Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.

Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.

Abstract: A circuit board utilizing thermocouples for improved heat dissipation performance from circuit boards includes a heat dissipation module which itself includes a first circuit substrate, a thermocouple, and a second circuit substrate. The first circuit substrate includes a first wiring layer comprising first and second wiring portions. The thermocouple includes a P-type and an N-type semiconductor. The second circuit substrate includes a second wiring layer with a third wiring portion. Conductive members electrically connect the P-type semiconductor with the first wiring portion, connect the P-type semiconductor with the third wiring portion, connect the N-type semiconductor with the second wiring portion, and connect the N-type semiconductor with the third wiring portion, to transfer away heat generated by working elements mounted on the board.

Abstract: A polypeptide or protein directional modification method based on sulfhydryl-alkenyl azide coupling is provided. The method uses a sulfhydryl group-containing compound and a compound containing alkenyl azide group as reactants to generate an amino acid containing ?-carbonyl sulfide, a polypeptide containing ?-carbonyl sulfide and a protein bioconjugate containing ?-carbonyl sulfide, thereby achieving a chemical modification. The method is mild in conditions and wide in solvent selectivity, a reaction temperature is in a range of 37 degrees Celsius (° C.) to 40° C., and a reaction time is in a range of 10 minutes to 48 hours. The method is promising in preparing functional polypeptides or functional proteins, protein labeling, and biological medicine.

Abstract: A dental implant surgical guide and manufacturing method thereof are provided. The dental implant surgical guide comprises a retainer, a guide portion, and an indicator. Said guide portion is located on either the tongue side or the palatal side of a patient, and comprises a guiding groove corresponding to an implant hole and an opening being connected to the guiding groove; said indicator comprises an extension portion and a terminal, wherein the extension portion is extended from the retainer to an implant platform of a missing tooth portion, while the terminal indicates a location of the implant platform. Therefore, locations of the implant platform and the implant hole of the missing tooth portion will be positioned by the dental implant surgical guide when placing the dental implant surgical guide on the missing tooth portion.

Abstract: A camera module having OIS function and its preparation method are provided. The camera module includes a housing and an optical assembly in the housing, and further includes a circuit board in the housing. The circuit board includes a first board and a second board on the first board. The first board is flexible. The first board includes a first portion, a second portion, and a third portion successively connected in an extending direction of the first board. The second portion defines a slot. The second board is on the third portion. The optical assembly is on the second board. The first portion includes a fixed end connecting the second portion and an opposite free end. The housing defines a through hole. The first portion extends through the slot to form a bent portion and extends out of the through hole, such that the free end is outside the housing.

Abstract: In alternative embodiments, provided are compositions, including products of manufacture and kits, and methods, for treating a heart failure in a subject in need thereof comprising administering to the subject an isolated or recombinant nucleic acid, an isolated or recombinant or chimeric polypeptide, or an engineered cell, as provided herein, thereby treating the subject. In alternative embodiments, the administration reduces left ventricular (LV) hypertrophy, increases LV peak pressure development, reduced cAMP production and/or improves LV peak pressure decay in a pressure-overload in the subject. In alternative embodiments, provided are compositions and methods for: treating, ameliorating, or slowing the progress of, or protecting (preventing) an individual or a patient against heart failure; or, reducing LV hypertrophy, increasing LV peak pressure development, and/or improving LV peak pressure decay in a pressure-overload in an individual in need thereof.

Abstract: The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips.

Abstract: A multi-piece pre-assembled raft foundation is provided and includes pre-assemble bottom layer rebars of foundation slab, foundation steel columns, upper layer rebars of the foundation slab, and foundation rebars. The pre-assembled raft foundation is transported to a construction site for final assembly. A construction method of the multi-piece pre-assembled raft foundation is also provided.

Abstract: A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Abstract: A battery assembly includes a circuit board and a battery cell. The circuit board includes a first dielectric layer, a second dielectric layer, an adhesive film, a bus bar, a first copper block, a fuse, and a second copper block. The adhesive film is located between the first dielectric layer and the second dielectric layer and includes cavities. The first copper block and the bus bar are on the first dielectric layer. The second copper block and the fuse are on the second dielectric layer. The circuit board is divided into heat dissipation areas and bending areas which are connected and alternately arranged, the heat dissipation areas and the bending areas enclose a holding groove. The bus bar and the first block copper are accommodated in the holding groove. The battery cell is accommodated in the holding groove. A battery module and a manufacturing method are also disclosed.

Abstract: Disclosed are an anode material for lithium secondary batteries, the anode material including an Si-based anode active material and a film layer formed as a double self-assembled monolayer as the result of an amino trimethoxy silane (ATS) SAM precursor and a fluoro ethylene carbonate (FEC) SAM precursor being sequentially bonded to the surface of the Si-based anode active material, and method of manufacturing the same.

Abstract: A dynamic speech recognition method includes performing a first stage: detecting sound data by using a digital microphone and storing the sound data in a first memory, generating a human voice detection signal in response to detecting a human voice from the sound data, and determining to selectively perform a second stage or a third stage according to a total effective data volume, a transmission bit rate of the digital microphone and a recognition interval time. In the second stage, the first processing circuit outputs a first command to a second processing circuit, and the second processing circuit instructs a memory access circuit to operate. In the third stage, the first processing circuit outputs a second command to the second processing circuit, and the second processing circuit instructs the memory access circuit to operate, and the second processing circuit determines whether the speech data matches a predetermined speech command.

Abstract: A method for manufacturing a circuit board is disclosed. An inner wiring base board with a first opening is provided. A base board is fixed in the first opening, and a first wiring base board and a second wiring base board are pressed on opposite surfaces of the inner wiring base board. The base board is made of ceramic and has a high light reflectivity of 92% to 97%. A first conductor layer and a second conductor layer are formed on opposite surfaces of the laminated structure. The first conductor layer includes a plurality of connecting pads on the base board. A solder mask is formed on an outer side of the first conductor layer, the solder mask has a high light reflectivity of 92% to 95%, and the base board is exposed outside the solder mask.

Abstract: Disclosed are an anode material for lithium secondary batteries, the anode material including an Si-based anode active material and a film layer formed as a double self-assembled monolayer as the result of an amino trimethoxy silane (ATS) SAM precursor and a fluoro ethylene carbonate (FEC) SAM precursor being sequentially bonded to the surface of the Si-based anode active material, and method of manufacturing the same.

Abstract: The anode material for a lithium secondary battery includes: an Si-based anode active material; and a film layer including a self-assembly monolayer (SAM) formed through bonding of SAM precursors onto a surface of the Si-based anode active material.

Abstract: A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.

Abstract: A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).

Abstract: A circuit board (100) includes an insulating base layer (11), a first conductive circuit layer (40) disposed on the base layer (11); a solder mask layer (60) covering the first conductive circuit layer (40) away from the base layer (11), wherein the solder mask layer (60) defines a slot (601), the slot (601) exposes a portion of the first conductive circuit layer (40), the solder mask layer (60) includes a sidewall (602) at the slot (601); and a cover film (70) covering the solder mask layer (60), wherein the cover film (70) defines an opening (701), the opening (701) corresponds to the slot (601) and exposes the solder pad (7401), the cover film (70) includes a covering portion (74) and a side reflecting portion (75), the covering portion (74) is disposed on the solder mask layer (60), the side reflecting portion (75) is connected to the covering portion (74) and covers the sidewall (602).

Abstract: A circuit board with high light reflectivity includes an inner wiring base board, a base board with a high light reflectivity, a first insulation layer, a first conductor layer, and a second insulation layer. A first opening in the inner wiring base board receives the base board. The first insulation layer is stacked on a surface of the inner wiring base board and defines a second opening corresponding in position to the first opening and exposing a portion of the base board. The first conductor layer is on a surface of the first insulation layer away from the inner wiring base board and includes connecting pads on the base board. The second insulation layer and the second conductor are stacked in that order on another surface of the inner wiring base board. A method for manufacturing the circuit board is also disclosed.