Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

Abstract: This disclosure generally relates to devices and methods involving optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a multi-channel optoelectronic subassembly including a multi-channel header subassembly with a plurality of optoelectronic transducers on a substrate, a housing defining a housing cavity and including an optically transmissive portion, a ferrule assembly retaining optical fibers and an alignment sleeve with a sleeve cavity sized and shaped to receive the ferrule assembly. At least one of the optoelectronic transducers may be configured to transmit and/or receive optical signals corresponding to one channel.

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to ferrule assemblies and/or ferrule alignment assemblies. In some aspects, the disclosed devices and methods may relate to a ferrule assembly including: optical fibers, an upper clamp member and a lower clamp member configured to retain the optical fibers that are positioned between the upper and lower clamp members, and a ferrule body surrounding at least a portion of the upper and lower clamp members; and an alignment sleeve including a sleeve cavity configured to receive the ferrule body such that the ferrule assembly is capable of being longitudinally repositioned with respect to the alignment sleeve.

Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.

Abstract: In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors.

Abstract: An example embodiment includes a TO can including a header, an RF pin opening, an internal volume, an RF pin, a submount, and a flex circuit. The header defines the RF pin opening. The internal volume is defined by a TO can housing and an interior header surface. The RF pin extends through the RF pin opening such that a first surface connection is located in the internal volume and a second surface connection is located outside of the internal volume and extends past an exterior header surface. The submount is located in the internal volume and the submount includes a submount trace. The submount trace includes a pin connection portion in-line with the RF pin and electrically coupled to the first surface connection. The flex circuit includes a flex trace further including a flex trace connection in-line with the RF pin and electrically coupled to the second surface connection.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: In one example embodiment, an electronic module comprises a plurality of components and flex circuit connectors each electrically connected to respective components of the electronic module. The electronic module may be an optical subassembly of an optical transceiver. Moreover, one of the flex circuit connectors may be physically connected to another of the flex circuit connectors.

Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.

Abstract: In one example, a header assembly for use in a communication device has a base that includes a plurality of single ports through which a corresponding plurality of leads extends. The leads are retained in their respective single ports by a retainer material. Additionally, the base includes one or more plural ports through which two or more leads extend.

Abstract: A low-cost, high-speed micro-connector replacement for current electrical inter-connects and intra-connects on printed circuit boards is provided. The invention achieves its goal by including an optical transmitter module or optical receiver module mounted in close proximity to a modulator used to encode optical signals from electrical impulses or decode optical signals to electrical impulses. The micro-connector is mounted on a PCB in alignment with the transmitting or receiving modules and provides appropriate alignment and stop positioning of an optical fiber used for optical transmitting between transmitting/receiving modules.

Abstract: A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.

Abstract: A height reduced rotary voice coil actuator assembly includes an E-block defining one or more vertically aligned short tines. Fastened to each short tine are one or two elongated tine extenders. The tine extender-short tine connection occurs outside the region above and below the data storage disks. A peg-leg load beam having tabs adapted to receive wires having no protective plastic tubing is connected to each tine extender. The wires are bonded directly to the tabs and provide electrical communication between data transducer heads located on the load beam and drive electronics. A swage boss formed in the tine extender faces outwardly in the same direction as a data transducer head assembly supported by the peg-leg load beam. Each short tine is substantially coplanar with an associated data storage disk and lies beyond the outer periphery thereof. The resulting in-line rotary actuator achieves substantial vertical or Z height compaction.

Abstract: A height reduced rotary voice coil actuator assembly includes an E-block defining one or more vertically aligned short tines. Fastened to each short tine are one or two elongated tine extenders. The tine extender-short tine connection occurs outside the region above and below the data storage disks. A peg-leg load beam having tabs adapted to receive wires having no protective plastic tubing is connected to each tine extender. The wires are bonded directly to the tabs and provide electrical communication between data transducer heads located on the load beam and drive electronics. A swage boss formed in the tine extender faces outwardly in the same direction as a data transducer head assembly supported by the peg-leg load beam. Each short tine is substantially coplanar with an associated data storage disk and lies beyond the outer periphery thereof. The resulting in-line rotary actuator achieves substantial vertical or Z height compaction.

Abstract: A height reduced rotary voice coil actuator assembly includes an E-block defining one or more vertically aligned short tines. Fastened to each short tine are one or two elongated tine extenders. The tine extender-short tine connection occurs outside the region above and below the data storage disks. A peg-leg load beam having tabs adapted to receive wires having no protective plastic tubing is connected to each tine extender. The wires are bonded directly to the tabs and provide electrical communication between data transducer heads located on the load beam and drive electronics. A swage boss formed in the tine extender faces outwardly in the same direction as a data transducer head assembly supported by the peg-leg load beam. Each short tine is substantially coplanar with an associated data storage disk and lies beyond the outer periphery thereof. The resulting in-line rotary actuator achieves substantial vertical or Z height compaction.

Abstract: A hard disk drive includes a spindle motor flex circuit having a connection end secured to a drive base at a location established by a reference feature and an actuator flex circuit having a connection end also secured to the base at the location established by the feature; a cover and cover gasket mounted to the base plate enclose and seal a rotating data storage disk, a disk spindle motor, a magnet structure, a rotary actuator assembly and the flex circuits except for the spindle motor connection end and the actuator connection end; and, a printed circuit board carrying drive electronics has a connector array of pressure pins aligned to contact facing connecting pads of the flex circuits, the connector array having an alignment pin for registering with the reference feature of the base plate as the printed circuit board is mounted to the base plate externally of the cover, thereby establishing electrical connections between the printed circuit board and the flex circuit connection pads.

Abstract: The present invention relates, in one aspect, to an apparatus for positioning a disk drive head over a disk which is a part of a disk drive assembly. A disk drive apparatus includes a base plate, a disk coupled to the base plate, a disk drive head assembly arranged over the disk, and an actuator assembly that is arranged to position the disk drive head assembly over the disk. The actuator assembly is coupled to the disk drive head assembly, and includes a ferrite piece and a crash stop contact point that is separate from the ferrite piece. The disk drive apparatus also includes a magnetic latching assembly which has a plate extension that is substantially stationary with respect to the disk, a magnet nest that is movably mounted over the plate extension, and a latch magnet that is coupled to the magnet nest. A crash stop, which is also included in the disk drive apparatus, is arranged to be contacted by the crash stop contact point when the disk drive head assembly is positioned in a parking position.