Abstract: A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.

Abstract: A method for reducing occurrences of loose gettering material particles within micro-electromechanical system (MEMS) devices is described. The MEMS devices include a micro-machine within a substantially sealed cavity formed by a housing and a cover for the housing. The cavity containing a getter mounted on a getter substrate which is to be attached to the cover. The method includes providing an area between a portion of the cover and a portion of the getter substrate, positioning the getter within the area, and attaching the getter substrate to the cover.

Abstract: For use in a MEMS device having a suspended proof mass, a method and apparatus for securing the MEMS device during a period of high acceleration. The method may include applying a DC voltage between the proof mass and a non-suspended structure of the device. The non-suspended structure may be mounted on a substrate, and the substrate or the non-suspended structure may be electrically isolated from the proof mass by an insulating layer or by one or more islands. Applying the DC voltage creates an electrostatic force that moves the proof mass toward (or holds the proof mass near) the substrate. Movement of the proof mass may be limited by mechanical contact between the proof mass and the insulating layer, the one or more islands, or by a cage mounted on the substrate during the period of high acceleration.

Abstract: A method for providing micro-electromechanical systems (MEMS) devices with multiple motor frequencies and uniform motor-sense frequency separation is described. The devices each include at least one proof mass, each proof mass being connected to a substrate by a system of suspensions. The method includes controlling the resonant frequencies of the MEMS device by adjusting at least two of a mass of the proof masses, a bending stiffness of the proof masses, a length of the suspensions, and a width of the suspensions.

Abstract: A micro-electromechanical systems (MEMS) device is described which includes a substrate having at least one anchor, a proof mass having either of at least one deceleration extension extending from the proof mass or at least one deceleration indentation formed in the proof mass, a motor drive comb, and a motor sense comb. The MEMS device further includes a plurality of suspensions configured to suspend the proof mass over the substrate and between the motor drive comb and the motor sense comb, and the suspensions are anchored to the substrate. The MEMS device also includes a body attached to the substrate and at least one deceleration beam extending from the body. The deceleration extensions are configured to engage either deceleration beams or deceleration indentations and slow or stop the proof mass before it contacts either of the motor drive comb or the motor sense comb.

Abstract: For use in a MEMS device having a suspended proof mass, a method and apparatus for securing the MEMS device during a period of high acceleration. The method may include applying a DC voltage between the proof mass and a non-suspended structure of the device. The non-suspended structure may be mounted on a substrate, and the substrate or the non-suspended structure may be electrically isolated from the proof mass by an insulating layer or by one or more islands. Applying the DC voltage creates an electrostatic force that moves the proof mass toward (or holds the proof mass near) the substrate. Movement of the proof mass may be limited by mechanical contact between the proof mass and the insulating layer, the one or more islands, or by a cage mounted on the substrate during the period of high acceleration.

Abstract: Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Abstract: Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Abstract: Layers of boron-doped silicon having reduced out-of-plane curvature are disclosed. The layers have substantially equal concentrations of boron near the top and bottom surfaces. Since the opposing concentrations are substantially equal, the compressive stresses on the layers are substantially balanced, thereby resulting in layers with reduced out-of-plane curvature.

Abstract: The apparatus of the invention includes a sensor header and a sensor cover which are coupled to a prior art diaphragm assembly. The sensor header is provided with two piezoresistive silicon membrane strain gauges. One side of both strain gauges is exposed to fluid at upstream high pressure. The other side of the first strain gauge is exposed to fluid at downstream low pressure and the other side of the second strain gauge is exposed to the atmosphere. The sensor header is provided with a first port which is fluidly coupled to the first membrane strain gauge and extends to the surface of the header at a first location. The sensor header is provided with a second port which is fluidly coupled to the second membrane strain gauge and extends to the surface of the header at a second location. The sensor cover defines two isolated annular spaces around the sensor header, a first annular space around the first location and a second annular space around the second location.

Abstract: A form pressure sensor diaphragm and method of making that allows for formation of long rectangular plate structures in semiconducting materials, especially silicon. A plurality or multiplicity of sensors may be constructed on a single chip, thus providing for absolute and relative sensing of pressure on a single device.

Abstract: A form of pressure sensor diaphragm and method of making that allows for the formation of long rectangular plate structures in semiconducting material, especially Silicon. A plurality or multiplicity of sensors may be constructed on a single chip, thus providing for absolute and relative sensing of pressure on a single device.

Abstract: A sensor comprising a die having a sensing portion. The sensor further comprises apparatus for enhancing the sensitivity of the sensing portion, the apparatus for enhancing comprising a mass rigidly attached to a portion of the die. The sensor also comprises two mechanical stops. One stop includes a portion of the die, and the other stop is rigidly spaced away from the die. Movement of the mass is limited by the two stops.

Abstract: An accelerometer switch which has cantilever beams carrying integral end masses formed in a silicon die which is sandwiched between a contact plate and a support plate. Each beam provides switching at a different threshold acceleration level. The fixed contact face of the contact plate is configured with a relief space to permit accelerometer switch operation even though the input acceleration is off-normal and there is twisting of the accelerometer beam.

Abstract: Disclosed is a pressure transducer comprising a pressure sensitive silicon die having a front side exposing piezoresistive means and comprising means for flip-chip mounting the die to a pressure vessel. The transducer further comprises a pressure vessel having an aperture, the pressure vessel comprising means for flip-chip mounting the die over the aperture. The die is flip-chip mounted over the aperture in the pressure vessel, and there is a hermetic seal between the pressure vessel and the die.

Abstract: Disclosed is a pressure transducer comprising a pressure sensitive silicon die having a front side exposing piezoresistive means and a back side for receiving pressure from a pressure medium. The transducer further comprises a pressure vessel having an aperture and apparatus including a hermetic seal for mounting the die with the front side of the die facing the aperture. In this manner, the die is compressed toward the pressure vessel when positive pressure is applied to the back side of the die by the pressure medium.