Patents by Inventor Mayu YAMAMURA

Mayu YAMAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11964359
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: April 23, 2024
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashwin Chockalingham, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
  • Publication number: 20240123568
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and methods of manufacturing the same. According to one or more embodiments, a method for forming or otherwise preparing a polishing article by sequentially forming a plurality of polymer layers is provided and includes: (a) dispensing a plurality of droplets of a polymer precursor composition onto a surface of a previously formed at least partially cured polymer layer, where the polymer precursor composition contains a first precursor component containing an epoxide group and a photoinitiator component which generates a photoacid when exposed to UV light, (b) at least partially curing the plurality of droplets to form an at least partially cured polymer layer, and (c) repeating (a) and (b).
    Type: Application
    Filed: June 21, 2023
    Publication date: April 18, 2024
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20240025009
    Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
    Type: Application
    Filed: October 5, 2023
    Publication date: January 25, 2024
    Inventors: Aniruddh Jagdish KHANNA, Jason G. FUNG, Puneet Narendra JAWALI, Rajeev BAJAJ, Adam Wade MANZONIE, Nandan BARADANAHALLI KENCHAPPA, Veera Raghava Reddy KAKIREDDY, Joonho AN, Jaeseok KIM, Mayu YAMAMURA
  • Patent number: 11813712
    Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: November 14, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Aniruddh Jagdish Khanna, Jason G. Fung, Puneet Narendra Jawali, Rajeev Bajaj, Adam Wade Manzonie, Nandan Baradanahalli Kenchappa, Veera Raghava Reddy Kakireddy, Joonho An, Jaeseok Kim, Mayu Yamamura
  • Publication number: 20230330805
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Application
    Filed: April 24, 2023
    Publication date: October 19, 2023
    Applicant: Applied Materials, Inc.
    Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
  • Patent number: 11772229
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: March 11, 2019
    Date of Patent: October 3, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Publication number: 20230294239
    Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.
    Type: Application
    Filed: May 25, 2023
    Publication date: September 21, 2023
    Inventors: Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
  • Patent number: 11745302
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: September 5, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 11724362
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: August 15, 2023
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Jagdish Khanna, Jason G. Fung, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Gregory E. Menk, Nag B. Patibandla
  • Patent number: 11685014
    Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: June 27, 2023
    Assignee: Applied Materials, Inc.
    Inventors: Sivapackia Ganapathiappan, Ankit Vora, Boyi Fu, Venkat Hariharan, Mayu Yamamura, Mario Cornejo, Igor Abramson, Mo Yang, Daniel Redfield, Rajeev Bajaj, Nag B. Patibandla
  • Publication number: 20220402091
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material, and structural properties, and new methods of manufacturing the same. In one or more embodiments, polishing pads with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Some embodiments may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, advanced polishing pads may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, where each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: June 7, 2022
    Publication date: December 22, 2022
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20220362904
    Abstract: Embodiments herein generally relate to polishing pads and methods of forming polishing pads. A method of forming a polishing pad includes (a) dispensing droplets of a pre-polymer composition and droplets of a sacrificial material composition onto a surface of a previously formed print layer according to a predetermined droplet dispense pattern. The method includes (b) at least partially curing the dispensed droplets of the pre-polymer composition to form a print layer. The method includes (c) sequentially repeating (a) and (b) to form a polishing layer having a plurality of pore-features formed therein. The pre-polymer composition includes a multifunctional acrylate component.
    Type: Application
    Filed: May 17, 2021
    Publication date: November 17, 2022
    Inventors: Sivapackia GANAPATHIAPPAN, Uma SRIDHAR, Yingdong LUO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Sebastian David ROZO, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA, Hou T. NG, Sudhakar MADHUSOODHANAN
  • Publication number: 20210347005
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material and methods of forming thereof. In one embodiment, a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition, and the dispensed window precursor composition disposed within the first layer.
    Type: Application
    Filed: July 21, 2021
    Publication date: November 11, 2021
    Inventors: Boyi FU, Sivapackia GANAPATHIAPPAN, Daniel REDFIELD, Rajeev BAJAJ, Ashwin CHOCKALINGAM, Dominic J. BENVEGNU, Mario Dagio CORNEJO, Mayu YAMAMURA, Nag B. PATIBANDLA, Ankit VORA
  • Patent number: 11072050
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: July 27, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Boyi Fu, Sivapackia Ganapathiappan, Daniel Redfield, Rajeev Bajaj, Ashwin Chockalingam, Dominic J. Benvegnu, Mario Dagio Cornejo, Mayu Yamamura, Nag B. Patibandla, Ankit Vora
  • Publication number: 20210205951
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: March 22, 2021
    Publication date: July 8, 2021
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20210187693
    Abstract: Polishing pads having discrete and selectively arranged regions of varying porosity within a continuous phase of polymer material are provided herein. In one embodiment a polishing pad features a plurality of polishing elements each comprising a polishing surface and sidewalls extending downwardly from the polishing surface to define a plurality of channels disposed between the polishing elements, wherein one or more of the polishing elements is formed of a continuous phase of polymer material having one or more first regions comprising a first porosity and a second region comprising a second porosity, wherein the second porosity is less than the first porosity.
    Type: Application
    Filed: September 29, 2020
    Publication date: June 24, 2021
    Inventors: Aniruddh Jagdish KHANNA, Jason G. FUNG, Puneet Narendra JAWALI, Rajeev BAJAJ, Adam Wade MANZONIE, Nandan BARADANAHALLI KENCHAPPA, Veera Raghava Reddy KAKIREDDY, Joonho AN, Jaeseok KIM, Mayu YAMAMURA
  • Publication number: 20210107116
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: December 8, 2020
    Publication date: April 15, 2021
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh Jagdish KHANNA, Jason G. FUNG, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Gregory E. MENK, Nag B. PATIBANDLA
  • Patent number: 10953515
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: March 23, 2021
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10875145
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: December 29, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
  • Patent number: 10821573
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: November 3, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha