41, 42). A method for producing a mount or a component with such a mount is also provided.
    Type: Application
    Filed: September 8, 2016
    Publication date: September 13, 2018
    Inventors: Lutz HOEPPEL, Matthias SABATHIL, Norwin VON MALM
  • Patent number: 10074769
    Abstract: A method of producing an optoelectronic component includes providing a carrier having a carrier surface, a first lateral section of the carrier surface being raised relative to a second lateral section of the carrier surface; arranging an optoelectronic semiconductor chip having a first surface and a second surface on the carrier surface, wherein the first surface faces toward the carrier surface; and forming a molded body having an upper side facing toward the carrier surface and a lower side opposite the upper side, the semiconductor chip being at least partially embedded in the molded body.
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: September 11, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Thomas Schwarz, Hans-Jürgen Lugauer, Jürgen Moosburger, Stefan Illek, Tansen Varghese, Matthias Sabathil
  • Publication number: 20180233634
    Abstract: A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.
    Type: Application
    Filed: April 3, 2018
    Publication date: August 16, 2018
    Inventors: Matthias Sabathil, Alexander Linkov, Britta Göötz, Georg Dirscherl