Patents by Inventor Max L. LIFSON
Max L. LIFSON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220314183Abstract: In an aspect, a method for making a metal-containing material comprises steps of: forming a metal-containing hydrogel from an aqueous precursor mixture using a photopolymerization; wherein the aqueous precursor mixture comprises water, one or more aqueous photosensitive binders, and one or more aqueous metal salts; and thermally treating the metal-containing hydrogel to form the metal-containing material; wherein the metal-containing hydrogel is exposed to a thermal-treatment atmosphere during the step of thermally treating; wherein a composition of the metal-containing material is at least partially determined by a composition of the thermal-treatment atmosphere during the thermally treating step.Type: ApplicationFiled: March 31, 2022Publication date: October 6, 2022Applicant: California Institute of TechnologyInventors: Daryl Wei Liang YEE, Julia R. GREER, Max L. LIFSON, Michael A. CITRIN
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Patent number: 11318435Abstract: In an aspect, a method for making a metal-containing material comprises steps of: forming a metal-containing hydrogel from an aqueous precursor mixture using a photopolymerization; wherein the aqueous precursor mixture comprises water, one or more aqueous photosensitive binders, and one or more aqueous metal salts; and thermally treating the metal-containing hydrogel to form the metal-containing material; wherein the metal-containing hydrogel is exposed to a thermal-treatment atmosphere during the step of thermally treating; wherein a composition of the metal-containing material is at least partially determined by a composition of the thermal-treatment atmosphere during the thermally treating step.Type: GrantFiled: September 20, 2019Date of Patent: May 3, 2022Assignee: California Institute of TechnologyInventors: Daryl Wei Liang Yee, Julia R. Greer, Max L. Lifson, Michael A. Citrin
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Patent number: 11152495Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: September 30, 2019Date of Patent: October 19, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Patent number: 11081572Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: August 7, 2019Date of Patent: August 3, 2021Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Publication number: 20200156035Abstract: In an aspect, a method for making a metal-containing material comprises steps of: forming a metal-containing hydrogel from an aqueous precursor mixture using a photopolymerization; wherein the aqueous precursor mixture comprises water, one or more aqueous photosensitive binders, and one or more aqueous metal salts; and thermally treating the metal-containing hydrogel to form the metal-containing material; wherein the metal-containing hydrogel is exposed to a thermal-treatment atmosphere during the step of thermally treating; wherein a composition of the metal-containing material is at least partially determined by a composition of the thermal-treatment atmosphere during the thermally treating step.Type: ApplicationFiled: September 20, 2019Publication date: May 21, 2020Inventors: Daryl Wei Liang YEE, Julia R. GREER, Max L. LIFSON, Michael A. CITRIN
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Patent number: 10629710Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: July 10, 2018Date of Patent: April 21, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Patent number: 10600893Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: June 15, 2018Date of Patent: March 24, 2020Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Publication number: 20200027973Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer.Type: ApplicationFiled: September 30, 2019Publication date: January 23, 2020Inventors: Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Publication number: 20190363182Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: ApplicationFiled: August 7, 2019Publication date: November 28, 2019Inventors: Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Patent number: 10224225Abstract: An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: GrantFiled: April 19, 2018Date of Patent: March 5, 2019Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20180331207Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer.Type: ApplicationFiled: July 10, 2018Publication date: November 15, 2018Inventors: Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Patent number: 10109553Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: March 28, 2017Date of Patent: October 23, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Publication number: 20180294346Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: ApplicationFiled: June 15, 2018Publication date: October 11, 2018Inventors: Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Patent number: 10068827Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: January 9, 2017Date of Patent: September 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Publication number: 20180240694Abstract: An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: ApplicationFiled: April 19, 2018Publication date: August 23, 2018Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Patent number: 9997385Abstract: An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chamber, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: GrantFiled: April 18, 2017Date of Patent: June 12, 2018Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20170221742Abstract: An apparatus and an associated method. The apparatus includes a chuck in a process chamber, an array of three or more ultrasonic sensors in the process chary a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.Type: ApplicationFiled: April 18, 2017Publication date: August 3, 2017Inventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan
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Publication number: 20170200665Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer.Type: ApplicationFiled: March 28, 2017Publication date: July 13, 2017Inventors: Alan B. BOTULA, Max L. LIFSON, James A. SLINKMAN, Theodore G. VAN KESSEL, Randy L. WOLF
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Patent number: 9704978Abstract: An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.Type: GrantFiled: March 18, 2016Date of Patent: July 11, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Alan B. Botula, Max L. Lifson, James A. Slinkman, Theodore G. Van Kessel, Randy L. Wolf
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Patent number: 9685362Abstract: An apparatus and method for centering substrates determining on a chuck. The apparatus includes a chuck in a process chamber, the chuck configured to removeably hold a substrate for processing; an array of two or more ultrasonic sensors arranged in the process chamber, each ultrasonic sensor arranged relative to the chuck so as to send a respective ultrasonic sound wave to a respective preselected region of the substrate and receive a respective return ultrasonic sound wave from the preselected region of the substrate; and a controller connected to each ultrasonic sensor and configured to compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave from each ultrasonic sensor.Type: GrantFiled: February 19, 2014Date of Patent: June 20, 2017Assignee: International Business Machines CorporationInventors: Shawn A. Adderly, Samantha D. DiStefano, Jeffrey P. Gambino, Max G. Levy, Max L. Lifson, Matthew D. Moon, Timothy D. Sullivan