Abstract: Aspects for device and package separation of a multi-layer integrated circuit device attached at a frontside to an integrated circuit package are described. In an exemplary method aspect, the method includes cutting through coupling material between the multilayer integrated circuit and the integrated circuit package with a high precision saw blade. The method further includes cutting with a high precision saw blade of approximately 50 microns thickness. Additionally, the multi-layer integrated circuit device is utilized for device analysis from a frontside following separation from the integrated circuit package by the step of cutting.

Abstract: A system and method for detecting a type of a short of a plurality of types of shorts in a circuit in a semiconductor device is disclosed. The circuit includes a plurality of power supply lines and a plurality of ground lines. The short is between at least one of the plurality of power supply lines and at least one of the plurality of ground lines. In one aspect, the method and system include providing a library including a plurality of sets of current-voltage characteristics. Each of the plurality of sets of current-voltage characteristics is for a particular type of short of the plurality of types of shorts. In this aspect, the method and system further include measuring a particular set of current-voltage characteristics of the semiconductor device and comparing the particular set of current-voltage characteristics to the plurality of sets of current-voltage characteristics in the library.

Abstract: Aspects for supporting a package and a device coupled to the package at a device frontside during package removal are described. In an exemplary aspect, a support structure includes a support frame supporting the package substantially near end portions of the package, and multi-layer support material provided within the support frame, wherein breakage of the package during grinding of the package at its backside is reduced. The multi-layer support material further includes a hard wax layer substantially covering the device, an epoxy glue layer substantially covering the hard wax layer, and a soft wax layer substantially covering the epoxy glue layer and substantially filling remaining space within the support frame.

Abstract: A system and method for detecting a fault in a circuit of a semiconductor package is disclosed. The semiconductor package includes a die having an active area and a substrate. The circuit is located on the active area of the die. The method and system include applying a liquid having a relatively low smoke point and which moves readily with respect to the semiconductor die to a surface of the semiconductor die. The liquid forms a thin layer on the exposed surface of the semiconductor die. The method and system further include applying power to the circuit and determining where a portion of the liquid has moved away from an exposed portion of the surface of the die.

Abstract: Aspects for removing device packaging from an FBGA (fine pitch ball grid array) package are described. In an exemplary method aspect, the method includes recessing a predetermined area of the FBGA package, and exposing an integrated circuit die covered by the FBGA package. Device analysis is then performed on the exposed die. The step of recessing further includes milling the predetermined area, while the step of exposing includes chemically etching the FBGA package.

Abstract: Aspects for supporting a package and a device coupled to the package at a device frontside during package removal at a package backside are described. In an exemplary aspect, a support structure includes a support frame supporting the package substantially near end portions of the package, and a set of support braces supporting the package substantially near the device. The structure further includes a block support positioned within the set of support braces and substantially underneath the device at a predetermined distance from the device. Support material is provided between the support frame and the set of support braces and between the block support and the device, wherein breakage of the package during grinding removal of the package is reduced.

Abstract: A method and apparatus for holding, grinding and polishing a die include a platform (10), a boss (20) on the platform, and a shielding structure (30) attached to at least one of the platform (10) and the boss (20). The boss (20) is configured for supporting a packaged (42) die (41) to be ground and polished and has a supporting topography to accommodate at least one package and lead configuration. The shielding structure (30) is configured to protect such a packaged (42) die (41) from physical and electrical damage when supported on the boss (20).