Patents by Inventor Mehmet Ozgur
Mehmet Ozgur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
Patent number: 7024936Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.Type: GrantFiled: June 17, 2003Date of Patent: April 11, 2006Assignee: Corporation for National Research InitiativesInventors: Michael Pedersen, Mehmet Ozgur, Michael A. Huff -
Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
Patent number: 7017419Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.Type: GrantFiled: August 31, 2004Date of Patent: March 28, 2006Assignee: Corporation for National Research InitiativesInventors: Michael Pedersen, Mehmet Ozgur, Michael A. Huff -
Patent number: 7012327Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: GrantFiled: April 30, 2004Date of Patent: March 14, 2006Assignee: Corporation for National Research InitiativesInventors: Michael A. Huff, Mehmet Ozgur
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Patent number: 6969630Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.Type: GrantFiled: September 17, 2003Date of Patent: November 29, 2005Assignee: Corporation for National Research InitiativesInventor: Mehmet Ozgur
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Publication number: 20050167047Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: ApplicationFiled: September 17, 2003Publication date: August 4, 2005Applicant: Corporation for National Research InitiativesInventors: Michael Huff, Mehmet Ozgur
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Publication number: 20050161753Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: ApplicationFiled: February 8, 2005Publication date: July 28, 2005Applicant: Corporation for National Research InitiativesInventors: Michael Huff, Mehmet Ozgur
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Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
Publication number: 20050103112Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.Type: ApplicationFiled: December 13, 2004Publication date: May 19, 2005Applicant: Corporation for National Research InitiativesInventors: Michael Pedersen, Mehmet Ozgur, Michael Huff -
Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
Publication number: 20050028601Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.Type: ApplicationFiled: August 31, 2004Publication date: February 10, 2005Applicant: Corporation for National Research InitiativesInventors: Michael Pedersen, Mehmet Ozgur, Michael Huff -
Publication number: 20040262645Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: ApplicationFiled: April 30, 2004Publication date: December 30, 2004Applicant: Corporation for National Research InitiativesInventors: Michael A. Huff, Mehmet Ozgur
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Patent number: 6815739Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: GrantFiled: May 20, 2002Date of Patent: November 9, 2004Assignee: Corporation for National Research InitiativesInventors: Michael A. Huff, Mehmet Ozgur
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Patent number: 6800912Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.Type: GrantFiled: May 17, 2002Date of Patent: October 5, 2004Assignee: Corporation for National Research InitiativesInventor: Mehmet Ozgur
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Publication number: 20040097066Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.Type: ApplicationFiled: September 17, 2003Publication date: May 20, 2004Applicant: Corporation for National Research InitiativesInventor: Mehmet Ozgur
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Micro-mechanical capacitive inductive sensor for wireless detection of relative or absolute pressure
Publication number: 20040057589Abstract: A micro-mechanical pressure transducer is disclosed in which a capacitive transducer structure is integrated with an inductor coil to form a LC tank circuit, resonance frequency of which may be detected remotely by imposing an electromagnetic field on the transducer. The capacitive transducer structure comprises a conductive movable diaphragm, a fixed counter electrode, and a predetermined air gap between said diaphragm and electrode. The diaphragm deflects in response to an applied pressure differential, leading to a change of capacitance in the structure and hence a shift of resonance frequency of the LC tank circuit. The resonance frequency of the LC circuit can be remotely detected by measuring and determining the corresponding peak in electromagnetic impedance of the transducer.Type: ApplicationFiled: June 17, 2003Publication date: March 25, 2004Applicant: Corporation for National Research InitiativesInventors: Michael Pedersen, Mehmet Ozgur, Michael A. Huff -
Patent number: 6709739Abstract: A plurality of closed metal cells is provided. Each cell encapulates a fluid or a fluid-like filler with a metal skin or cell wall. The closed cells are joined into an aggregate arrangement to form a composite material in which the bonded cell walls form a continuous metal matrix. The cell walls and the encapulated cell filler fluid or fluid-like filler provide controllable stiffness and strength as well as vibration-damping and shock-absorbing characteristics to the material. The resulting closed cell metal composite finds many advantages uses including use as a prosthetic device, a casting, or an automotive component. The component material is elastically compliant or stiff, depending on the design, as well as lightweight and resistant to buckling and crushing. The material provides desirable physical properties such as heat-capacity, thermal and electrical conductivity, vibration-damping capacity, and shock-absorbing characteristics.Type: GrantFiled: June 24, 2002Date of Patent: March 23, 2004Assignee: Case Western Reserve UniversityInventors: Robert L. Mullen, Mehmet Ozgur, Gerhard E. Welsch
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Publication number: 20030104649Abstract: A method is provided for fabricating a CMOS based micro-electromechanical system (MEMS) integrated circuit. A CMOS circuit layout is fabricated on a silicon substrate. A first thick film photo resist layer is then deposited on the CMOS circuit layout. To prevent oxidation from occurring between aluminum and gold, a seed layer is applied to the first thick film photo resist layer. A mold is then formed by selectively depositing a second thick film photo resist layer on portions of the seed layer so that a conductive layer can be applied to the mold. Portions of the seed layer are then removed and a stress compensation material is applied to the conductive layer. A back side surface of the silicon substrate is then etched to remove areas not covered by a mask, and the first thick film photo resist layer is removed via openings in the CMOS circuit layout.Type: ApplicationFiled: August 15, 2002Publication date: June 5, 2003Inventors: Mehmet Ozgur, Mona Elwakkad Zaghloul
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Publication number: 20030020173Abstract: A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”) technology and a method of fabricating such phased-array antenna system and other types of radio frequency (RF) devices are disclosed. Each antenna or other type of device includes at least two multilayer ceramic modules and a MEMS device fabricated on one of the modules. Once fabrication of the MEMS device is completed, the two ceramic modules are bonded together, hermetically sealing the MEMS device, as well as allowing electrical connections between all device layers. The bottom ceramic module has also cavities at the backside for mounting integrated circuits. The internal layers are formed using conducting, resistive and high-k dielectric pastes available in standard LTCC fabrication and low-loss dielectric LTCC tape materials.Type: ApplicationFiled: May 20, 2002Publication date: January 30, 2003Inventors: Michael A. Huff, Mehmet Ozgur
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Publication number: 20020171121Abstract: A monolithically integrated, electromechanical microwave switch, capable of handling signals from DC to millimeter-wave frequencies, and an integrated electromechanical tunable capacitor are described. Both electromechanical devices include movable beams actuated either by thermo-mechanical or by electrostatic forces. The devices are fabricated directly on finished silicon-based integrated circuit wafers, such as CMOS, BiCMOS or bipolar wafers. The movable beams are formed by selectively removing the supporting silicon underneath the thin films available in a silicon-based integrated circuit technology, which incorporates at least one polysilicon layer and two metallization layers. A cavity and a thick, low-loss metallization are used to form an electrode above the movable beam. A thick mechanical support layer is formed on regions where the cavity is located, or substrate is bulk-micro-machined, i.e., etched.Type: ApplicationFiled: May 17, 2002Publication date: November 21, 2002Inventor: Mehmet Ozgur
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Patent number: 5890268Abstract: A plurality of closed structural metal cells are joined into an aggregate arrangement to form a composite material. Each cell encapsulates a fluid or fluid-like filler therein to provide controllable strength and shock-absorbing characteristics to the material. The resulting closed cell metal composite finds many advantageous uses including use as a prosthetic device, a casting, or an automotive component. The component material is elastically compliant or stiff, depending on the design, as well as lightweight and crush resistant. The material provides desirable physical properties such as thermal and electrical conductivity and shock-absorbing characteristics.Type: GrantFiled: September 6, 1996Date of Patent: April 6, 1999Assignee: Case Western Reserve UniversityInventors: Robert L. Mullen, Mehmet Ozgur, Gerhard E. Welsch