Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

Abstract: A method of making a package is disclosed. The method may include forming bond pads on a first surface of a substrate, forming leads in the substrate by etching recesses in a second surface of the substrate, the second surface being opposite the first surface, and plating at least a portion of a top surface of the leads with a layer of finish plating. The method may also include thermosonically bonding the leads to a die by thermosonically bonding the finish plating to the die and encapsulating the die and the leads in an encapsulant.

Abstract: A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink.

Abstract: A method for encapsulating an electronic device is provided. The electronic device includes an integrated circuit, a lead frame for supporting the integrated circuit and having peripheral leads integrally formed therewith, and a heat sink thermally coupled to the lead frame. The heat sink includes an extension extending therefrom in a direction towards a corner of the electronic device. The method includes positioning the electronic device within a mold that includes a gate therein that is adjacent to and parallel with the extension. Molten insulative material is injected through the gate and into the mold for encapsulating the integrated circuit, and at least a portion of the lead frame and the heat sink.

Abstract: A mold for packaging an integrated semiconductor device includes two half shells closing on a perimeter dam bar of a die-stamped assembly metal frame of a semiconductor die that is between the two half shells of the mold. A depressed central pad of the metal frame defines, at least along an injection zone of the resin, a slit between the perimeter portion of the metal frame and the central pad. Resin flows through an inlet channel of the mold and through the slit to fill the upper and lower cavities. An edge of the central pad defining the slit is bent upward to form a spoiler intercepting the resin stream so that part of the resin is directed toward the lower cavity. The inner edge of the upper half shell of the mold defining the internal cavity along the injection side of the resin is inwardly offset.

Abstract: A QFP plastic surface-mounting semiconductor power device, comprising a plastic package inside which there is provided a chip which is connected by means of conductors to terminals that protrude from the plastic package, and a heat sink plate that is arranged on the bottom of the plastic package and has thinner ends, wherein the length of the heat sink plate is at least equal to the minimum length of the plastic package, channels being formed in the plastic package in a position that is adjacent to the thinner ends of the heat sink plate.

Abstract: A leadframe for electronic semiconductor devices incorporates one or two metal bars fastened to a heat dissipator by electroconductive means.Each bar has a metallized area for the electric connection, by means of a bonding wire, with a semiconductor chip placed on the dissipator.According to the present invention, the metallized areas are lowered in relation to the upper surface of the metal bar, so that lead frames can be stacked, during packing and transportation, directly on each other without danger of damaging the metallized areas.