Patents by Inventor Mayu YAMAMURA

Mayu YAMAMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10773509
    Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: September 15, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Hou T. Ng, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Ashwin Chockalingam, Mayu Yamamura, Mario Cornejo
  • Patent number: 10618141
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: April 14, 2020
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Ashwin Chockalingam, Mahendra C. Orilall, Mayu Yamamura, Boyi Fu, Rajeev Bajaj, Daniel Redfield
  • Publication number: 20200070302
    Abstract: Methods and formulations for manufacturing polishing articles used in polishing processes are provided. In one implementation, a UV curable resin precursor composition is provided. The UV curable resin precursor comprises a precursor formulation. The precursor formulation comprises a first resin precursor component that comprises a semi-crystalline radiation curable oligomeric material, wherein the semi-crystalline radiation curable oligomeric material is selected from a semi-crystalline aliphatic polyester urethane acrylate, a semi-crystalline aliphatic polycarbonate urethane acrylate, a semi-crystalline aliphatic polyether urethane acrylate, or combinations thereof. The precursor formulation further comprises a second resin precursor component that comprises a monofunctional or multifunctional acrylate monomer.
    Type: Application
    Filed: August 2, 2019
    Publication date: March 5, 2020
    Inventors: Sivapackia GANAPATHIAPPAN, Ankit VORA, Boyi FU, Venkat HARIHARAN, Mayu YAMAMURA, Mario CORNEJO, Igor ABRAMSON, Mo YANG, Daniel REDFIELD, Rajeev BAJAJ, Nag B. PATIBANDLA
  • Publication number: 20200055161
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Application
    Filed: October 23, 2019
    Publication date: February 20, 2020
    Inventors: Ashwin CHOCKALINGHAM, Mahendra C. ORILALL, Mayu YAMAMURA, Boyi FU, Rajeev BAJAJ, Daniel REDFIELD
  • Patent number: 10456886
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: October 29, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Nag B. Patibandla, Rajeev Bajaj, Daniel Redfield, Fred C. Redeker, Mahendra C. Orilall, Boyi Fu, Mayu Yamamura, Ashwin Chockalingam
  • Patent number: 10399201
    Abstract: Embodiments herein relate to advanced polishing pads with tunable chemical, material and structural properties, and manufacturing methods related thereto. According to one or more embodiments herein, a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments herein thus may provide an advanced polishing pad having discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one polymer precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: September 3, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10391605
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: August 27, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Sivapackia Ganapathiappan, Boyi Fu, Ashwin Chockalingam, Daniel Redfield, Rajeev Bajaj, Mahendra C. Orilall, Hou T. Ng, Jason G. Fung, Mayu Yamamura
  • Patent number: 10384330
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: August 20, 2019
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
  • Publication number: 20190224809
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Application
    Filed: April 2, 2019
    Publication date: July 25, 2019
    Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
  • Publication number: 20190202024
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: March 11, 2019
    Publication date: July 4, 2019
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20190047112
    Abstract: Embodiments of the present disclosure provide for polishing pads that include at least one endpoint detection (EPD) window disposed through the polishing pad material, and methods of forming thereof. In one embodiment a method of forming a polishing pad includes forming a first layer of the polishing pad by dispensing a first precursor composition and a window precursor composition, the first layer comprising at least portions of each of a first polishing pad element and a window feature, and partially curing the dispensed first precursor composition and the dispensed window precursor composition disposed within the first layer.
    Type: Application
    Filed: July 31, 2018
    Publication date: February 14, 2019
    Inventors: Boyi FU, Sivapackia GANAPATHIAPPAN, Daniel REDFIELD, Rajeev BAJAJ, Ashwin CHOCKALINGAM, Dominic J. BENVEGNU, Mario Dagio CORNEJO, Mayu YAMAMURA, Nag B. PATIBANDLA, Ankit VORA
  • Publication number: 20170259499
    Abstract: A method and apparatus for manufacturing polishing articles used in polishing processes are provided. In one implementation, a method of forming a polishing pad is provided. The method comprises depositing an uncured first layer of a pad forming photopolymer on a substrate. The method further comprises positioning a first optical mask over the first layer of the uncured pad forming photopolymer. The first optical mask includes a patterned sheet of material having at least one aperture. The method further comprises exposing the uncured first layer of the pad forming photopolymer to electromagnetic radiation to selectively polymerize exposed portions of the uncured first layer of the pad forming photopolymer to form pad-supporting structures within the first layer of pad forming photopolymer.
    Type: Application
    Filed: March 7, 2017
    Publication date: September 14, 2017
    Inventors: Hou T. NG, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Mario CORNEJO
  • Publication number: 20170203406
    Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
    Type: Application
    Filed: December 29, 2016
    Publication date: July 20, 2017
    Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA
  • Publication number: 20170203408
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: October 6, 2016
    Publication date: July 20, 2017
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20170136603
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: November 16, 2016
    Publication date: May 18, 2017
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20170120416
    Abstract: Implementations described herein generally relate to polishing articles and methods of manufacturing polishing articles used in polishing processes and cleaning processes. More particularly, implementations disclosed herein relate to composite polishing articles having graded properties. In one implementation, a polishing article is provided. The polishing article comprises one or more exposed first regions formed from a first material and having a first zeta potential and one or more second exposed regions formed from a second material and having a second zeta potential, wherein the first zeta potential is different from the second zeta potential.
    Type: Application
    Filed: October 20, 2016
    Publication date: May 4, 2017
    Inventors: Ashwin CHOCKALINGAM, Mahendra C. ORILALL, Mayu YAMAMURA, Boyi FU, Rajeev BAJAJ, Daniel REDFIELD
  • Publication number: 20170100817
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, addition polymer precursor compounds, catalysts, and curing agents.
    Type: Application
    Filed: October 17, 2016
    Publication date: April 13, 2017
    Inventors: Sivapackia GANAPATHIAPPAN, Boyi FU, Ashwin CHOCKALINGAM, Daniel REDFIELD, Rajeev BAJAJ, Mahendra C. ORILALL, Hou T. NG, Jason G. FUNG, Mayu YAMAMURA
  • Publication number: 20160114458
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 28, 2016
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava REDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
  • Publication number: 20160107287
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: October 19, 2015
    Publication date: April 21, 2016
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA
  • Publication number: 20160107295
    Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
    Type: Application
    Filed: October 16, 2015
    Publication date: April 21, 2016
    Inventors: Rajeev BAJAJ, Daniel REDFIELD, Mahendra C. ORILALL, Boyi FU, Aniruddh KHANNA, Jason G. FUNG, Mario CORNEJO, Ashwin CHOCKALINGAM, Mayu YAMAMURA, Veera Raghava Reddy KAKIREDDY, Ashavani KUMAR, Venkatachalam HARIHARAN, Gregory E. MENK, Fred C. REDEKER, Nag B. PATIBANDLA, Hou T. NG, Robert E. DAVENPORT, Amritanshu SINHA